公开(公告)号：US10937936B2

公开(公告)日：2021-03-02

申请号：US16502101

申请日：2019-07-03

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

Inventor： Feng Gu ,  Kuai Qin ,  Yuanbin Lin ,  Bin Cai

IPC: H01L33/62 ,  H01L23/538 ,  H01L25/075

Abstract: Provided is a light-emitting diode (LED) display unit group and a display panel. The LED display unit group includes a circuit board, and a pixel unit array located on the circuit board. The pixel unit array includes a plurality of pixel units arranged in n rows and m columns, n and m are both positive integers and greater than or equal to 2. Each of the pixel units includes multiple LED light-emitting chips of at least two colors, each of the LED light-emitting chips includes an electrode A and an electrode B of opposite polarities. The LED light-emitting chip of each of the pixel units includes at least one dual-electrode chip, the dual-electrode chip has the electrode A and the electrode B located on a same side of the dual-electrode chip. All dual-electrode chips in the plurality of pixel units of a same color have connecting lines from the electrode A to the electrode B directed in a same direction.

公开(公告)号：US12148867B2

公开(公告)日：2024-11-19

申请号：US17574586

申请日：2022-01-13

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD

Inventor： Kuai Qin ,  Heng Guo ,  Xiaobo Ouyang ,  Hongwen Chen ,  Qiang Zhao ,  Bin Cai ,  Nianpu Li ,  Junyong Wang

IPC: H01L33/56 ,  H01L23/00 ,  H01L25/075 ,  H01L33/62

Abstract: The disclosure provides a light-emitting device and a displayer. Herein, the light-emitting device includes a substrate, a light-emitting chip, a first light-transmitting layer, a second light-transmitting layer and a nano coating. The light transmittance of the second light-transmitting layer is greater than the light transmittance of the first light-transmitting layer. A reference surface corresponding to the light-emitting chip is arranged above the substrate, and the reference surface is higher than the bottom surface of the light-emitting chip and not higher than the top surface of the light-emitting chip. The first light-transmitting layer covers the surface of the light-emitting chip below the reference surface, and the second light-transmitting layer covers the surface of the light-emitting chip above the reference surface. The nano coating covers the outer surface of the first light-transmitting layer, the outer surface of the second light-transmitting layer and the side surface of the substrate.

公开(公告)号：US20230155092A1

公开(公告)日：2023-05-18

申请号：US17910295

申请日：2021-03-25

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

Inventor： Kuai Qin ,  Shaojia Xie ,  Feng Gu ,  Bin Cai ,  Kailiang Fan ,  Zhuang Peng

IPC: H01L33/62 ,  H01L27/15 ,  H01L25/075 ,  H01L33/38

CPC classification number: H01L33/62 ,  H01L27/156 ,  H01L25/0753 ,  H01L33/38

Abstract: Provided are a LED display unit group and a display panel. The LED display unit group includes a circuit board and pixel units. The circuit board includes N metal wiring layers stacked in sequence and an insulating plate disposed between adjacent metal wiring layers, and the N metal wiring layers are electrically connected through conductive vias on the insulating plate. The pixel units are arranged in an array of m rows and n columns and disposed on the circuit board. Each pixel unit includes at least two LED light-emitting chips with different emitted colors, each LED light-emitting chip is fixed on a first metal wiring layer. The first metal wiring layer includes m common A-electrode pads, A-electrode pads, and B-electrode pads. All the A-electrode pads corresponding to each row of pixel units are integrally formed with and electrically connected to one corresponding common A-electrode pad.

公开(公告)号：US20230111103A1

公开(公告)日：2023-04-13

申请号：US17936645

申请日：2022-09-29

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

Inventor： Kuai Qin ,  Heng Guo ,  Bin Cai ,  Feng Gu ,  Fangping He

IPC: H01L25/075 ,  H01L33/62 ,  H01L27/15 ,  H01L33/38

Abstract: Provided are an LED display module and a display device. The LED display module includes LED display units and a circuit board. Each LED display unit includes pixel units. Each pixel unit includes LED light-emitting chips. A surface of the circuit board is provided with a circuit layer. The circuit layer includes first wirings and second wirings that do not cross each other. A-electrodes of LED light-emitting chips in an i-th row of pixel units in a current LED display unit and in an i-th row of pixel units in a subsequent LED display unit are electrically connected by one first wiring. B-electrodes of LED light-emitting chips of a same color in a j-th column of pixel units in a current LED display unit and in a j-th column of pixel units in a subsequent LED display unit are electrically connected by one second wiring.

公开(公告)号：US20220384690A1

公开(公告)日：2022-12-01

申请号：US17748493

申请日：2022-05-19

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

Inventor： Kuai Qin ,  Heng Guo ,  Qiang Zhao ,  Hongwen Chen ,  Bin Cai ,  Junyong Wang ,  Nianpu Li ,  Xiaobo Ouyang

IPC: H01L33/48 ,  H01L25/075 ,  H01L33/62 ,  H01L33/00

Abstract: Provided is a light-emitting diode (LED) display assembly. The LED display assembly includes a plurality of chips, a first carrier and a second carrier. Two opposite side surfaces of the first carrier are respectively a first mounting surface and a second mounting surface. The first mounting surface is provided with first pads, and the first pads are connected to the chips. The second mounting surface is provided with first pins, and wires in the first carrier connect the first pads to the first pins. An area of each of the first pins is larger than an area of each of the first pads. The second carrier is provided with a third mounting surface, the third mounting surface is provided with second pads whose number is the same as a number of the first pins, and the second pads are welded to the first pins in one-to-one correspondence.