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公开(公告)号：US20240213685A1
公开(公告)日：2024-06-27
申请号：US18473854
申请日：2023-09-25
Inventor： Bong Hyuk PARK , Sunwoo KONG , SEUNG HUN WANG , Hui Dong LEE , Seunghyun JANG , Seok Bong HYUN
CPC classification number: H01Q13/08 , H01Q1/2283
Abstract: An antenna system and an apparatus including the same are provided. The antenna system includes at least one antenna module, wherein the antenna module may include a plurality of antennas formed on one surface of a first board, and a beamforming chip formed on one surface of a second board, wherein the plurality of antennas is connected to the beamforming chip through a plurality of microstrip lines and a waveguide.
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公开(公告)号：US20230198144A1
公开(公告)日：2023-06-22
申请号：US17871608
申请日：2022-07-22
Inventor： Bong Hyuk PARK , Sunwoo KONG , Hui Dong LEE , Seunghyun JANG , Seok Bong HYUN
CPC classification number: H01Q3/28 , H01Q21/062 , H01Q9/16
Abstract: Provided is a terahertz wideband antenna and a method for designing the same. According to various embodiments, the wideband antenna used for mobile communication in the terahertz wave communication band may include an antenna board including a first surface and a second surface opposite to the first surface, and a plurality of dipole antennas arranged on the antenna board, each of the plurality of dipole antennas may include a feeder disposed on the first surface and a radiator disposed on the second surface and physically spaced apart from the feeder, the feeder may be wire-bonded to a corresponding channel of a plurality of channels of a beam former, and the radiator may be coupled to the feeder to receive a signal from the feeder.
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公开(公告)号：US20210242948A1
公开(公告)日：2021-08-05
申请号：US17160631
申请日：2021-01-28
Inventor： Sunwoo KONG , Kwang Seon KIM , Jeehoon PARK , HUI DONG LEE , Seunghyun JANG , SEOK BONG HYUN
Abstract: An array antenna system, and a calibration method and apparatus thereof are provided. The calibration method includes measuring a signal loop including mutual coupling between antennas included in an array antenna, calculating a ratio of a reception (RX) signal received by each antenna to an RX signal received by a reference antenna of the array antenna based on a result of the measuring, and performing calibration of the array antenna based on the ratio.
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公开(公告)号：US20170302234A1
公开(公告)日：2017-10-19
申请号：US15487905
申请日：2017-04-14
Inventor： Sunwoo KONG , Bong Hyuk PARK , Moon-Sik LEE , Hui Dong LEE
CPC classification number: H03F1/56 , H03F1/347 , H03F1/565 , H03F3/193 , H03F3/195 , H03F3/265 , H03F3/45179 , H03F2200/318 , H03F2200/391 , H03F2200/399 , H03F2200/411 , H03F2200/451 , H03F2200/534 , H03F2200/537
Abstract: A high frequency amplifier circuit includes a transistor including a drain, a gate, and a source, an inductance-capacitor (LC) tank connected to the drain, and a transformer connected to the gate and the source.
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公开(公告)号：US20230163733A1
公开(公告)日：2023-05-25
申请号：US17939648
申请日：2022-09-07
Inventor： Sunwoo KONG , Bong Hyuk Park , Hui Dong Lee , Seunghyun Jang , Seok Bong Hyun
IPC: H03F3/193
CPC classification number: H03F3/193 , H03F2200/451 , H03F2200/09 , H03F2200/21
Abstract: Disclosed is an ultra-high frequency amplifier which includes a first conductor connected to an amplifier input terminal to receive an RF signal applied to the amplifier input terminal, a second conductor parallel to a first portion of the first conductor, a third conductor separated from the second conductor and parallel to a second portion of the first conductor, and a transistor including a gate terminal connected to one end of the second conductor, a first terminal connected to one end of the third conductor, and a second terminal connected to an amplifier output terminal, wherein the first conductor and the second conductor form a first balun to output a first balance signal based on the RF signal, the first conductor and the third conductor form a second balun to output a second balance signal based on the RF signal.
