公开(公告)号：US20170287755A1

公开(公告)日：2017-10-05

申请号：US15475860

申请日：2017-03-31

申请人： EBARA CORPORATION

发明人： Tomohiro TANAKA ,  Kenichiro SAITO ,  Koichi TAKEDA ,  Masumi NISHIJIMA ,  Ryuichi KOSUGE

IPC分类号： H01L21/67 ,  H01L21/687

CPC分类号： H01L21/67259 ,  H01L21/67173 ,  H01L21/67265 ,  H01L21/67742

摘要： A substrate processing apparatus includes transport mechanisms 121a to 127a, a sensor 40 for detecting whether a wafer W is held by the transport mechanisms 121a to 127a, a sensor controller 82 for controlling the sensor 40, a position information acquiring part 81 for acquiring position information of the substrate W in the transport passage, a detection result acquiring part 83 for acquiring a detection result from the sensor 40, and a determination processor 84 for determining whether the detection result of the sensor and the position information are consistent with each other. When it is determined that the detection result of the sensor 40 is inconsistent with the position information, the sensor controller 82 makes the sensor 40 retry to detect whether the substrate W is held.

公开(公告)号：US20200171618A1

公开(公告)日：2020-06-04

申请号：US16787892

申请日：2020-02-11

申请人： Ebara Corporation

发明人： Itsuki KOBATA ,  Katsuhide WATANABE ,  Hozumi YASUDA ,  Yuji YAGI ,  Nobuyuki TAKAHASHI ,  Koichi TAKEDA

IPC分类号： B24B37/013 ,  B24B37/20 ,  B24B37/04

摘要： One object is to provide a polishing machine and a polishing method capable of improving a processing accuracy on the surface of an object. A method of polishing an object is provided. Such a method comprises a first step of polishing an object by moving the object and a first polishing pad having a smaller dimension than that of the object relative to each other while the first polishing pad is made to contact the object, a second step of polishing the object, after the first step of polishing, by moving the object and a second polishing pad having a larger dimension than that of the object relative to each other while the second polishing pad is made to contact the object, and a step of detecting the state of the surface of the object before the first step of polishing.

公开(公告)号：US20150241866A1

公开(公告)日：2015-08-27

申请号：US14596531

申请日：2015-01-14

申请人： EBARA CORPORATION

发明人： Koichi TAKEDA ,  Takamasa NAKAMURA

IPC分类号： G05B19/402

CPC分类号： G05B19/4184 ,  G05B2219/2602 ,  G05B2219/31044 ,  G05B2219/32139 ,  Y02P90/04 ,  Y02P90/14 ,  Y02P90/16 ,  Y02P90/18 ,  Y02P90/185

摘要： An adjustment apparatus capable of adjusting various types of processing units of a substrate processing apparatus within a shorter period of time is disclosed. The adjustment apparatus includes a main operation device configured to manipulate the processing units and adjust the designated operations, terminal operation devices configured to manipulate the processing units and adjust the designated operations, a network that connects the processing units and the main operation device to each other; and connecting devices configured to connect the terminal operation devices to the network and disconnect the terminal operation devices from the network. Each of the terminal operation devices is configured to be able to manipulate at least one of the processing units.

摘要翻译： 公开了能够在更短的时间内调整基板处理装置的各种处理单元的调整装置。 调整装置包括：主操作装置，被配置为操纵处理单元并调整指定操作;终端操作装置，被配置为操纵处理单元并调整指定操作;将处理单元和主操作装置彼此连接的网络 ; 以及被配置为将终端操作设备连接到网络并将终端操作设备从网络断开的连接设备。 每个终端操作设备被配置为能够操纵至少一个处理单元。

公开(公告)号：US20240316720A1

公开(公告)日：2024-09-26

申请号：US18734791

申请日：2024-06-05

申请人： Ebara Corporation

发明人： Koichi TAKEDA ,  Tsuneo TORIKOSHI ,  Kunio OISHI ,  Katsuhide WATANABE ,  Hozumi YASUDA ,  Yu ISHII

IPC分类号： B24B37/005 ,  B24B37/12 ,  B24B37/14 ,  B24B49/03 ,  B24B49/04 ,  B24B55/06 ,  H01L21/304

CPC分类号： B24B37/005 ,  B24B37/12 ,  B24B37/14 ,  B24B49/03 ,  B24B49/04 ,  B24B55/06 ,  H01L21/304

摘要： A local polishing system comprises: a particle estimation unit (30) for estimating the film thickness distribution of a wafer; a local polishing region setting unit (11) for setting a local polishing region on the wafer based on the film thickness distribution; a polishing head selection unit (12) for selecting a polishing head based on the size of the local polishing region; a model storage (20) holding a recipe generating model that defines the relation between an input node and an output node, the input node being an attribute of the local polishing region, the output node comprising a recipe for a polishing process; a polishing recipe generator (13) that puts an attribute of the local polishing region set by the local polishing region setting unit (11) into the input node of the recipe generating model and determines a polishing recipe for polishing the local polishing region; and a polishing recipe transmitter (15) for transmitting data of the polishing recipe to a local polishing module (200) that performs local polishing.

