公开(公告)号：US06446647B1

公开(公告)日：2002-09-10

申请号：US09597744

申请日：2000-06-19

申请人： Eric Chu ,  Hung-Hsien Chang ,  To-Yao Hsu ,  Chin-Wen Chung ,  Hsing-Sheng Yang

发明人： Eric Chu ,  Hung-Hsien Chang ,  To-Yao Hsu ,  Chin-Wen Chung ,  Hsing-Sheng Yang

IPC分类号： B08B300

CPC分类号： H01L21/67057 ,  H01L21/6732 ,  H01L21/67326 ,  H01L21/6733 ,  Y10S134/902

摘要： A cassette holder is positioned within cleaning equipment. The cleaning equipment includes a solution tank, at least one pipe positioned on an internal wall of the solution tank, and a cassette in which at least one semiconductor wafer is placed. The cassette holder has a loading plate in the solution tank for holding the cassette. Pluralities of guide blocks mounted on the loading plate prevent movement of the cassette. A side-frame is positioned at an end of the loading plate proximate to the pipe. The bottom of the loading plate has a plurality of neck feet, and each neck foot is covered by a first tube that enhances support strength of the neck foot. The cassette holder further includes at least one weight to overcome buoyancy.

摘要翻译： 磁带仓位于清洁设备内。 清洁设备包括溶液罐，位于溶液罐的内壁上的至少一个管和其中放置至少一个半导体晶片的盒。 盒式存储器在溶液罐中具有用于保持盒式磁带的装载板。 安装在装载板上的多个导块阻止盒的移动。 侧框架位于靠近管道的装载板的端部。 装载板的底部具有多个颈部脚，并且每个颈部脚都由增强颈部脚的支撑强度的第一管覆盖。 盒架还包括至少一个重量以克服浮力。

公开(公告)号：US08772136B2

公开(公告)日：2014-07-08

申请号：US13483129

申请日：2012-05-30

申请人： Chine-Li Wang ,  Chun-Yen Chen ,  Wei-Hua Fang ,  Hung-Hsien Chang ,  Yung-Chin Yen

发明人： Chine-Li Wang ,  Chun-Yen Chen ,  Wei-Hua Fang ,  Hung-Hsien Chang ,  Yung-Chin Yen

IPC分类号： H01L21/78 ,  H01L21/46 ,  H01L21/301

CPC分类号： B81C1/00873 ,  H01L21/78

摘要： A method for fabricating a semiconductor device, wherein the method comprises steps as follows: Firstly, a device wafer is provided and a patterned bonding layer is then formed within a scribe line region of the device wafer. Subsequently a handle wafer is bonded to the device wafer by the patterned bonding layer. Next, a dicing process is performed along the scribe line region in order to divide the device wafer into a plurality of dices and remove the patterned bonding layer simultaneously, whereby the divided dices can be separated from the handle wafer.

摘要翻译： 一种制造半导体器件的方法，其中所述方法包括以下步骤：首先，提供器件晶片，然后在器件晶片的划线区域内形成图案化结合层。 随后，通过图案化的接合层将处理晶片结合到器件晶片。 接下来，沿着划线区域进行切割处理，以便将器件晶片分成多个骰子并同时移除图案化的接合层，从而可以将分割的骰子与手柄晶片分离。

公开(公告)号：US20130323908A1

公开(公告)日：2013-12-05

申请号：US13483129

申请日：2012-05-30

申请人： Chine-Li WANG ,  Chun-Yen Chen ,  Wei-Hua Fang ,  Hung-Hsien Chang ,  Yung-Chin Yen

发明人： Chine-Li WANG ,  Chun-Yen Chen ,  Wei-Hua Fang ,  Hung-Hsien Chang ,  Yung-Chin Yen

IPC分类号： H01L21/78

CPC分类号： B81C1/00873 ,  H01L21/78

摘要： A method for fabricating a semiconductor device, wherein the method comprises steps as follows: Firstly, a device wafer is provided and a patterned bonding layer is then formed within a scribe line region of the device wafer. Subsequently a handle wafer is bonded to the device wafer by the patterned bonding layer. Next, a dicing process is performed along the scribe line region in order to divide the device wafer into a plurality of dices and remove the patterned bonding layer simultaneously, whereby the divided dices can be separated from the handle wafer.

摘要翻译： 一种制造半导体器件的方法，其中所述方法包括以下步骤：首先，提供器件晶片，然后在器件晶片的划线区域内形成图案化结合层。 随后，通过图案化的接合层将处理晶片结合到器件晶片。 接下来，沿着划线区域进行切割处理，以便将器件晶片分成多个骰子并同时移除图案化的接合层，从而可以将分割的骰子与手柄晶片分离。