公开(公告)号：US10342141B2

公开(公告)日：2019-07-02

申请号：US15847798

申请日：2017-12-19

Applicant: FINISAR CORPORATION

Inventor： Maziar Amirkiai ,  Yunpeng Song ,  Peter Henry Mahowald ,  Hongyu Deng

IPC: H05K3/32 ,  H05K1/18 ,  G02B6/00 ,  G02B6/42 ,  H05K1/02 ,  H05K1/11

Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a substrate with a substrate top and a substrate bottom; at least one optoelectronic transducer on the substrate top; at least one top electrical component on the substrate top, the electrical component can be operably coupled with the optoelectronic transducer; and at least one bottom electrical component on the substrate bottom, the bottom electrical component can be operably coupled with the optoelectronic transducer.

公开(公告)号：US09848498B2

公开(公告)日：2017-12-19

申请号：US14923037

申请日：2015-10-26

Applicant: FINISAR CORPORATION

Inventor： Maziar Amirkiai ,  Yunpeng Song ,  Peter Henry Mahowald ,  Hongyu Deng

IPC: H05K3/32 ,  H05K1/18 ,  G02B6/00 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K3/32 ,  G02B6/00 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/10121 ,  H05K2201/10545 ,  Y02P70/611

Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a substrate with a substrate top and a substrate bottom; at least one optoelectronic transducer on the substrate top; at least one top electrical component on the substrate top, the electrical component can be operably coupled with the optoelectronic transducer; and at least one bottom electrical component on the substrate bottom, the bottom electrical component can be operably coupled with the optoelectronic transducer.

公开(公告)号：US20180116054A1

公开(公告)日：2018-04-26

申请号：US15847798

申请日：2017-12-19

Applicant: FINISAR CORPORATION

Inventor： Maziar Amirkiai ,  Yunpeng Song ,  Peter Henry Mahowald ,  Hongyu Deng

IPC: H05K3/32 ,  G02B6/00 ,  H05K1/18 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K3/32 ,  G02B6/00 ,  G02B6/4263 ,  G02B6/4274 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/10121 ,  H05K2201/10545 ,  Y02P70/611

Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a substrate with a substrate top and a substrate bottom; at least one optoelectronic transducer on the substrate top; at least one top electrical component on the substrate top, the electrical component can be operably coupled with the optoelectronic transducer; and at least one bottom electrical component on the substrate bottom, the bottom electrical component can be operably coupled with the optoelectronic transducer.

公开(公告)号：US20160050775A1

公开(公告)日：2016-02-18

申请号：US14923037

申请日：2015-10-26

Applicant: FINISAR CORPORATION

Inventor： Maziar Amirkiai ,  Yunpeng Song ,  Peter Henry Mahowald ,  Hongyu Deng

IPC: H05K5/00 ,  H05K3/32 ,  H05K1/18 ,  H05K3/30 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K3/32 ,  G02B6/00 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/10121 ,  H05K2201/10545 ,  Y02P70/611

Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a substrate with a substrate top and a substrate bottom; at least one optoelectronic transducer on the substrate top; at least one top electrical component on the substrate top, the electrical component can be operably coupled with the optoelectronic transducer; and at least one bottom electrical component on the substrate bottom, the bottom electrical component can be operably coupled with the optoelectronic transducer.

Abstract translation: 本公开通常涉及使用光信号通过网络传输数据的高速光纤网络。 所公开的主题包括与头部组件和/或光电子部件有关的装置和方法。 在一些方面，所公开的设备和方法可以涉及头部子组件，其可以包括：具有衬底顶部和衬底底部的衬底; 至少一个光电转换器在衬底顶部; 所述衬底顶部上的至少一个顶部电气部件，所述电气部件可以与所述光电转换器可操作地耦合; 以及衬底底部上的至少一个底部电气部件，底部电气部件可以与光电转换器可操作地耦合。