公开(公告)号：US20230114941A1

公开(公告)日：2023-04-13

申请号：US17950809

申请日：2022-09-22

Applicant: ENTEGRIS, INC.

Inventor： Doruk Yener ,  Joseph Rivers ,  Elango Balu ,  Fadi Abdallah Coder

IPC: B24B53/017

Abstract: A CMP pad conditioner assembly includes a backing plate including a first face including a plurality of first mounting locations and a second face including a plurality of second mounting locations. A plurality of segments is secured to the first face. The segments include a substrate having a first surface and a second surface opposite the first surface. A plurality of protrusions is integral with the substrate protruding away from the first surface. The protrusions are coated with a conformal diamond layer. A plurality of second segments is secured to the second face, the second segments including a substrate having a first surface and a second surface opposite the first surface. Each of the second segments includes a plurality of protrusions integral with the substrate protruding away from the first surface. The protrusions are coated with a conformal diamond layer.