公开(公告)号：US20250129308A1

公开(公告)日：2025-04-24

申请号：US19005399

申请日：2024-12-30

Applicant: FUJIFILM CORPORATION

Inventor： Yuta Shigenoi ,  Tetsuya Kamimura ,  Atsushi Mizutani ,  Shimpei Yamada

IPC: C11D3/28 ,  C11D3/00 ,  C11D3/30 ,  H01L21/02

Abstract: An object of the present invention is to provide a semiconductor treatment liquid which has excellent anticorrosion properties against at least one metal selected from the group consisting of Cu and Co in a case of being brought into contact with an object containing the metal, and also has excellent cleanability for organic residues on a surface of the object to be treated; and to provide a treatment method for an object to be treated and a manufacturing method of an electronic device. The treatment liquid of the present invention contains a purine compound and an amine compound, in which the purine compound includes at least one selected from the group consisting of purine and a purine derivative, the amine compound includes at least two of one amine compound A and one or two or more amine compounds B different from the amine compound A, the amine compound A is a tertiary amine compound, and a mass ratio of a content of the purine compound to a content of the amine compound is 0.0001 to 0.1.

公开(公告)号：US20240018442A1

公开(公告)日：2024-01-18

申请号：US18473501

申请日：2023-09-25

Applicant: FUJIFILM Corporation

Inventor： Naoko OUCHI ,  Tetsuya Kamimura ,  Shimpei Yamada ,  Naotsugu Muro

IPC: C11D1/62 ,  C11D11/00 ,  C11D3/00 ,  C11D3/28 ,  C11D3/30 ,  C11D3/20 ,  H01L21/02

CPC classification number: C11D1/62 ,  C11D11/0047 ,  C11D3/0073 ,  C11D3/28 ,  C11D3/30 ,  C11D3/2082 ,  C11D3/2086 ,  H01L21/02074

Abstract: An object of the present invention is to provide a cleaning liquid for a semiconductor substrate, which is excellent in cleaning performance of organic impurities, and a cleaning method for a semiconductor substrate. The cleaning liquid for a semiconductor substrate according to the present invention is a cleaning liquid for a semiconductor substrate used for cleaning a semiconductor substrate, and includes a compound represented by Formula (A).