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公开(公告)号：US11378588B2
公开(公告)日：2022-07-05
申请号：US17090779
申请日：2020-11-05
申请人： ESSAI, INC.
发明人： Nasser Barabi , Oksana Kryachek , Joven R. Tienzo , Chee Wah Ho
IPC分类号： G01R1/04
摘要： A test probe contactor includes an angled depressible probe configuration that causes the tips of the compressible probes to “swipe” the contact pads/solder balls of an IC device under test as the contacts are made. The angulation of the depressible probes permit penetration through foreign material layers on the pad/ball surfaces with less contact force. The contactor includes an upper block and a main block for housing the plurality of probes. The main block and the upper block include corresponding pluralities of slanted probe cavities. The upper bore axis of one or more of the upper probe cavities is laterally shifted relative to the main bore axis of a corresponding probe cavity of the main block, resulting in a lateral offset between the upper bore axis and the main bore axis.
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2.发明申请SYSTEMS AND METHODS FOR CONFORMING TEST TOOLING TO INTEGRATED CIRCUIT DEVICE PROFILES WITH COAXIAL SOCKET 审中-公开用于将测试工具配合到具有同轴插座的集成电路设备配置文件的系统和方法公开(公告)号：US20150022226A1
公开(公告)日：2015-01-22
申请号：US14340554
申请日：2014-07-24
申请人： ESSAI, INC.
CPC分类号： G01R1/0458
摘要： A coaxial socket useful in association with an integrated circuit (IC) device tester and having a conducting pin surrounded by an insulating layer and embedded in a conducting base. This coaxial pin configuration allows for good thermal conductivity and better electrical signal transmission specially for testing high-speed integrated circuits.
摘要翻译： 一种与集成电路（IC）器件测试器相关联并具有由绝缘层包围并嵌入导电基底的导电引脚的同轴插座。 该同轴引脚配置允许良好的导热性和更好的电信号传输专门用于测试高速集成电路。
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3.发明申请SYSTEMS AND METHODS FOR CONFORMING TEST TOOLING TO INTEGRATED CIRCUIT DEVICE PROFILES WITH CONVEX SUPPORT STRUCTURE 有权用于将测试工具与集成电路设备配置为CONVEX支持结构的系统和方法公开(公告)号：US20140232426A1
公开(公告)日：2014-08-21
申请号：US14181612
申请日：2014-02-14
申请人： ESSAI, INC.
IPC分类号： G01R31/28
CPC分类号： G01R31/2891 , G01R31/2865 , G01R31/2874
摘要： A convex testing stack useful in association with a thermal control unit (TCU) that may be used to maintain a set point temperature for testing of a convex IC device under test (DUT) is configured to preserve the convex shape of the DUT.
摘要翻译： 与用于保持测试中的凸型IC器件（DUT）的设定点温度相关联的热控制单元（TCU）有用的凸测试堆被配置为保留DUT的凸形。
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公开(公告)号：US20220413010A1
公开(公告)日：2022-12-29
申请号：US17832557
申请日：2022-06-03
申请人： ESSAI, INC.
发明人： Nasser Barabi , Oksana Kryachek , Joven R. Tienzo , Chee Wah Ho
IPC分类号： G01R1/04
摘要： A test probe contactor includes an angled depressible probe configuration that causes the tips of the compressible probes to “swipe” the contact pads/solder balls of an IC device under test as the contacts are made. The angulation of the depressible probes permit penetration through foreign material layers on the pad/ball surfaces with less contact force. The contactor includes an upper block and a main block for housing the plurality of probes. The main block and the upper block include corresponding pluralities of slanted probe cavities. The upper bore axis of one or more of the upper probe cavities is laterally shifted relative to the main bore axis of a corresponding probe cavity of the main block, resulting in a lateral offset between the upper bore axis and the main bore axis.
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5.发明授权Systems and methods for conforming test tooling to integrated circuit device profiles with convex support structure 有权用于将测试工具与具有凸起支撑结构的集成电路器件配置一致的系统和方法公开(公告)号：US09557373B2
公开(公告)日：2017-01-31
申请号：US14181612
申请日：2014-02-14
申请人： ESSAI, INC.
IPC分类号： G01R31/28
CPC分类号： G01R31/2891 , G01R31/2865 , G01R31/2874
摘要： A convex testing stack useful in association with a thermal control unit (TCU) that may be used to maintain a set point temperature for testing of a convex IC device under test (DUT) is configured to preserve the convex shape of the DUT.
摘要翻译： 与用于保持测试中的凸型IC器件（DUT）的设定点温度相关联的热控制单元（TCU）有用的凸测试堆被配置为保留DUT的凸形。
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6.发明申请Systems and Methods for Conforming Device Testers to Integrated Circuit Device With Pressure Relief Valve 有权将装置测试仪与泄压阀结合在一起的集成电路装置的系统和方法公开(公告)号：US20150109009A1
公开(公告)日：2015-04-23
申请号：US14525223
申请日：2014-10-28
申请人： ESSAI, INC.
