公开(公告)号：US20230114941A1

公开(公告)日：2023-04-13

申请号：US17950809

申请日：2022-09-22

Applicant: ENTEGRIS, INC.

Inventor： Doruk Yener ,  Joseph Rivers ,  Elango Balu ,  Fadi Abdallah Coder

IPC: B24B53/017

Abstract: A CMP pad conditioner assembly includes a backing plate including a first face including a plurality of first mounting locations and a second face including a plurality of second mounting locations. A plurality of segments is secured to the first face. The segments include a substrate having a first surface and a second surface opposite the first surface. A plurality of protrusions is integral with the substrate protruding away from the first surface. The protrusions are coated with a conformal diamond layer. A plurality of second segments is secured to the second face, the second segments including a substrate having a first surface and a second surface opposite the first surface. Each of the second segments includes a plurality of protrusions integral with the substrate protruding away from the first surface. The protrusions are coated with a conformal diamond layer.

公开(公告)号：US20250144746A1

公开(公告)日：2025-05-08

申请号：US18900625

申请日：2024-09-27

Applicant: ENTEGRIS, INC.

Inventor： Doruk Yener ,  Jakub Rybczynski ,  Isaac J. Parker ,  Nilesh Gunda ,  Christopher J. Yannetta ,  Supil Raina ,  Chandrasekaran Venkatraman

IPC: B23K26/40 ,  B23K101/36

Abstract: Electrostatic chucks and methods for forming electrostatic chucks are provided. A method comprises obtaining a substrate comprising an etch resistant coating layer; ablating, with a laser, the etch resistant coating layer so as to remove at least a portion of the etch resistant coating layer so as to provide one or more exposed portions of the substrate; and forming an electrostatic chuck, wherein, when measuring an electrical resistance across the one or more exposed portions of the substrate between two metallized portions, the electrostatic chuck exhibits an electrical isolation of 300 GΩ or more. An electrostatic chuck comprises a substrate having at least one etch resistant coating layer comprising a laser ablated pattern, wherein the laser ablated pattern comprises one or more exposed portions of the substrate spanning distances of at least 0.5 mm.