公开(公告)号：US20230043639A1

公开(公告)日：2023-02-09

申请号：US17911947

申请日：2021-03-10

申请人： EBARA CORPORATION ,  NATIONAL UNIVERSITY CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM ,  NATIONAL UNIVERSITY CORPORATION KANAZAWA UNIVERSITY

发明人： Norikazu SUZUKI ,  Hozumi YASUDA ,  Yoshihiro MOCHIZUKI ,  Yohei HASHIMOTO

IPC分类号： B24B37/005 ,  B24B53/017 ,  H01L21/304

摘要： The present invention relates to a cyber-physical system for optimizing a simulation model for chemical mechanical polishing based on actual measurement data of chemical mechanical polishing. The chemical mechanical polishing system includes a polishing apparatus (1) for polishing the workpiece (W) and an arithmetic system (47). The arithmetic system (47) includes a simulation model including at least a physical model configured to output an estimated polishing physical quantity including an estimated polishing rate of the workpiece (W). The arithmetic system (47) is configured to: input polishing conditions for the workpiece (W) into the simulation model; output the estimated polishing physical quantity of the workpiece (W) from the simulation model; and determine model parameters of the simulation model that bring the estimated polishing physical quantity closer to a measured polishing physical quantity of the workpiece (W).

公开(公告)号：US20200171618A1

公开(公告)日：2020-06-04

申请号：US16787892

申请日：2020-02-11

申请人： Ebara Corporation

发明人： Itsuki KOBATA ,  Katsuhide WATANABE ,  Hozumi YASUDA ,  Yuji YAGI ,  Nobuyuki TAKAHASHI ,  Koichi TAKEDA

IPC分类号： B24B37/013 ,  B24B37/20 ,  B24B37/04

摘要： One object is to provide a polishing machine and a polishing method capable of improving a processing accuracy on the surface of an object. A method of polishing an object is provided. Such a method comprises a first step of polishing an object by moving the object and a first polishing pad having a smaller dimension than that of the object relative to each other while the first polishing pad is made to contact the object, a second step of polishing the object, after the first step of polishing, by moving the object and a second polishing pad having a larger dimension than that of the object relative to each other while the second polishing pad is made to contact the object, and a step of detecting the state of the surface of the object before the first step of polishing.

公开(公告)号：US20170173756A1

公开(公告)日：2017-06-22

申请号：US15378761

申请日：2016-12-14

申请人： EBARA CORPORATION

发明人： Satoru YAMAKI ,  Hozumi YASUDA ,  Keisuke NAMIKI ,  Osamu NABEYA ,  Makoto FUKUSHIMA ,  Shingo TOGASHI ,  Shintaro ISONO

IPC分类号： B24B37/005 ,  B24B37/20

CPC分类号： B24B37/005 ,  B24B37/20

摘要： A polishing object is prevented from slipping out without depending on the process type or the polishing condition. A polishing apparatus for polishing a surface to be polished of an polishing object by sliding the surface to be polished and a polishing member relative to each other, including: a pressing unit that presses a back surface of the surface to be polished of the polishing object such that the surface to be polished is pressed against the polishing member; a retainer member that is arranged on an outer side of the pressing unit and presses the polishing member; a storage unit that stores information concerning a condition for preventing the polishing object from slipping out, the condition being defined by use of information concerning a pressing force of the retainer member; and a control unit that acquires information concerning a force of friction between the surface to be polished of the polishing object and the polishing member or information concerning the pressing force of the retainer member, and executes control for adapting to the condition for preventing the slipping-out by using the acquired information concerning the force of friction or the acquired information concerning the pressing force of the retainer member.

公开(公告)号：US20140329446A1

公开(公告)日：2014-11-06

申请号：US14332357

申请日：2014-07-15

申请人： EBARA CORPORATION

发明人： Osamu NABEYA ,  Tetsuji TOGAWA ,  Makoto FUKUSHIMA ,  Hozumi YASUDA

IPC分类号： B24B37/005 ,  B24B49/00 ,  B24B37/10

CPC分类号： B24B37/20 ,  B24B37/005 ,  B24B37/042 ,  B24B37/10 ,  B24B37/105 ,  B24B37/30 ,  B24B37/32 ,  B24B47/22 ,  B24B49/00 ,  B24B49/16 ,  B24B49/18 ,  B24B49/183

摘要： A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.

公开(公告)号：US20140302754A1

公开(公告)日：2014-10-09

申请号：US14312641

申请日：2014-06-23

申请人： EBARA CORPORATION

发明人： Osamu NABEYA ,  Tetsuji TOGAWA ,  Makoto FUKUSHIMA ,  Hozumi YASUDA

IPC分类号： B24B37/32

CPC分类号： B24B37/20 ,  B24B37/005 ,  B24B37/10 ,  B24B37/105 ,  B24B37/30 ,  B24B37/32 ,  B24B47/22 ,  B24B49/00 ,  B24B49/16

摘要： A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.

