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公开(公告)号：US06634890B2
公开(公告)日：2003-10-21
申请号：US09972545
申请日：2001-10-08
IPC分类号： H01R1200
摘要： A spring-loaded heat sink assembly for a circuit assembly, an installation tool, and a method of installation. The assembly comprises a heat sink, a load plate, and at least one leaf spring positioned therebetween. The load plate comprises elongate shafts having an open channel therethrough which extend through the leaf spring(s) and heat sink and at least partially through the circuit assembly. The elongate shafts provide a space for the leaf spring(s) between the heat sink and load plate. Fasteners extend through the elongate shafts to connect the spring-loaded heat sink assembly to the circuit assembly.
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公开(公告)号：US06746270B2
公开(公告)日：2004-06-08
申请号：US10602221
申请日：2003-06-23
IPC分类号： H01R300
摘要： A spring-loaded heat sink assembly for a circuit assembly, an installation tool, and a method of installation. The assembly comprises a heat sink, a load plate, and at least one leaf spring positioned therebetween. The load plate comprises elongate shafts having an open channel therethrough which extend through the leaf spring(s) and heat sink and at least partially through the circuit assembly. The elongate shafts provide a space for the leaf spring(s) between the heat sink and load plate. Fasteners extend through the elongate shafts to connect the spring-loaded heat sink assembly to the circuit assembly.
摘要翻译： 用于电路组件的弹簧加载散热器组件，安装工具和安装方法。 组件包括散热器，负载板和位于它们之间的至少一个板簧。 负载板包括细长轴，其具有穿过其的开放通道，其穿过板簧和散热器并且至少部分地穿过电路组件。 细长轴为散热片和负载板之间的板簧提供了一个空间。 紧固件延伸穿过细长轴以将弹簧加载的散热器组件连接到电路组件。
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公开(公告)号：US20080101031A1
公开(公告)日：2008-05-01
申请号：US11552963
申请日：2006-10-25
IPC分类号： H05K7/20
CPC分类号： H05K7/1431 , Y10T29/49126 , Y10T29/49128 , Y10T29/4984 , Y10T29/49904 , Y10T403/7062 , Y10T403/7064 , Y10T403/75 , Y10T403/76
摘要： Various apparatus and methods are disclosed wherein a wedge member and a support engage one another to lock a first structure and a second structure to one another along an axis.
摘要翻译： 公开了各种装置和方法，其中楔形构件和支撑件彼此接合以沿着轴线将第一结构和第二结构彼此锁定。
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公开(公告)号：US07397666B2
公开(公告)日：2008-07-08
申请号：US11552963
申请日：2006-10-25
CPC分类号： H05K7/1431 , Y10T29/49126 , Y10T29/49128 , Y10T29/4984 , Y10T29/49904 , Y10T403/7062 , Y10T403/7064 , Y10T403/75 , Y10T403/76
摘要： Various apparatus and methods are disclosed wherein a wedge member and a support engage one another to lock a first structure and a second structure to one another along an axis.
摘要翻译： 公开了各种装置和方法，其中楔形构件和支撑件彼此接合以沿着轴线将第一结构和第二结构彼此锁定。
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公开(公告)号：US07289335B2
公开(公告)日：2007-10-30
申请号：US10615011
申请日：2003-07-08
申请人： Daniel Lyle Callahan , Raymond Joseph Iannuzzelli , S. Daniel Cromwell , James D. Hensley , Zoila Vega-Marchena
发明人： Daniel Lyle Callahan , Raymond Joseph Iannuzzelli , S. Daniel Cromwell , James D. Hensley , Zoila Vega-Marchena
IPC分类号： G11C11/00
CPC分类号： H05K7/1061
摘要： A force distributor is configured for disposition between a printed circuit board and a stiffening plate, which is spaced from the printed circuit board. The force distributor is configured to distribute a compressive force between the printed circuit board, an interposer and a land grid array module carried on a side of the printed circuit board opposite the stiffening plate. The force distributor comprises a spring element comprising a first portion and a second portion with the first portion extending radially outward from the second portion. The spring element is configured for placement so that the first portion is secured to the stiffening plate and the second portion is biased in unsecured, pressing contact against the printed circuit board.