公开(公告)号：US20190240799A1

公开(公告)日：2019-08-08

申请号：US16338931

申请日：2017-09-07

申请人： Ebara Corporation

发明人： Koichi TAKEDA ,  Tsuneo TORIKOSHI ,  Kunio OISHI ,  Katsuhide WATANABE ,  Hozumi YASUDA ,  Yu ISHII

IPC分类号： B24B37/005 ,  B24B37/14 ,  B24B49/03 ,  B24B49/04 ,  B24B55/06 ,  H01L21/304

CPC分类号： B24B37/005 ,  B24B37/12 ,  B24B37/14 ,  B24B49/03 ,  B24B49/04 ,  B24B55/06 ,  H01L21/304

摘要： A local polishing system comprises: a particle estimation unit (30) for estimating the film thickness distribution of a wafer; a local polishing region setting unit (11) for setting a local polishing region on the wafer based on the film thickness distribution; a polishing head selection unit (12) for selecting a polishing head based on the size of the local polishing region; a model storage (20) holding a recipe generating model that defines the relation between an input node and an output node, the input node being an attribute of the local polishing region, the output node comprising a recipe for a polishing process; a polishing recipe generator (13) that puts an attribute of the local polishing region set by the local polishing region setting unit (11) into the input node of the recipe generating model and determines a polishing recipe for polishing the local polishing region; and a polishing recipe transmitter (15) for transmitting data of the polishing recipe to a local polishing module (200) that performs local polishing.

公开(公告)号：US20190118330A1

公开(公告)日：2019-04-25

申请号：US16164273

申请日：2018-10-18

申请人： EBARA CORPORATION

发明人： Kazuya OTSU ,  Koichi TAKEDA ,  Kunimasa MATSUSHITA

IPC分类号： B24B37/005 ,  B24B37/04 ,  B24B37/10

摘要： A non-transitory computer-readable storage medium storing a program of stretching operation of an elastic membrane which can enhance elasticity of an elastic membrane in a short time without using a dummy wafer is disclosed. The non-transitory computer-readable storage medium storing a program of stretching operation of an elastic membrane in a substrate holding apparatus, the program causes a computer to perfoini stretching operation of supplying a pressurized fluid to a pressure chamber formed by the elastic membrane and allowing the pressure chamber to be open to the atmosphere a predetermined number of times by a pressure regulating device in a state where the substrate holding apparatus is positioned above a polishing table during standby operation of a polishing apparatus.

公开(公告)号：US20170259395A1

公开(公告)日：2017-09-14

申请号：US15453442

申请日：2017-03-08

申请人： Ebara Corporation

发明人： Itsuki KOBATA ,  Katsuhide WATANABE ,  Hozumi YASUDA ,  Yuji YAGI ,  Nobuyuki TAKAHASHI ,  Koichi TAKEDA

IPC分类号： B24B37/013 ,  B24B37/20 ,  B24B37/04

CPC分类号： B24B37/013 ,  B24B37/042 ,  B24B37/20

摘要： One object is to provide a polishing machine and a polishing method capable of improving a processing accuracy on the surface of an object. A method of polishing an object is provided. Such a method comprises: a first step of polishing an object by moving the object and a first polishing pad having a smaller dimension than that of the object relative to each other while the first polishing pad is made to contact the object, a second step of polishing the object, after the first step of polishing, by moving the object and a second polishing pad having a larger dimension than that of the object relative to each other while the second polishing pad is made to contact the object, and a step of detecting the state of the surface of the object before the first step of polishing.

公开(公告)号：US20170144265A1

公开(公告)日：2017-05-25

申请号：US15353088

申请日：2016-11-16

申请人： Ebara Corporation

发明人： Koichi TAKEDA

IPC分类号： B24B37/005 ,  B24B37/20

CPC分类号： B24B37/005 ,  B24B37/20

摘要： According to one embodiment of the present disclosure, provided is a method of calibrating a relationship among a pressure command value, a pressure in an air-bag, and a pressure read value of the air-bag in a substrate polishing apparatus, the substrate polishing apparatus including: a polishing table; the air-bag configured to press a substrate against the polishing table, the pressure for pressing the substrate being variable; and a pressure control unit configured to control the pressure in the air-bag in accordance with the pressure command value inputted to the pressure control unit, and read the pressure in the air-bag.