公开(公告)号：US20210237221A1

公开(公告)日：2021-08-05

申请号：US17166521

申请日：2021-02-03

申请人： Ebara Corporation

发明人： Nobuyuki TAKADA ,  Hozumi YASUDA

IPC分类号： B24B9/06 ,  B24B37/30 ,  B24B37/04 ,  B24B49/04 ,  B24B49/10

摘要： Polishing uniformity of a surface to be polished of a substrate is improved by appropriately according with a state of the surface to be polished during polishing. A substrate processing apparatus includes a table 100 for supporting a substrate WF, a pad holder 226 for holding a polishing pad 222 for polishing the substrate WF supported by the table 100, an elevating mechanism for elevating the pad holder 226 with respect to the substrate WF, a swing mechanism for swinging the pad holder 226 in a radial direction of the substrate WF, supporting members 300A and 300B for supporting the polishing pad 222 swung to outside the table 100 by the swing mechanism, and driving mechanisms 310 and 320 for adjusting at least one of a height and a distance to the substrate WF of the supporting member 300 while polishing the substrate WF.

公开(公告)号：US20190224808A1

公开(公告)日：2019-07-25

申请号：US16374590

申请日：2019-04-03

申请人： EBARA CORPORATION

发明人： Osamu NABEYA ,  Tetsuji TOGAWA ,  Makoto FUKUSHIMA ,  Hozumi YASUDA

IPC分类号： B24B37/20 ,  B24B49/18 ,  B24B37/04 ,  B24B37/10 ,  B24B49/00 ,  B24B37/30 ,  B24B37/005 ,  B24B37/32 ,  B24B49/16 ,  B24B47/22

摘要： A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.

公开(公告)号：US20170266779A1

公开(公告)日：2017-09-21

申请号：US15458513

申请日：2017-03-14

申请人： EBARA CORPORATION

发明人： Shintaro ISONO ,  Hozumi YASUDA ,  Keisuke NAMIKI ,  Osamu NABEYA ,  Makoto FUKUSHIMA ,  Shingo TOGASHI ,  Satoru YAMAKI

IPC分类号： B24B37/04 ,  B24B37/32 ,  B24B37/20

CPC分类号： B24B37/042 ,  B24B37/20 ,  B24B37/32

摘要： According to one embodiment, a substrate polishing method includes: conveying a substrate to a position above a polishing pad by sucking the substrate by a first region of an elastic film; polishing the substrate while bringing the substrate into contact with the polishing pad; and lifting off the substrate by sucking the substrate by a second region of the elastic film, the second region being larger than the first region.

公开(公告)号：US20160250735A1

公开(公告)日：2016-09-01

申请号：US15150279

申请日：2016-05-09

申请人： EBARA CORPORATION

发明人： Osamu NABEYA ,  Tetsuji TOGAWA ,  Makoto FUKUSHIMA ,  Hozumi YASUDA

IPC分类号： B24B37/20 ,  B24B37/005

CPC分类号： B24B37/20 ,  B24B37/005 ,  B24B37/042 ,  B24B37/10 ,  B24B37/105 ,  B24B37/30 ,  B24B37/32 ,  B24B47/22 ,  B24B49/00 ,  B24B49/16 ,  B24B49/18 ,  B24B49/183

摘要： A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.

摘要翻译： 抛光装置具有抛光垫，用于保持半导体晶片的顶环，以及可操作以在垂直方向上移动顶环的垂直移动机构。 抛光装置还具有距离测量传感器，该距离测量传感器可操作以当顶环的下表面与抛光垫接触时检测顶环的位置，以及控制器，其可操作以计算顶环的最佳位置进行抛光 基于由距离测量传感器检测到的位置的半导体晶片。 垂直移动机构包括可操作以将顶环移动到最佳位置的滚珠丝杠机构。

公开(公告)号：US20140357164A1

公开(公告)日：2014-12-04

申请号：US14464130

申请日：2014-08-20

申请人： EBARA CORPORATION

发明人： Osamu NABEYA ,  Tetsuji TOGAWA ,  Makoto FUKUSHIMA ,  Hozumi YASUDA

IPC分类号： B24B37/32 ,  B24B37/10

CPC分类号： B24B37/20 ,  B24B37/005 ,  B24B37/10 ,  B24B37/105 ,  B24B37/30 ,  B24B37/32 ,  B24B47/22 ,  B24B49/00 ,  B24B49/16

摘要： A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.

摘要翻译： 抛光装置具有抛光垫，用于保持半导体晶片的顶环，以及可操作以在垂直方向上移动顶环的垂直移动机构。 抛光装置还具有距离测量传感器，该距离测量传感器可操作以当顶环的下表面与抛光垫接触时检测顶环的位置，以及控制器，其可操作以计算顶环的最佳位置进行抛光 基于由距离测量传感器检测到的位置的半导体晶片。 垂直移动机构包括可操作以将顶环移动到最佳位置的滚珠丝杠机构。