Bus structure for parallel connected power switches

    公开(公告)号:US11056860B2

    公开(公告)日:2021-07-06

    申请号:US16599955

    申请日:2019-10-11

    Abstract: An apparatus includes a plurality of semiconductor switches. A first bus interconnects first terminals of the semiconductor switches in a first chain and provides a first impedance between the first terminals of switches of the first chain. A second bus interconnects second terminals of the semiconductor switches in a second chain and provides a second impedance greater that the first impedance between the second terminals of the switches of the second chain. The apparatus may be implemented as a laminated bus assembly including respective overlapping conductor plates, wherein the second bus includes a plate having subregions defined by features, such as slots or grooves, that provide the second impedance.

    BUS STRUCTURE FOR PARALLEL CONNECTED POWER SWITCHES

    公开(公告)号:US20210111542A1

    公开(公告)日:2021-04-15

    申请号:US16599955

    申请日:2019-10-11

    Abstract: An apparatus includes a plurality of semiconductor switches. A first bus interconnects first terminals of the semiconductor switches in a first chain and provides a first impedance between the first terminals of switches of the first chain. A second bus interconnects second terminals of the semiconductor switches in a second chain and provides a second impedance greater that the first impedance between the second terminals of the switches of the second chain. The apparatus may be implemented as a laminated bus assembly including respective overlapping conductor plates, wherein the second bus includes a plate having subregions defined by features, such as slots or grooves, that provide the second impedance.

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