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公开(公告)号：US20240213685A1
公开(公告)日：2024-06-27
申请号：US18473854
申请日：2023-09-25
发明人： Bong Hyuk PARK , Sunwoo KONG , SEUNG HUN WANG , Hui Dong LEE , Seunghyun JANG , Seok Bong HYUN
CPC分类号： H01Q13/08 , H01Q1/2283
摘要： An antenna system and an apparatus including the same are provided. The antenna system includes at least one antenna module, wherein the antenna module may include a plurality of antennas formed on one surface of a first board, and a beamforming chip formed on one surface of a second board, wherein the plurality of antennas is connected to the beamforming chip through a plurality of microstrip lines and a waveguide.
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公开(公告)号：US20240222862A1
公开(公告)日：2024-07-04
申请号：US18501418
申请日：2023-11-03
发明人： Sunwoo KONG , Bong Hyuk PARK , SEUNG HUN WANG , HUI DONG LEE , Seunghyun JANG , SEOK BONG HYUN
CPC分类号： H01Q3/36 , H01Q1/48 , H01Q9/0407
摘要： A beamforming apparatus and a beamforming method using an expandable planar array antenna are provided. The beamforming apparatus that performs the beamforming method includes an array antenna in which an Elevation (EL) antenna group configured to perform beam steering in an elevation angle direction and an Azimuth (AZ) antenna group configured to perform beam steering in an azimuth angle direction are disposed on a same plane, a first chip located on a top surface of the array antenna and configured to control the beam steering in the elevation angle direction by controlling patch antennas included in the EL antenna group, and a second chip located on a bottom surface of the array antenna and configured to control the beam steering in the azimuth angle direction by controlling patch antennas included in the AZ antenna group.
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公开(公告)号：US20240194618A1
公开(公告)日：2024-06-13
申请号：US18349024
申请日：2023-07-07
发明人： HUI DONG LEE , Sunwoo KONG , Bong Hyuk PARK , SEUNG HUN WANG , Seunghyun JANG , SEOK BONG HYUN
IPC分类号： H01L23/66 , H01L23/00 , H01L23/495 , H01L23/64
CPC分类号： H01L23/66 , H01L23/4952 , H01L23/642 , H01L23/647 , H01L24/48 , H01L2223/6627 , H01L2224/48195
摘要： A semiconductor package is provided. The semiconductor package includes a semiconductor chip including an integrated circuit (IC) pad configured to output a wireless frequency signal, a lead frame including a package pad configured to receive the wireless frequency signal, a first wire of which one end is connected to the IC pad, a second wire of which one end is connected to the package pad, and a circuit element connected to the first wire and the second wire in parallel or in series. A radio frequency (RF) output impedance of the package pad or an RF output impedance of the IC pad is controlled by a type of the circuit element or a connection relationship between the circuit element, the first wire, and the second wire.
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