公开(公告)号：US20170078802A1

公开(公告)日：2017-03-16

申请号：US15121831

申请日：2014-03-03

Applicant: Epcos AG

Inventor： Jan Tue Ravnkilde ,  Dennis Mortensen ,  Morten Ginnerup

IPC: H04R19/04 ,  H04R7/16 ,  B81B3/00 ,  H04R9/08

CPC classification number: H04R19/04 ,  B06B1/0292 ,  B81B3/0072 ,  B81B2201/0257 ,  B81B2203/0127 ,  H04R7/16 ,  H04R19/005 ,  H04R2201/003

Abstract: A non-uniform stress distribution of a MEMS microphone having a non-circular shape is compensated by a structured back plate that has a compensating structure to provide a stress distribution opposite to that of the membrane.

Abstract translation: 具有非圆形形状的MEMS麦克风的不均匀应力分布由具有补偿结构的结构化背板补偿，以提供与膜的应力分布相反的应力分布。

公开(公告)号：US10419858B2

公开(公告)日：2019-09-17

申请号：US15121831

申请日：2014-03-03

Applicant: Epcos AG

Inventor： Jan Tue Ravnkilde ,  Dennis Mortensen ,  Morten Ginnerup

IPC: H04R19/04 ,  B06B1/02 ,  B81B3/00 ,  H04R7/16 ,  H04R19/00

Abstract: A non-uniform stress distribution of a MEMS microphone having a non-circular shape is compensated by a structured back plate that has a compensating structure to provide a stress distribution opposite to that of the membrane.

公开(公告)号：US20140346621A1

公开(公告)日：2014-11-27

申请号：US13261882

申请日：2011-11-14

Applicant: EPCOS AG

Inventor： Leif Steen Johansen ,  Jan Tue Ravnkilde ,  Pirmin Hermann Otto Rombach ,  Kurt Rasmussen ,  Dennis Mortensen

IPC: B81B3/00 ,  B81C1/00 ,  H04R31/00

CPC classification number: B81B3/0086 ,  B81C1/00158 ,  B81C1/00698 ,  H04R19/005 ,  H04R31/006 ,  H04R2201/003 ,  Y10T428/24273

Abstract: A MEMS backplate enables MEMS microphones with reduced parasitic capacitance. A MEMS backplate includes a central area and a perforation in the central area. A suspension area surrounds the central area at least partially. An aperture is disposed in the suspension area.

Abstract translation: MEMS背板使MEMS麦克风具有减小的寄生电容。 MEMS背板包括在中心区域的中心区域和穿孔。 悬挂区域至少部分地围绕中心区域。 在悬挂区域设置有孔。