公开(公告)号：US20140020938A1

公开(公告)日：2014-01-23

申请号：US14033412

申请日：2013-09-20

Applicant: Fujifilm Corporation

Inventor： Hiroshi MATAKI

IPC: H05K3/22 ,  H05K1/09

CPC classification number: H05K3/227 ,  H01L21/4867 ,  H01L23/5328 ,  H01L2924/0002 ,  H05K1/09 ,  H05K1/097 ,  H05K3/125 ,  H05K3/1283 ,  H05K3/245 ,  H05K2201/0266 ,  H05K2203/0278 ,  H05K2203/1476 ,  H01L2924/00

Abstract: A method of forming copper wiring includes: a wiring pattern formation step of depositing a first suspension onto a substrate to form a wiring pattern of the first suspension on the substrate, the first suspension including dispersed first copper particles having an average particle diameter that is not smaller than 100 nm; a drying step of drying the first copper particles at a temperature lower than 150° C.; a second suspension deposition step of depositing a second suspension onto the wiring pattern, the second suspension including dispersed second copper particles having an average particle diameter that is smaller than the average particle diameter of the first copper particles; a compaction step of reducing voids between the first and second copper particles; a heat application step of applying heat to the first and second copper particles; and a reducing treatment step of subjecting the first and second copper particles to a reducing treatment.

Abstract translation: 一种形成铜布线的方法包括：布线图形形成步骤，将第一悬浮液沉积在基板上，以在基板上形成第一悬浮液的布线图案，第一悬浮液包括平均粒径不分散的分散的第一铜颗粒 小于100nm; 在低于150℃的温度下干燥第一铜颗粒的干燥步骤; 第二悬浮沉积步骤，将第二悬浮液沉积到所述布线图案上，所述第二悬浮液包括平均粒径小于所述第一铜颗粒的平均粒径的分散的第二铜颗粒; 减少第一和第二铜颗粒之间的空隙的压实步骤; 向第一和第二铜颗粒施加热量的加热步骤; 以及对所述第一和第二铜粒进行还原处理的还原处理工序。

公开(公告)号：US20200215821A1

公开(公告)日：2020-07-09

申请号：US16826281

申请日：2020-03-22

Applicant: FUJIFILM Corporation

Inventor： Hiroshi MATAKI

IPC: B41J2/165

Abstract: Provided are a liquid jetting device, a liquid jetting head cleaning device, and a liquid jetting head cleaning method, in which an increase in the number of jetting failures is suppressed in a case where a nozzle surface of a liquid jetting head is cleaned by causing a napped wiping member to abut against the nozzle surface.The problem is solved by a liquid jetting head cleaning device, in which first cleaning is performed on a liquid jetting head by causing a napped wiping member to abut against a nozzle surface of the liquid jetting head, second cleaning is performed on the liquid jetting head by causing a liquid to be first pre-jetted from a nozzle of the liquid jetting head after the first cleaning and causing an unnapped wiping member to abut against the nozzle surface of the liquid jetting head after the first pre-jetting, the liquid is pre-jetted from the nozzle of the liquid jetting head after the second cleaning, and the number of times of jetting in the first pre-jetting is larger than the number of times of jetting in the second pre-jetting.

公开(公告)号：US20140083753A1

公开(公告)日：2014-03-27

申请号：US14033407

申请日：2013-09-20

Applicant: FUJIFILM CORPORATION

Inventor： Hiroshi MATAKI

IPC: H05K3/12 ,  H05K1/09

CPC classification number: H05K1/092 ,  H01L21/4867 ,  H01L23/5328 ,  H01L2924/0002 ,  H05K1/097 ,  H05K3/125 ,  H05K3/1283 ,  H05K2203/0278 ,  H05K2203/1157 ,  H01L2924/00

Abstract: Provided are a method of forming copper wiring, a method of manufacturing a wiring board, and a wiring board, which are capable of improving conductivity and suppressing deterioration over a period of time of copper wiring. The method of forming copper wiring includes: a wiring pattern formation step of depositing a suspension onto a substrate to form a wiring pattern of the suspension on the substrate, the suspension including dispersed copper particles having an average particle diameter that is not smaller than 100 nm; a drying step of drying the copper particles at a temperature lower than 150° C.; a pressure application step of applying pressure to the copper particles in the wiring pattern; a heat application step of applying heat to the copper particles in the wiring pattern; and a reducing treatment step of subjecting the copper particles to a reducing treatment.

