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公开(公告)号：US20230155092A1
公开(公告)日：2023-05-18
申请号：US17910295
申请日：2021-03-25
发明人： Kuai Qin , Shaojia Xie , Feng Gu , Bin Cai , Kailiang Fan , Zhuang Peng
IPC分类号： H01L33/62 , H01L27/15 , H01L25/075 , H01L33/38
CPC分类号： H01L33/62 , H01L27/156 , H01L25/0753 , H01L33/38
摘要： Provided are a LED display unit group and a display panel. The LED display unit group includes a circuit board and pixel units. The circuit board includes N metal wiring layers stacked in sequence and an insulating plate disposed between adjacent metal wiring layers, and the N metal wiring layers are electrically connected through conductive vias on the insulating plate. The pixel units are arranged in an array of m rows and n columns and disposed on the circuit board. Each pixel unit includes at least two LED light-emitting chips with different emitted colors, each LED light-emitting chip is fixed on a first metal wiring layer. The first metal wiring layer includes m common A-electrode pads, A-electrode pads, and B-electrode pads. All the A-electrode pads corresponding to each row of pixel units are integrally formed with and electrically connected to one corresponding common A-electrode pad.
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公开(公告)号：US20210398954A1
公开(公告)日：2021-12-23
申请号：US17281433
申请日：2019-09-26
发明人： Feng Gu , Chuanbiao Liu , Kuai Qin , Kailiang Fan
IPC分类号： H01L25/075 , H01L23/544 , H01L33/62
摘要： Provided is an LED display unit group, comprising: an insulation substrate, a front circuit board, and a back circuit board. The front circuit board is divided into pixel areas arranged in an array of 2m rows and 2n columns. Each pixel area comprises three A-electrode pads, three LED light-emitting chips of different light emission colors, and B-electrode pads corresponding to the three LED light-emitting chips. In each pixel area, the electrode A of each LED light-emitting chip is electrically connected to a corresponding A-electrode pad, and the electrode B of each LED light-emitting chip is electrically connected to a corresponding B-electrode pad. In the same column of pixel areas, B-electrode pads corresponding to all LED light-emitting chips are electrically connected to each other. In the same row of pixel areas, A-electrode pads corresponding to LED light-emitting chips of the same light emission color are electrically connected to each other.
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公开(公告)号：US10573227B2
公开(公告)日：2020-02-25
申请号：US15995248
申请日：2018-06-01
发明人： Feng Gu , Chuanbiao Liu , Kuai Qin , Xi Zheng , Yuanbin Lin
摘要： The disclosure provides an LED display unit group and display panel, including a pixel unit array of n rows and m columns of pixel units. n and m are positive integers not less than 2. Each pixel unit includes a first, a second and a third LED chip. In the i-th row, the A-electrodes of all the LED chips in m pixel units are connected together, and are electrically connected to the i-th common A-electrode pin. In the j-th column, the B-electrodes of n first LED chips are connected together and are electrically connected to the j-th first B-electrode pin, the B-electrodes of n second LED chips are connected together and electrically connected to the j-th second B-electrode pin, and the B-electrodes of n third LED chips are connected together and are electrically connected to j-th third B-electrode pin of the LED display unit group.
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公开(公告)号：US11789309B2
公开(公告)日：2023-10-17
申请号：US17629410
申请日：2020-06-29
发明人： Qiang Zhao , Kuai Qin , Heng Guo , Kailiang Fan
IPC分类号： G02F1/13357 , H01L27/15 , G02F1/1335 , H01L33/56 , H01L33/62
CPC分类号： G02F1/133603 , G02F1/133612 , H01L27/156 , H01L33/56 , H01L33/62
摘要： Some embodiments of the present disclosure disclose an LED backlight module and a display device, a plurality of light-emitting units are distributed on a substrate of the LED backlight module, and the surface of the substrate is provided with a plurality of solder mask window areas for the plurality of light-emitting units to abut against, and a conductive circuit connecting two adjacent light-emitting units includes a main circuit and an auxiliary circuit; a remaining portion of the substrate except for the solder mask window area is coated with an insulating material, an alignment error in the coating process causes the reserved solder mask window area to be covered and an actual solder mask window area to shift, since the auxiliary circuit passes through the solder mask window area and a routing-wiring direction is intersected the connecting-wiring direction of the two electrodes of the light-emitting units.
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公开(公告)号：US11600606B2
公开(公告)日：2023-03-07
申请号：US17218389
申请日：2021-03-31
发明人： Junyong Wang , Qiang Zhao , Kuai Qin , Heng Guo , Feng Gu , Danwei Li , Bin Zhao , Hongwen Chen
IPC分类号： H01L25/075 , H01L33/62
摘要： Provided are a LED display unit group and a display panel. The LED display unit group includes a circuit board and pixel units arranged in an array of m rows and n columns on the circuit board. The circuit board includes N metal line layers stacked in sequence and an insulating plate located between adjacent metal line layers. The N metal line layers are electrically connected through a conductive via on the insulating plate, where N≥2. Each pixel unit includes at least two LED light-emitting chips with different light-emitting colors, where m≥2, n≥2. The first metal line layer includes m common A-electrode pads, multiple A-electrode pads and multiple B-electrode pads.
