公开(公告)号：US20170311455A1

公开(公告)日：2017-10-26

申请号：US15315359

申请日：2015-08-12

Applicant: EPCOS AG

Inventor： Sebastian Brunner ,  Gerhard Fuchs ,  Annette Fischer

IPC: H05K3/42 ,  H05K1/03 ,  H05K1/09 ,  H05K1/11

CPC classification number: H05K3/429 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/115 ,  H05K3/248 ,  H05K3/4061 ,  H05K3/4605 ,  H05K2201/0195

Abstract: A method for producing a multilayer substrate (1) is specified, wherein a main body (26) comprising a plurality of ceramic layers (2) is provided, wherein at least one layer (2) comprises a hole (27). In order to form a plated-through hole (4, 18, 20, 21), the hole (27) is filled with a metal by depositing the metal from a solution. Furthermore, a multilayer substrate is specified wherein a plated-through hole (4, 18, 20, 21) in the interior of the main body (26) is connected to a further contact (11), wherein the plated-through hole (4, 18, 20, 21) comprises a different material than the further contact (11) and/or is produced by a different method.macros hash =multilayer substrate star =plated-throuch hole pie =connection contact alpha =photoresist mask beta =further contact gamma =HTCC technology delta =main body matt =ceramic layer