摘要翻译： 力分配器构造成用于布置在印刷电路板和与印刷电路板间隔开的加强板之间。 力分配器构造成在印刷电路板，插入器和承载在印刷电路板的与加强板相对的一侧上的平台栅格阵列模块之间分布压缩力。 力分配器包括弹簧元件，弹簧元件包括第一部分和第二部分，第一部分从第二部分径向向外延伸。 弹簧元件构造成用于放置，使得第一部分固定到加强板上，并且第二部分被偏置在与印刷电路板无关的压力接触中。
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公开(公告)号：US07345891B2
公开(公告)日：2008-03-18
申请号：US10680445
申请日：2003-10-07
CPC分类号： H05K3/301 , H05K2201/09954 , H05K2201/10409 , H05K2201/2036
摘要： A circuit board assembly includes a circuit board, an electronic component and a structure coupling the electronic component to the circuit board. The structure retains the electronic component relative to the circuit board at a selected one of a plurality of positions in both directions along an axis perpendicular to the circuit board. The structure is movably coupled to one of the electronic component and the circuit board in a direction perpendicular to the axis at least prior to being coupled to the other of the electronic component and the circuit board.
摘要翻译： 电路板组件包括电路板，电子部件和将电子部件耦合到电路板的结构。 该结构沿着垂直于电路板的轴在两个方向上的多个位置中的选定的一个位置处相对于电路板保持电子部件。 至少在与电子部件和电路板的另一个耦合之前，该结构可以在垂直于轴线的方向上可移动地耦合到电子部件和电路板之一。
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公开(公告)号：US20050073817A1
公开(公告)日：2005-04-07
申请号：US10680445
申请日：2003-10-07
CPC分类号： H05K3/301 , H05K2201/09954 , H05K2201/10409 , H05K2201/2036
摘要： A circuit board assembly includes a circuit board, an electronic component and a structure coupling the electronic component to the circuit board. The structure retains the electronic component relative to the circuit board at a selected one of a plurality of positions in both directions along an axis perpendicular to the circuit board. The structure is movably coupled to one of the electronic component and the circuit board in a direction perpendicular to the axis at least prior to being coupled to the other of the electronic component and the circuit board.
摘要翻译： 电路板组件包括电路板，电子部件和将电子部件耦合到电路板的结构。 该结构沿着垂直于电路板的轴在两个方向上的多个位置中的选定的一个位置处相对于电路板保持电子部件。 至少在与电子部件和电路板的另一个耦合之前，该结构可以在垂直于轴线的方向上可移动地耦合到电子部件和电路板之一。
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8.发明授权Method and apparatus for electrical and mechanical attachment, and electromagnetic interference and thermal management of high speed, high density VLSI modules 有权电气和机械附件的方法和装置，以及高速，高密度VLSI模块的电磁干扰和热管理公开(公告)号：US06198630B1
公开(公告)日：2001-03-06
申请号：US09234127
申请日：1999-01-20
申请人： S. Daniel Cromwell
发明人： S. Daniel Cromwell
IPC分类号： H05K720
CPC分类号： H01L23/4006 , H01L2924/0002 , H05K7/1431 , H01L2924/00
摘要： A method and apparatus for assembling a high speed, high density VLSI module in a computer system that enables attachment, support, electromagnetic interference containment, and thermal management of the VLSI module. The present invention packages a high speed, high density VLSI module within a limited space and in a single assembly that attaches, aligns, and manages electromagnetic interference and heat dissipation of the VLSI module. The present invention aligns a land grid array of a circuit board and an interposer socket assembly, and the interposer socket assembly and a land grid array of the VLSI module; in the single VLSI module assembly. An even, controlled load is placed on the interposer socket interface thereby reducing the risk of damage to the interposer socket from overloaded connections between the land grid array of the VLSI module, the interposer socket assembly, and the land grid array of the circuit board. The present invention is easy-to-use in upgrading and handling of the VLSI module.
