公开(公告)号：US20040231888A1

公开(公告)日：2004-11-25

申请号：US10811817

申请日：2004-03-30

申请人： Endicott Interconnect Technologies, Inc.

发明人： Benson Chan ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich ,  David L. Thomas

IPC分类号： H05K001/00

CPC分类号： H05K3/4688 ,  H01L23/3128 ,  H01L23/5383 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/024 ,  H05K1/113 ,  H05K3/4623 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/061 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2224/0401

摘要： A multilayered PCB including two multilayered portions, one of these able to electrically connect electronic components mounted on the PCB to assure high frequency connections therebetween. The PCB further includes a conventional PCB portion to reduce costs while assuring a structure having a satisfactory overall thickness for use in the PCB field. Coupling is also possible to the internal portion from these components. Methods of making these structures have also been provided.

公开(公告)号：US20040150969A1

公开(公告)日：2004-08-05

申请号：US10354000

申请日：2003-01-30

申请人： Endicott Interconnect Technologies Inc.

发明人： Benson Chan ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich ,  David L. Thomas

IPC分类号： H05K001/11

CPC分类号： H05K3/4688 ,  H01L23/3128 ,  H01L23/5383 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/024 ,  H05K1/113 ,  H05K3/4623 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/061 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2224/0401

摘要： A multilayered PCB including two multilayered portions, one of these able to electrically connect electronic components mounted on the PCB to assure high frequency connections therebetween. The PCB further includes a conventional PCB portion to reduce costs while assuring a structure having a satisfactory overall thickness for use in the PCB field. Coupling is also possible to the internal portion from these components. Methods of making these structures have also been provided.