公开(公告)号：US12148867B2

公开(公告)日：2024-11-19

申请号：US17574586

申请日：2022-01-13

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD

Inventor： Kuai Qin ,  Heng Guo ,  Xiaobo Ouyang ,  Hongwen Chen ,  Qiang Zhao ,  Bin Cai ,  Nianpu Li ,  Junyong Wang

IPC: H01L33/56 ,  H01L23/00 ,  H01L25/075 ,  H01L33/62

Abstract: The disclosure provides a light-emitting device and a displayer. Herein, the light-emitting device includes a substrate, a light-emitting chip, a first light-transmitting layer, a second light-transmitting layer and a nano coating. The light transmittance of the second light-transmitting layer is greater than the light transmittance of the first light-transmitting layer. A reference surface corresponding to the light-emitting chip is arranged above the substrate, and the reference surface is higher than the bottom surface of the light-emitting chip and not higher than the top surface of the light-emitting chip. The first light-transmitting layer covers the surface of the light-emitting chip below the reference surface, and the second light-transmitting layer covers the surface of the light-emitting chip above the reference surface. The nano coating covers the outer surface of the first light-transmitting layer, the outer surface of the second light-transmitting layer and the side surface of the substrate.

公开(公告)号：US11600606B2

公开(公告)日：2023-03-07

申请号：US17218389

申请日：2021-03-31

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

Inventor： Junyong Wang ,  Qiang Zhao ,  Kuai Qin ,  Heng Guo ,  Feng Gu ,  Danwei Li ,  Bin Zhao ,  Hongwen Chen

IPC: H01L25/075 ,  H01L33/62

Abstract: Provided are a LED display unit group and a display panel. The LED display unit group includes a circuit board and pixel units arranged in an array of m rows and n columns on the circuit board. The circuit board includes N metal line layers stacked in sequence and an insulating plate located between adjacent metal line layers. The N metal line layers are electrically connected through a conductive via on the insulating plate, where N≥2. Each pixel unit includes at least two LED light-emitting chips with different light-emitting colors, where m≥2, n≥2. The first metal line layer includes m common A-electrode pads, multiple A-electrode pads and multiple B-electrode pads.

公开(公告)号：US20210305221A1

公开(公告)日：2021-09-30

申请号：US17218389

申请日：2021-03-31

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

Inventor： Junyong Wang ,  Qiang Zhao ,  Kuai Qin ,  Heng Guo ,  Feng Gu ,  Danwei Li ,  Bin Zhao ,  Hongwen Chen

IPC: H01L25/075 ,  H01L33/62

Abstract: Provided are a LED display unit group and a display panel. The LED display unit group includes a circuit board and pixel units arranged in an array of m rows and n columns on the circuit board. The circuit board includes N metal line layers stacked in sequence and an insulating plate located between adjacent metal line layers. The N metal line layers are electrically connected through a conductive via on the insulating plate, where N≥2. Each pixel unit includes at least two LED light-emitting chips with different light-emitting colors, where m≥2, n≥2. The first metal line layer includes m common A-electrode pads, multiple A-electrode pads and multiple B-electrode pads.

公开(公告)号：US20220384690A1

公开(公告)日：2022-12-01

申请号：US17748493

申请日：2022-05-19

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

Inventor： Kuai Qin ,  Heng Guo ,  Qiang Zhao ,  Hongwen Chen ,  Bin Cai ,  Junyong Wang ,  Nianpu Li ,  Xiaobo Ouyang

IPC: H01L33/48 ,  H01L25/075 ,  H01L33/62 ,  H01L33/00

Abstract: Provided is a light-emitting diode (LED) display assembly. The LED display assembly includes a plurality of chips, a first carrier and a second carrier. Two opposite side surfaces of the first carrier are respectively a first mounting surface and a second mounting surface. The first mounting surface is provided with first pads, and the first pads are connected to the chips. The second mounting surface is provided with first pins, and wires in the first carrier connect the first pads to the first pins. An area of each of the first pins is larger than an area of each of the first pads. The second carrier is provided with a third mounting surface, the third mounting surface is provided with second pads whose number is the same as a number of the first pins, and the second pads are welded to the first pins in one-to-one correspondence.