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6.发明申请公开(公告)号：US20230029972A1
公开(公告)日：2023-02-02
申请号：US17788151
申请日：2020-12-18
发明人： Kuai Qin , Heng Guo , Kailiang Fan , Caineng Huo , Zhuang Peng
IPC分类号： H01L33/62 , H01L25/075 , H01L23/544 , H01L33/32 , H01L33/44 , H01L33/46 , H01L33/50
摘要： A manufacturing method for an integrated chip is used for forming and processing an electrode structure of the integrated chip. The method includes step S1 and step S2. In step S1, a light-emitting portion is manufactured, and the light-emitting portion includes multiple light-emitting unit groups distributed in the form of a matrix. In step S2, conductive terminals multiple first electrodes and conductive terminals of multiple second electrodes of the light-emitting portion are electrically led out to form multiple first pin electrodes and multiple second pin electrodes. The first pin electrodes and the second pin electrodes are used for being electrically connected to a circuit substrate.
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公开(公告)号：US10256384B2
公开(公告)日：2019-04-09
申请号：US15764319
申请日：2016-06-04
发明人： Chuanbiao Liu , Kuai Qin , Mingjun Zhu , Xiaolong Huang , Tinghong Yang
摘要： A light emitting diode (LED) support frame (10), LED device adopting the same, and LED display module. The LED support frame (10) comprises a base board (101) and a reflection cup (102). A light converging component (103) is arranged on the reflection cup (102). A concave light converging surface (1030) is provided at a side of the light converging component (103) and adjacent to a reflection cup mouth (1021). A part of a light beam emitted from an LED chip is directed to the light converging surface (1030), reflected by the light converging surface (1030), and finally converged with other light beams emitted from the LED chip to focus at a visual field observed by an observer. Therefore, the embodiment effectively reduces optical loss of lights from different directions in the light converging component (103).
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公开(公告)号：US20180277726A1
公开(公告)日：2018-09-27
申请号：US15764319
申请日：2016-06-04
发明人： Chuanbiao Liu , Kuai Qin , Mingjun Zhu , Xiaolong Huang , Tinghong Yang
CPC分类号： H01L33/60 , G09F9/33 , H01L33/486 , H01L33/52 , H01L33/58
摘要： A light emitting diode (LED) support frame (10), LED device adopting the same, and LED display module. The LED support frame (10) comprises a base board (101) and a reflection cup (102). A light converging component (103) is arranged on the reflection cup (102). A concave light converging surface (1030) is provided at a side of the light converging component (103) and adjacent to a reflection cup mouth (1021). A part of a light beam emitted from an LED chip is directed to the light converging surface (1030), reflected by the light converging surface (1030), and finally converged with other light beams emitted from the LED chip to focus at a visual field observed by an observer. Therefore, the embodiment effectively reduces optical loss of lights from different directions in the light converging component (103).
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公开(公告)号：US12100690B2
公开(公告)日：2024-09-24
申请号：US17281433
申请日：2019-09-26
发明人： Feng Gu , Chuanbiao Liu , Kuai Qin , Kailiang Fan
IPC分类号： H01L25/075 , H01L23/544 , H01L33/62
CPC分类号： H01L25/0753 , H01L23/544 , H01L33/62 , H01L2223/54426
摘要： Provided is an LED display unit group, comprising: an insulation substrate, a front circuit board, and a back circuit board. The front circuit board is divided into pixel areas arranged in an array of 2m rows and 2n columns. Each pixel area comprises three A-electrode pads, three LED light-emitting chips of different light emission colors, and B-electrode pads corresponding to the three LED light-emitting chips. In each pixel area, the electrode A of each LED light-emitting chip is electrically connected to a corresponding A-electrode pad, and the electrode B of each LED light-emitting chip is electrically connected to a corresponding B-electrode pad. In the same column of pixel areas, B-electrode pads corresponding to all LED light-emitting chips are electrically connected to each other. In the same row of pixel areas, A-electrode pads corresponding to LED light-emitting chips of the same light emission color are electrically connected to each other.
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公开(公告)号：US20230111103A1
公开(公告)日：2023-04-13
申请号：US17936645
申请日：2022-09-29
发明人： Kuai Qin , Heng Guo , Bin Cai , Feng Gu , Fangping He
IPC分类号： H01L25/075 , H01L33/62 , H01L27/15 , H01L33/38
摘要： Provided are an LED display module and a display device. The LED display module includes LED display units and a circuit board. Each LED display unit includes pixel units. Each pixel unit includes LED light-emitting chips. A surface of the circuit board is provided with a circuit layer. The circuit layer includes first wirings and second wirings that do not cross each other. A-electrodes of LED light-emitting chips in an i-th row of pixel units in a current LED display unit and in an i-th row of pixel units in a subsequent LED display unit are electrically connected by one first wiring. B-electrodes of LED light-emitting chips of a same color in a j-th column of pixel units in a current LED display unit and in a j-th column of pixel units in a subsequent LED display unit are electrically connected by one second wiring.
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