公开(公告)号：US10564545B2

公开(公告)日：2020-02-18

申请号：US15278715

申请日：2016-09-28

Applicant: FUJIFILM Corporation

Inventor： Rena Mukaiyama ,  Atsuyasu Nozaki ,  Takashi Sato ,  Kotaro Asano

IPC: G03F7/32 ,  G03F7/039 ,  B41C1/10 ,  G03F7/09 ,  G03F7/20

Abstract: A photosensitive resin composition contains a polymer compound having a linking group represented by Formula A-1 in the main chain; and an infrared absorbing material. In Formula A-1, R1 and R2 each independently represent a hydrogen atom or a monovalent organic group, and X1 is a specific linking group.

公开(公告)号：US10338469B2

公开(公告)日：2019-07-02

申请号：US15279699

申请日：2016-09-29

Applicant: FUJIFILM Corporation

Inventor： Kotaro Asano ,  Atsuyasu Nozaki ,  Takashi Sato ,  Rena Mukaiyama ,  Kazuto Shimada

IPC: G03F7/32 ,  G03F7/039 ,  B41C1/10 ,  G03F7/20 ,  G03F7/095

Abstract: A photosensitive resin composition contains a polymer compound having a constitutional unit represented by the following Formula A-1 as a constitutional unit A and at least one constitutional unit among constitutional units represented by the following Formulas B-1 to B-6 as a constitutional unit B in the main chain, and an infrared absorbing material.