Abstract:
A nanoimprinting mold includes: a mold main body having a fine pattern of protrusions and recesses on a surface thereof; and a mold release layer formed on the surface of the mold main body. The mold release layer is formed within a mold release layer forming region, which is a region of the mold main body that includes a patterned region where the fine pattern of protrusions and recesses is formed and has an outer edge positioned outside the outer edge of the patterned region. An outer peripheral mold release layer has a thickness distribution in which the thickness of the outer peripheral mold release layer is locally maximal at positions outside the outer edge of the patterned region, substantially continuously along the entire periphery. Thereby, it becomes possible to restrict the region in which resist flows during nanoimprinting, without employing a mesa type substrate.
Abstract:
A nanoimprinting method employs a resist composition including polymerizable compounds and a polymerization initiating agent, each having absorption spectrum properties with absorption regions within a range from 250 nm to 500 nm. The polymerization initiating agent has an absorption region with a longer wavelength end wavelength longer than the longer wavelength end wavelength of the absorption region of the polymerizable compounds. Further, exposure of the resist composition is executed by light having spectral intensity properties that satisfy a predetermined relational formula. The present invention enables contamination of molds by adhered matter to be suppressed, and enables formation of resist patterns having sufficient etching resistance by nanoimprinting.