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1.发明申请公开(公告)号：US20170370799A1
公开(公告)日：2017-12-28
申请号：US15189892
申请日：2016-06-22
Applicant: FREESCALE SEMICONDUCTOR INC.
Inventor： PETER T. JONES , ARVIND SALIAN , WILLIAM D. MCWHORTER , CHAD KRUEGER , JOHN SHIPMAN , MICHAEL NAUMANN , LARRY D. METZLER , TRIPTI REGMI
CPC classification number: G01M7/08 , B81B2201/0235 , B81C99/0045 , B81C99/005
Abstract: Methods and apparatuses are provided for evaluating or testing stiction in Microelectromechanical Systems (MEMS) devices utilizing a mechanized shock pulse generation approach. In one embodiment, the method includes the step or process of loading a MEMS device, such as a multi-axis MEMS accelerometer, into a socket provided on a Device-Under-Test (DUT) board. After loading the MEMS device into the socket, a series of controlled shock pulses is generated and transmitted through the MEMS device utilizing a mechanized test apparatus. The mechanized test apparatus may, for example, repeatedly move the DUT board over a predefined motion path to generate the controlled shock pulses. In certain cases, transverse vibrations may also be directed through the tested MEMS device in conjunction with the shock pulses. An output of the MEMS device is then monitored to determine whether stiction of the MEMS device occurs during each of the series of controlled shock pulses.
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公开(公告)号：US20160116361A1
公开(公告)日：2016-04-28
申请号：US14525408
申请日：2014-10-28
Applicant: FREESCALE SEMICONDUCTOR, INC.
Inventor： BRUNO J. DEBEURRE , ALBERT S. CHECKANOV , JANSEN D. CURRENS , PETER T. JONES , WILLIAM D. MCWHORTER , RAIMONDO P. SESSEGO
CPC classification number: B81C99/005 , G01L27/005
Abstract: A system for testing pressure sensors on a device wafer includes a tray for holding the device wafer. The tray includes a base having a surface, a spacer extending from the surface, and a tacky material disposed on the surface. The spacer holds the device wafer spaced apart from the surface of the base to form a chamber between the surface and the device wafer. A wafer chuck retains the tray and the device wafer under vacuum. The system further includes a nozzle and a seal element in fixed engagement with the nozzle. The seal element surrounds the outlet of the nozzle and is adapted for mechanical contact with the device wafer. An actuator is configured to place the nozzle and a diaphragm of one of the pressure sensors in proximity to one another, wherein a pneumatic pressure stimulus is applied to the diaphragm via an outlet of the nozzle.
Abstract translation: 用于测试器件晶片上的压力传感器的系统包括用于保持器件晶片的托盘。 托盘包括具有表面的基部，从表面延伸的间隔件和布置在表面上的粘性材料。 间隔件将装置晶片保持与基座的表面间隔开，以在表面和器件晶片之间形成一个腔室。 晶片卡盘将托盘和器件晶片保持在真空下。 该系统还包括与喷嘴固定接合的喷嘴和密封元件。 密封元件围绕喷嘴的出口并且适于与装置晶片机械接触。 致动器构造成将喷嘴和其中一个压力传感器的隔膜彼此靠近放置，其中气动压力刺激经由喷嘴的出口施加到隔膜。
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3.发明申请公开(公告)号：US20160107887A1
公开(公告)日：2016-04-21
申请号：US14514438
申请日：2014-10-15
Applicant: FREESCALE SEMICONDUCTOR, INC.
Inventor： BRUNO J. DEBEURRE , PETER T. JONES , WILLIAM D. MCWHORTER , RAIMONDO P. SESSEGO
CPC classification number: B81C99/004 , B81C99/005 , B81C99/007 , G01L27/005
Abstract: A method for testing a plurality of pressure sensors on a device wafer includes placing a diaphragm of one of the pressure sensors on the device wafer in proximity to a nozzle of a test system. A pneumatic pressure stimulus is applied to the diaphragm via an outlet of the nozzle and a cavity pressure is measured within a cavity associated with the pressure sensor in response to application of the pneumatic pressure stimulus. The pneumatic pressure stimulus within the cavity corresponds to the pressure applied to the diaphragm. Methodology is executed to test the strength and/or stiffness of the diaphragm. Additionally, the methodology and test system can be utilized to determine an individual calibration factor for each pressure sensor on the device wafer.
Abstract translation: 用于在设备晶片上测试多个压力传感器的方法包括将一个压力传感器的膜片放置在设备晶片上靠近测试系统的喷嘴。 通过喷嘴的出口将气动压力刺激施加到隔膜，并响应于气动压力刺激的应用，在与压力传感器相关联的空腔内测量空腔压力。 空腔内的气动压力刺激对应于施加到隔膜上的压力。 执行方法来测试隔膜的强度和/或刚度。 另外，方法学和测试系统可用于确定设备晶片上每个压力传感器的单独校准因子。
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