公开(公告)号：US20210375786A1

公开(公告)日：2021-12-02

申请号：US17216780

申请日：2021-03-30

申请人： FUJI ELECTRIC CO., LTD.

发明人： Satoshi KANEKO ,  Hisato INOKUCHI

IPC分类号： H01L23/00 ,  H01L23/495

摘要： A semiconductor module includes semiconductor elements, a case that houses the semiconductor elements, an external terminal electrically connecting the semiconductor elements and an external conductor, and a nut into which a bolt that secures the external conductor and the external terminal is threaded. The nut includes a cylindrical main body having a threaded hole, and a flange projecting in a direction radially outward of a center axis of the threaded nut hole and being disposed on one face of the main body. The case includes a wall surrounding the nut, the wall having a first recess that houses the main body, a second recess above the first recess and housing the flange, and a notch cut in a portion of the wall surrounding the main body. The first recess extends deeper than the main body, and the fillet is formed on a floor surface of the first recess.

公开(公告)号：US20220301955A1

公开(公告)日：2022-09-22

申请号：US17586328

申请日：2022-01-27

申请人： FUJI ELECTRIC CO., LTD.

发明人： Satoshi KANEKO

IPC分类号： H01L23/049 ,  H01L23/373 ,  H01L23/00 ,  H01L25/18 ,  H01L25/07

摘要： A first wiring member bends at a first bent portion in the shape of the letter “L” in a side view and includes a first horizontal portion parallel to the principal surface of a semiconductor chip and a first vertical portion perpendicular to the first horizontal portion. A second wiring member bends at a second bent portion in a direction opposite to the first wiring member in the shape of the letter “L” in the side view and includes a second horizontal portion flush with the first horizontal portion and a second vertical portion a determined distance distant from the first vertical portion and parallel to the first vertical portion. A wiring holding portion fills a gap between the first and second vertical portions and a gap between the first and second bent portions. Therefore, stress applied to the vicinity of the first or second bent portion is relaxed.

公开(公告)号：US20200161256A1

公开(公告)日：2020-05-21

申请号：US16589689

申请日：2019-10-01

申请人： Fuji Electric Co., Ltd.

发明人： Satoshi KANEKO ,  Naoyuki KANAI

IPC分类号： H01L23/60 ,  H01L23/367 ,  H01L25/07 ,  H01L25/18 ,  H01L25/16 ,  H01L23/31 ,  H01L23/40

摘要： A semiconductor module internally includes semiconductor elements and multilayer substrates on which the semiconductor elements are arranged. The semiconductor module further includes, in a case, fastening portions for fastening a cooler such as conductive radiating fins or water-cooling jackets, for example. In the semiconductor module, side faces of heat radiating plates formed on the rear surface sides of the multilayer substrates are electrically connected to the fastening portions in the case by conductive connectors.

公开(公告)号：US20170236819A1

公开(公告)日：2017-08-17

申请号：US15390683

申请日：2016-12-26

申请人： FUJI ELECTRIC CO., LTD.

发明人： Naoyuki KANAI ,  Motohito HORI ,  Satoshi KANEKO

IPC分类号： H01L27/06 ,  H01L29/16 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L29/66 ,  H01L29/739 ,  H01L29/06 ,  H01L29/872

摘要： A semiconductor device 100 includes a semiconductor element 12 having an electrode on a front surface, a wire 15 bonded to the electrode of the semiconductor element 12, a resin layer 22b covering a bonding portion of the wire 15 on the front surface of the semiconductor element 12, and a gel filler material 23 that seals the semiconductor element 12, the wire 15, and the resin layer 22b. By protecting the bonding portion of the wire 15 with the resin layer 22b, degradation of the wire 15 is ameliorated and the reliability of the semiconductor device 100 is improved.

公开(公告)号：US20240321675A1

公开(公告)日：2024-09-26

申请号：US18678778

申请日：2024-05-30

申请人： FUJI ELECTRIC CO., LTD.

发明人： Satoshi KANEKO

IPC分类号： H01L23/373 ,  H01L23/00 ,  H01L23/047

CPC分类号： H01L23/3735 ,  H01L23/047 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/73265 ,  H01L2924/3512

摘要： A semiconductor device, including: an insulating board; a conductive plate that is provided on the insulating board; and a terminal that is bonded to the conductive plate via a bonding material. The conductive plate has a structure formed in a predetermined region adjacent to an end portion thereof, such that spreading of the bonding material to the end portion is suppressible by the structure.