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1.发明申请MEMS BACKPLATE, MEMS MICROPHONE COMPRISING A MEMS BACKPLATE AND METHOD FOR MANUFACTURING A MEMS MICROPHONE 有权MEMS背板，包含MEMS背板的MEMS麦克风和制造MEMS麦克风的方法公开(公告)号：US20140346621A1
公开(公告)日：2014-11-27
申请号：US13261882
申请日：2011-11-14
Applicant: EPCOS AG
Inventor： Leif Steen Johansen , Jan Tue Ravnkilde , Pirmin Hermann Otto Rombach , Kurt Rasmussen , Dennis Mortensen
CPC classification number: B81B3/0086 , B81C1/00158 , B81C1/00698 , H04R19/005 , H04R31/006 , H04R2201/003 , Y10T428/24273
Abstract: A MEMS backplate enables MEMS microphones with reduced parasitic capacitance. A MEMS backplate includes a central area and a perforation in the central area. A suspension area surrounds the central area at least partially. An aperture is disposed in the suspension area.
Abstract translation: MEMS背板使MEMS麦克风具有减小的寄生电容。 MEMS背板包括在中心区域的中心区域和穿孔。 悬挂区域至少部分地围绕中心区域。 在悬挂区域设置有孔。
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公开(公告)号：US20140346620A1
公开(公告)日：2014-11-27
申请号：US13261875
申请日：2011-11-14
Applicant: EPCOS AG
CPC classification number: B81B3/0086 , B81C1/00158 , B81C1/00698 , H04R1/222 , H04R19/005 , H04R19/04 , H04R31/00 , H04R31/006 , H04R2201/003
Abstract: A MEMS microphone has reduced parasitic capacitance. The microphone includes a trench electrically separating an acoustically active section of the backplate from an acoustically inactive section of the backplate.
Abstract translation: MEMS麦克风降低了寄生电容。 麦克风包括将背板的声学活动部分与背板的声学不起作用的部分电隔离的沟槽。
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公开(公告)号：US20150076627A1
公开(公告)日：2015-03-19
申请号：US13261881
申请日：2011-11-14
Applicant: EPCOS AG
CPC classification number: H04R19/04 , B81B7/0025 , B81B2201/0257 , B81C2201/053 , H04R19/005 , H04R31/003 , H04R2201/003 , H04R2410/03
Abstract: A MEMS microphone with reduced parasitic capacitance is provided. A microphone includes a protection film covering a rim-sided area of the backplate.
Abstract translation: 提供具有降低的寄生电容的MEMS麦克风。 麦克风包括覆盖背板的边缘区域的保护膜。
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