-
公开(公告)号：US11448392B2
公开(公告)日：2022-09-20
申请号：US16883163
申请日：2020-05-26
发明人： Qiang Zhao , Kuai Qin , Heng Guo , Changqi Wang , Zongxian Xie , Kailiang Fan
IPC分类号： F21V33/00 , F21V19/00 , H01L25/065 , H01L23/02 , H01L23/28 , H01L33/48 , H01L33/52 , F21Y105/12 , F21Y113/13 , F21Y115/10
摘要： A blade assembly and a fan display including the same. The blade assembly includes a circuit substrate provided in an elongated shape, a lamination board provided in an elongated shape and bonded to the circuit substrate by a laminating glue, and a plurality of light emitting diode (LED) light emitting units. A mounting hole is defined in the lamination board and passes through a thickness of the lamination board. The circuit substrate has a first side attached to the lamination board, the first side and the mounting hole jointly defining a mounting cavity, in which plurality of LED light emitting units are hermetically disposed in the mounting cavity, and are arranged at intervals along a length of the circuit substrate.
-
公开(公告)号：US20210305221A1
公开(公告)日：2021-09-30
申请号：US17218389
申请日：2021-03-31
发明人： Junyong Wang , Qiang Zhao , Kuai Qin , Heng Guo , Feng Gu , Danwei Li , Bin Zhao , Hongwen Chen
IPC分类号： H01L25/075 , H01L33/62
摘要： Provided are a LED display unit group and a display panel. The LED display unit group includes a circuit board and pixel units arranged in an array of m rows and n columns on the circuit board. The circuit board includes N metal line layers stacked in sequence and an insulating plate located between adjacent metal line layers. The N metal line layers are electrically connected through a conductive via on the insulating plate, where N≥2. Each pixel unit includes at least two LED light-emitting chips with different light-emitting colors, where m≥2, n≥2. The first metal line layer includes m common A-electrode pads, multiple A-electrode pads and multiple B-electrode pads.
-
公开(公告)号：US20230111103A1
公开(公告)日：2023-04-13
申请号：US17936645
申请日：2022-09-29
发明人： Kuai Qin , Heng Guo , Bin Cai , Feng Gu , Fangping He
IPC分类号： H01L25/075 , H01L33/62 , H01L27/15 , H01L33/38
摘要： Provided are an LED display module and a display device. The LED display module includes LED display units and a circuit board. Each LED display unit includes pixel units. Each pixel unit includes LED light-emitting chips. A surface of the circuit board is provided with a circuit layer. The circuit layer includes first wirings and second wirings that do not cross each other. A-electrodes of LED light-emitting chips in an i-th row of pixel units in a current LED display unit and in an i-th row of pixel units in a subsequent LED display unit are electrically connected by one first wiring. B-electrodes of LED light-emitting chips of a same color in a j-th column of pixel units in a current LED display unit and in a j-th column of pixel units in a subsequent LED display unit are electrically connected by one second wiring.
-
4.发明申请公开(公告)号：US20220384690A1
公开(公告)日：2022-12-01
申请号：US17748493
申请日：2022-05-19
发明人： Kuai Qin , Heng Guo , Qiang Zhao , Hongwen Chen , Bin Cai , Junyong Wang , Nianpu Li , Xiaobo Ouyang
IPC分类号： H01L33/48 , H01L25/075 , H01L33/62 , H01L33/00
摘要： Provided is a light-emitting diode (LED) display assembly. The LED display assembly includes a plurality of chips, a first carrier and a second carrier. Two opposite side surfaces of the first carrier are respectively a first mounting surface and a second mounting surface. The first mounting surface is provided with first pads, and the first pads are connected to the chips. The second mounting surface is provided with first pins, and wires in the first carrier connect the first pads to the first pins. An area of each of the first pins is larger than an area of each of the first pads. The second carrier is provided with a third mounting surface, the third mounting surface is provided with second pads whose number is the same as a number of the first pins, and the second pads are welded to the first pins in one-to-one correspondence.
-
公开(公告)号：US11315907B2
公开(公告)日：2022-04-26
申请号：US16995850
申请日：2020-08-18
发明人： Kailiang Fan , Kuai Qin , Heng Guo , Qiang Zhao , Zongxian Xie , Chungan Jiang
IPC分类号： H01L25/075 , G09G3/32
摘要： Some embodiments provide a full-color display module and display device. The full-color display module includes at least two light-emitting layers. Any one of the at least two light-emitting layers includes a substrate and a plurality of light-emitting portions encapsulated on the substrate. A type of any one of the plurality of light-emitting portions is one of a red light-emitting portion, a green light-emitting portion, and a blue light-emitting portion. The at least two light-emitting layers are successively laminated in a laminating direction and form a plurality of pixel points. Any one of the plurality of pixel points is a surrounding area on the full-color display module, which is surrounded by a surrounding curved surface. The surrounding area of the any one of the plurality of pixel points includes at least one red light-emitting portion, at least one green light-emitting portion, and at least one blue light-emitting portion.