摘要翻译： 一种用于在计算机系统中组装高速，高密度VLSI模块的方法和装置，其能够实现VLSI模块的附接，支持，电磁干扰抑制和热管理。 本发明将有限空间内的高速，高密度VLSI模块和在VLSI模块的电磁干扰和散热附着，对准和管理的单个组件中进行封装。 本发明对准了电路板和嵌入式插座组件的焊盘阵列，以及插入器插座组件和VLSI模块的焊盘阵列; 在单个VLSI模块组件中。 在插入器插座接口上放置均匀的受控负载，从而降低了插入器插座损坏VLSI模块的地面网格阵列，插入式插座组件和电路板的焊盘阵列之间的过载连接的风险。 本发明在VLSI模块的升级和处理中易于使用。
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9.发明授权
公开(公告)号：US6061235A
公开(公告)日：2000-05-09
申请号：US195256
申请日：1998-11-18
申请人： S. Daniel Cromwell , Laszlo Nobi
发明人： S. Daniel Cromwell , Laszlo Nobi
IPC分类号： H05K1/18 , H01L23/367 , H01L23/552 , H05K7/20
CPC分类号： H01L23/3675 , H01L23/552 , H01L2924/0002 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144
摘要： A modular integrated apparatus and method that integrates mechanical, electrical, and thermal management, and that includes a computer processor (CPU), or VLSI module, connected to a circuit board and a thermal plate. The modular integrated apparatus includes a field replaceable apparatus and a receiving apparatus and attenuates EMI. By integrating mechanical, electrical, and thermal management features the modular integrated apparatus improves the process of repairing and upgrading the processor at a customer site by simplifying the modular integrated apparatus package. Additionally, by reducing the number of parts and the amount of circuit board space required to connect a processor to a thermal plate, the present embodiment improves ease of use and acts as a handle in its own installation and removal. Further, by including the processor and a heat sink in the field replaceable apparatus, the field replaceable apparatus reduces handling in the field and the risk of damage to the processor, and may be tested prior to installation in the field to ensure it operates properly.
摘要翻译： 集成机械，电气和热管理的模块化集成设备和方法，包括连接到电路板和热板的计算机处理器（CPU）或VLSI模块。 模块化集成装置包括现场可更换装置和接收装置，并且衰减EMI。 通过集成机械，电气和热管理功能，模块化集成设备通过简化模块化集成设备包，改善了客户现场处理器的修复和升级过程。 此外，通过减少将处理器连接到热板所需的部件数量和电路板空间的数量，本实施例提高了使用的便利性并且在其自身的安装和拆卸中作为手柄。 此外，通过在现场可更换设备中包括处理器和散热器，现场可更换设备减少了现场的处理和对处理器的损坏的风险，并且可以在现场安装之前进行测试，以确保其正常工作。
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公开(公告)号：US07646595B2
公开(公告)日：2010-01-12
申请号：US12034646
申请日：2008-02-20
CPC分类号： H05K3/301 , H05K2201/09954 , H05K2201/10409 , H05K2201/2036
摘要： A computing device includes a baseboard, a memory coupled to the baseboard, an input/output coupled to the baseboard and a processor system coupled to the baseboard. The processor system includes a circuit board, a central electronic control coupled to the circuit board and a processor component. The device further includes a first structure coupling the processor component to the circuit board and retaining the processor component relative to the circuit board at a selected one of a plurality of positions in both directions along an axis perpendicular to the circuit board. The first structure is movably coupled to one of the processor component and the circuit board for movement in a direction perpendicular to the first axis at least prior to being coupled to the other of the processor component and the circuit board.
摘要翻译： 计算设备包括基板，耦合到基板的存储器，耦合到基板的输入/输出和耦合到基板的处理器系统。 处理器系统包括电路板，耦合到电路板的中央电子控制器和处理器部件。 该装置还包括将处理器部件耦合到电路板并将处理器部件相对于电路板沿着垂直于电路板的轴线沿着两个方向的多个位置中选定的一个位置固定的第一结构。 至少在耦合到处理器部件和电路板中的另一个之前，第一结构可移动地耦合到处理器部件和电路板中的一个，用于在垂直于第一轴线的方向上移动。
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