POLISHING MACHINE AND A POLISHING METHOD FOR A SUBSTRATE

    公开(公告)号:US20170259395A1

    公开(公告)日:2017-09-14

    申请号:US15453442

    申请日:2017-03-08

    申请人: Ebara Corporation

    摘要: One object is to provide a polishing machine and a polishing method capable of improving a processing accuracy on the surface of an object. A method of polishing an object is provided. Such a method comprises: a first step of polishing an object by moving the object and a first polishing pad having a smaller dimension than that of the object relative to each other while the first polishing pad is made to contact the object, a second step of polishing the object, after the first step of polishing, by moving the object and a second polishing pad having a larger dimension than that of the object relative to each other while the second polishing pad is made to contact the object, and a step of detecting the state of the surface of the object before the first step of polishing.

    POLISHING MACHINE AND A POLISHING METHOD FOR A SUBSTRATE

    公开(公告)号:US20200171618A1

    公开(公告)日:2020-06-04

    申请号:US16787892

    申请日:2020-02-11

    申请人: Ebara Corporation

    摘要: One object is to provide a polishing machine and a polishing method capable of improving a processing accuracy on the surface of an object. A method of polishing an object is provided. Such a method comprises a first step of polishing an object by moving the object and a first polishing pad having a smaller dimension than that of the object relative to each other while the first polishing pad is made to contact the object, a second step of polishing the object, after the first step of polishing, by moving the object and a second polishing pad having a larger dimension than that of the object relative to each other while the second polishing pad is made to contact the object, and a step of detecting the state of the surface of the object before the first step of polishing.