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Patent Agency Ranking
公开(公告)号：US20220337192A1
公开(公告)日：2022-10-20
申请号：US17665405
申请日：2022-02-04
Inventor： Sunwoo KONG , Bong Hyuk PARK , HUI DONG LEE , Seunghyun JANG , SEOK BONG HYUN
Abstract: A method and apparatus for input matching of a passive mixer are disclosed. The passive mixer includes a differential transistor pair including a first transistor and a second transistor, a first inductor having one end connected to the first transistor and another end connected to a ground, a second inductor having one end connected to the second transistor and another end connected to a ground, and a third inductor having one end for receiving a radio frequency (RF) signal and another end connected to a ground.
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公开(公告)号：US20240222862A1
公开(公告)日：2024-07-04
申请号：US18501418
申请日：2023-11-03
Inventor： Sunwoo KONG , Bong Hyuk PARK , SEUNG HUN WANG , HUI DONG LEE , Seunghyun JANG , SEOK BONG HYUN
CPC classification number: H01Q3/36 , H01Q1/48 , H01Q9/0407
Abstract: A beamforming apparatus and a beamforming method using an expandable planar array antenna are provided. The beamforming apparatus that performs the beamforming method includes an array antenna in which an Elevation (EL) antenna group configured to perform beam steering in an elevation angle direction and an Azimuth (AZ) antenna group configured to perform beam steering in an azimuth angle direction are disposed on a same plane, a first chip located on a top surface of the array antenna and configured to control the beam steering in the elevation angle direction by controlling patch antennas included in the EL antenna group, and a second chip located on a bottom surface of the array antenna and configured to control the beam steering in the azimuth angle direction by controlling patch antennas included in the AZ antenna group.
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公开(公告)号：US20240194618A1
公开(公告)日：2024-06-13
申请号：US18349024
申请日：2023-07-07
Inventor： HUI DONG LEE , Sunwoo KONG , Bong Hyuk PARK , SEUNG HUN WANG , Seunghyun JANG , SEOK BONG HYUN
IPC: H01L23/66 , H01L23/00 , H01L23/495 , H01L23/64
CPC classification number: H01L23/66 , H01L23/4952 , H01L23/642 , H01L23/647 , H01L24/48 , H01L2223/6627 , H01L2224/48195
Abstract: A semiconductor package is provided. The semiconductor package includes a semiconductor chip including an integrated circuit (IC) pad configured to output a wireless frequency signal, a lead frame including a package pad configured to receive the wireless frequency signal, a first wire of which one end is connected to the IC pad, a second wire of which one end is connected to the package pad, and a circuit element connected to the first wire and the second wire in parallel or in series. A radio frequency (RF) output impedance of the package pad or an RF output impedance of the IC pad is controlled by a type of the circuit element or a connection relationship between the circuit element, the first wire, and the second wire.
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9.发明公开公开(公告)号：US20230198485A1
公开(公告)日：2023-06-22
申请号：US17964157
申请日：2022-10-12
Inventor： Sunwoo KONG , Bong Hyuk PARK , Hui Dong LEE , Seunghyun JANG , Seok Bong HYUN
Abstract: Disclosed is a bidirectional amplifier. The bidirectional amplifier includes a first matching circuit, a second matching circuit, an amplifier circuit connected between the first matching circuit and the second matching circuit, that amplifies a first input signal received from the first matching circuit to output the amplified first input signal to the second matching circuit, and that amplifies a second input signal received from the second matching circuit to output the amplified first input signal to the first matching circuit, and the first and second matching circuits have a symmetrical structure and operate complementary to each other.
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公开(公告)号：US20220373403A1
公开(公告)日：2022-11-24
申请号：US17743072
申请日：2022-05-12
Inventor： Seunghyun JANG , Sunwoo KONG , Bong Hyuk PARK , Hui Dong LEE , Seok Bong HYUN
Abstract: Provided are a semiconductor-based temperature sensor and a method of operating the semiconductor-based temperature sensor. A temperature sensor includes an electrical temperature signal generator configured to generate a first electrical temperature signal that changes according to temperature and a second electrical temperature signal that changes according to temperature at a different rate from that of the first electrical temperature signal, a differential signal generator configured to generate a differential electrical temperature signal between the first electrical temperature signal and the second electrical temperature signal, and an analog digital converter (ADC) configured to convert the differential electrical temperature signal into digital temperature information.
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