-
公开(公告)号：US11314125B2
公开(公告)日：2022-04-26
申请号：US16587279
申请日：2019-09-30
发明人： Qiang Zhao , Chuanbiao Liu , Kuai Qin , Heng Guo , Changqi Wang , Zongxian Xie , Kailiang Fan , Chungan Jiang
IPC分类号： G02F1/13357 , H01L25/075 , H01L33/50 , H01L33/62 , H01L33/64 , H01L33/60 , H05B45/10 , G02F1/1335
摘要： Provided is a LED backlight module, display screen and detection method of a LED backlight module. The LED backlight module includes a substrate and multiple LED chips arranged on the substrate, one first detection group is arranged on the substrate for each LED chip of more than one LED chip arranged at an interval of N LED chips connected in series, where N is greater than or equal to 0, the first detection group includes a first positive electrode detection point and a first negative electrode detection point, the first positive electrode detection point and the first negative electrode detection point of the first detection group are respectively connected to a positive electrode and a negative electrode of the each LED chip.
-
公开(公告)号：US11789309B2
公开(公告)日：2023-10-17
申请号：US17629410
申请日：2020-06-29
发明人： Qiang Zhao , Kuai Qin , Heng Guo , Kailiang Fan
IPC分类号： G02F1/13357 , H01L27/15 , G02F1/1335 , H01L33/56 , H01L33/62
CPC分类号： G02F1/133603 , G02F1/133612 , H01L27/156 , H01L33/56 , H01L33/62
摘要： Some embodiments of the present disclosure disclose an LED backlight module and a display device, a plurality of light-emitting units are distributed on a substrate of the LED backlight module, and the surface of the substrate is provided with a plurality of solder mask window areas for the plurality of light-emitting units to abut against, and a conductive circuit connecting two adjacent light-emitting units includes a main circuit and an auxiliary circuit; a remaining portion of the substrate except for the solder mask window area is coated with an insulating material, an alignment error in the coating process causes the reserved solder mask window area to be covered and an actual solder mask window area to shift, since the auxiliary circuit passes through the solder mask window area and a routing-wiring direction is intersected the connecting-wiring direction of the two electrodes of the light-emitting units.
-
公开(公告)号：US11600606B2
公开(公告)日：2023-03-07
申请号：US17218389
申请日：2021-03-31
发明人： Junyong Wang , Qiang Zhao , Kuai Qin , Heng Guo , Feng Gu , Danwei Li , Bin Zhao , Hongwen Chen
IPC分类号： H01L25/075 , H01L33/62
摘要： Provided are a LED display unit group and a display panel. The LED display unit group includes a circuit board and pixel units arranged in an array of m rows and n columns on the circuit board. The circuit board includes N metal line layers stacked in sequence and an insulating plate located between adjacent metal line layers. The N metal line layers are electrically connected through a conductive via on the insulating plate, where N≥2. Each pixel unit includes at least two LED light-emitting chips with different light-emitting colors, where m≥2, n≥2. The first metal line layer includes m common A-electrode pads, multiple A-electrode pads and multiple B-electrode pads.
-
9.发明申请公开(公告)号：US20230029972A1
公开(公告)日：2023-02-02
申请号：US17788151
申请日：2020-12-18
发明人： Kuai Qin , Heng Guo , Kailiang Fan , Caineng Huo , Zhuang Peng
IPC分类号： H01L33/62 , H01L25/075 , H01L23/544 , H01L33/32 , H01L33/44 , H01L33/46 , H01L33/50
摘要： A manufacturing method for an integrated chip is used for forming and processing an electrode structure of the integrated chip. The method includes step S1 and step S2. In step S1, a light-emitting portion is manufactured, and the light-emitting portion includes multiple light-emitting unit groups distributed in the form of a matrix. In step S2, conductive terminals multiple first electrodes and conductive terminals of multiple second electrodes of the light-emitting portion are electrically led out to form multiple first pin electrodes and multiple second pin electrodes. The first pin electrodes and the second pin electrodes are used for being electrically connected to a circuit substrate.
-
-
-
-
-
-
-
-
搜索结果
9 条记录 (耗时 0.021 秒)