Abstract translation: 提供一种形成铜布线的方法，制造布线板和布线板的方法，其能够在铜布线的一段时间内提高导电性和抑制劣化。 形成铜布线的方法包括：布线图形形成步骤，将悬浮液沉积在基板上以在基板上形成悬浮液的布线图案，该悬浮液包括平均粒径不小于100nm的分散的铜颗粒 ; 在低于150℃的温度下干燥铜颗粒的干燥步骤; 压力施加步骤，对布线图案中的铜颗粒施加压力; 向所述布线图案中的所述铜粒子施加热量的加热工序; 以及对铜粒进行还原处理的还原处理工序。

公开(公告)号：US20210291551A1

公开(公告)日：2021-09-23

申请号：US17340101

申请日：2021-06-07

Applicant: FUJIFILM Corporation

Inventor： Hiroshi MATAKI

IPC: B41J2/21

Abstract: Provided are a manufacturing method of a printed article and a printing device which obtain a back printed article with a high image quality. A first treatment liquid which contains an aggregating agent that aggregates a color ink and a white ink is added to an impermeable medium, the color ink is applied to the impermeable medium to which the first treatment liquid is added to print an image, and the white ink is applied to the impermeable medium to which the color ink is applied. In a case in which a total amount of an applied amount of the color ink and an applied amount of the white ink exceeds a threshold value, a second treatment liquid which contains at least the aggregating agent that aggregates the white ink is added to the impermeable medium after the color ink is applied and before the white ink is applied.

公开(公告)号：US20180029385A1

公开(公告)日：2018-02-01

申请号：US15657218

申请日：2017-07-24

Applicant: FUJIFILM Corporation

Inventor： Hiroshi MATAKI

IPC: B41J11/00

CPC classification number: B41J11/0015 ,  B41F23/08 ,  B41J11/002 ,  B41M7/0036 ,  B41M7/009

Abstract: A printing apparatus and a printing method that can reduce a difference in glossiness in an in-plane direction of a printed matter to which aqueous varnish has been applied. The apparatus and method satisfy a relationship of “Tp−(40/6)×tw≦a” when the temperature of a recording surface at the time of application of aqueous varnish containing water is denoted by Tp, coating formation time of the aqueous varnish is denoted by tw, and a constant determined according to an allowable value of a gloss difference, which is a difference between glossiness of the recording surface of a printed matter of which applied aqueous varnish has been dried in a first direction and glossiness of the recording surface in a direction orthogonal to the first direction, is denoted by a. Here, the unit of the temperature Tp is ° C. and the unit of the coating formation time tw is minute.

公开(公告)号：US20170151790A1

公开(公告)日：2017-06-01

申请号：US15432566

申请日：2017-02-14

Applicant: FUJIFILM Corporation

Inventor： Hiroshi MATAKI ,  Jun YAMANOBE ,  Hiroshi INOUE

IPC: B41J2/165

CPC classification number: B41J2/16535 ,  B41J2/16538 ,  B41J2/16544 ,  B41J2/16552 ,  B41J2/16585 ,  B41J2/16588 ,  B41J29/38 ,  B41J2002/1655 ,  B41J2002/16558

Abstract: Provided are a nozzle wiping sheet, a nozzle wiping unit, and an image forming apparatus capable of preventing occurrence of streaks during printing immediately after maintenance. A wiping member (120) wipes a nozzle surface (57K) of a jetting head (56K) provided with a nozzle through which liquid droplets are jetted, in which a shape of the liquid droplet added dropwise to the wiping member (120) after a cleaning liquid (108) is added to the wiping member (120) satisfies the following condition when an aspect ratio of the liquid droplet after 40 seconds after the addition of the cleaning liquid (108) is assumed to be R, and the R is 1.3 or more.

公开(公告)号：US20170120600A1

公开(公告)日：2017-05-04

申请号：US15407351

申请日：2017-01-17

Applicant: FUJIFILM Corporation

Inventor： Jun YAMANOBE ,  Hiroshi MATAKI ,  Hiroshi INOUE

IPC: B41J2/165

CPC classification number: B41J2/16535 ,  B05B15/52 ,  B41J2/16544 ,  B41J2/16552 ,  B41J2002/1655 ,  B41J2002/16558

Abstract: Provided are a wiping mechanism, a liquid droplet jetting apparatus, and a wiping method capable of securing an absorption capacity of a wiping member which absorbs a liquid adhered to a nozzle surface while preventing infiltration of bubbles into a nozzle when the nozzle surface is wiped by the wiping member. The nozzle surface is wiped by the wiping member which has one surface 200A that comes into contact with the nozzle surface in which a plurality of nozzles through which liquid droplets are jetted are formed, and has a plurality of voids M that form capillaries from the one surface 200A side to the other surface 200B side, the voids M being greater in size on the other surface 200B side than on the one surface side 200A among the plurality of voids M.