IPC分类号： G01R31/28
CPC分类号： G01R31/2874 , G01R1/0458 , G01R31/2875 , G01R31/2891
摘要： The present invention relates to systems and methods for preventing over pressurization in a fluid management system used in an integrated circuit (IC) device tester. The prevention of the over pressurization in the fluid management system is based on the use of a pressure relief valve coupled to the fluid management system.
摘要翻译： 本发明涉及在集成电路（IC）器件测试仪中使用的流体管理系统中防止过度加压的系统和方法。 在流体管理系统中防止过度加压基于使用与流体管理系统相连的压力释放阀。
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7.发明申请SYSTEMS AND METHODS FOR CONFORMING TEST TOOLING TO INTEGRATED CIRCUIT DEVICE PROFILES WITH SOCKETS HAVING SECURED AND REPLACEABLE BUSHINGS 有权用于将测试工具配合到集成电路设备配置文件的系统和方法与具有安全和可更换总线的插座公开(公告)号：US20140021972A1
公开(公告)日：2014-01-23
申请号：US13941404
申请日：2013-07-12
申请人： Essai, Inc.
IPC分类号： G01R31/28
CPC分类号： G01R31/2874 , G01R1/0458 , G01R1/0466
摘要： A test socket assembly, useful in association with a thermal control unit (TCU) used to maintain a set point temperature on an IC device under test, has alignment holes with bushings that are secured within the alignment holes by using retaining pins. The retaining pins can be easily screwed in and out of the socket. This provision allows the bushings to be replaced easily as they get worn out or deformed from repeated testing.
摘要翻译： 与用于保持被测IC器件上的设定点温度的热控制单元（TCU）相关联的测试插座组件具有带衬套的对准孔，衬套通过使用固定销固定在对准孔内。 保持销可以很容易地拧入和插出插座。 这种设置允许套筒在重复测试时磨损或变形时容易更换。
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8.发明申请SYSTEMS AND METHODS FOR CONFORMING TEST TOOLING TO INTEGRATED CIRCUIT DEVICE PROFILES WITH COMPLIANT PEDESTALS 有权用于将测试工具与集成电路设备配置文件配合使用的系统和方法公开(公告)号：US20140015556A1
公开(公告)日：2014-01-16
申请号：US13935439
申请日：2013-07-03
申请人： ESSAI, INC.
IPC分类号： G01R31/28
CPC分类号： G01R31/2874 , G01R1/0458
摘要： A test socket assembly, useful in association with a thermal control unit used to maintain a set point temperature on an IC device under test, has at least one compliant pedestal is configured to facilitate the testing of integrated circuits where the device under test comprises a substrate having multiple IC chips with different heights and testing requirements.
摘要翻译： 与用于保持被测试的IC器件上的设定点温度相关联的热控制单元有用的测试插座组件具有至少一个柔性基座，以便于对被测器件包括衬底的集成电路进行测试 具有不同高度和测试要求的多个IC芯片。
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公开(公告)号：US11906550B2
公开(公告)日：2024-02-20
申请号：US17515371
申请日：2021-10-29
申请人： ESSAI, INC.
发明人： Nasser Barabi , Oksana Kryachek , Hin Lum Lee , Chee Wah Ho
CPC分类号： G01R1/06738 , G01R1/07342 , G01R31/2886
摘要： An automated high speed test solution for Quad Flat Pack device packages that enables connectivity between test equipment and the integrated circuit under test is described. A test probe geometry that provides highly repeatable and reliable connections suitable for use with consumer grade QFP devices coupled with ease of maintenance is provided. In some embodiments, the probe tip ends are chisel-shaped. The probes can be slightly slanted with respect to a vertical axis of the probe retaining block.
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公开(公告)号：US20210102972A1
公开(公告)日：2021-04-08
申请号：US17090779
申请日：2020-11-05
申请人： ESSAI, INC.
发明人： Nasser Barabi , Oksana Kryachek , Joven R. Tienzo , Chee Wah Ho
IPC分类号： G01R1/04
摘要： A test probe contactor includes an angled depressible probe configuration that causes the tips of the compressible probes to “swipe” the contact pads/solder balls of an IC device under test as the contacts are made. The angulation of the depressible probes permit penetration through foreign material layers on the pad/ball surfaces with less contact force. The contactor includes an upper block and a main block for housing the plurality of probes. The main block and the upper block include corresponding pluralities of slanted probe cavities. The upper bore axis of one or more of the upper probe cavities is laterally shifted relative to the main bore axis of a corresponding probe cavity of the main block, resulting in a lateral offset between the upper bore axis and the main bore axis.
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