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公开(公告)号：US10036838B2
公开(公告)日：2018-07-31
申请号：US14820619
申请日：2015-08-07
申请人： FUJIFILM Corporation
发明人： Seongmu Bak , Toshihide Ezoe , Kazuto Shimada
IPC分类号： G06K7/10 , G02B5/20 , G02B1/04 , G02B1/00 , H01L31/0232 , H01L31/0216 , H04N5/225 , C09D5/32 , G02B5/22 , H04N9/04 , H01L27/146 , C09B47/04 , C09B67/02
CPC分类号： G02B5/208 , C09B47/045 , C09B67/0097 , C09D5/32 , G02B1/002 , G02B1/04 , G02B5/22 , G02B5/223 , H01L27/14618 , H01L27/14625 , H01L31/02162 , H01L31/02325 , H01L2924/0002 , H04N5/2254 , H04N5/2257 , H04N9/045 , H01L2924/00
摘要： An infrared ray absorbing composition kit comprises: a composition containing a copper compound or pigment having a maximum absorption wavelength in the wavelength range of 700 nm to 1000 nm; and a composition containing a metal oxide having a maximum absorption wavelength in the wavelength range of 800 nm to 2000 nm.
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公开(公告)号：US09810821B2
公开(公告)日：2017-11-07
申请号：US14735330
申请日：2015-06-10
申请人： FUJIFILM Corporation
IPC分类号： F21V9/04 , G02B5/20 , B32B7/02 , C08L101/12 , G02B5/22 , G02B5/28 , C09D5/33 , C09D183/04 , B32B27/08 , B32B27/20 , B32B27/28 , C08K3/22 , C08K5/16 , C08K5/3417 , G02B1/04 , H04N9/04 , C08K5/00
CPC分类号： G02B5/208 , B32B7/02 , B32B27/08 , B32B27/20 , B32B27/283 , B32B2264/102 , B32B2307/4026 , B32B2307/418 , B32B2457/00 , C08K3/22 , C08K5/0041 , C08K5/16 , C08K5/3417 , C08K2003/2241 , C08L101/12 , C09D5/004 , C09D183/04 , G02B1/04 , G02B5/223 , G02B5/282 , H04N9/045
摘要： An infrared ray cutoff filter including two or more high refractive index layers with a refractive index ranging from 1.65 to 2.00 and two or more low refractive index layers with a refractive index ranging from 1.20 to 1.45. At least one layer of the two or more high refractive index layers and the two or more low refractive index layers contains a dye having a maximum absorption wavelength in a range of 600 nm to 820 nm, and the two or more low refractive index layers are a plurality of kinds of layers which have different film thickness within a range of 50 nm to 250 nm.
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公开(公告)号：US09620542B2
公开(公告)日：2017-04-11
申请号：US14725172
申请日：2015-05-29
申请人： FUJIFILM Corporation
发明人： Toshihide Ezoe , Kazuto Shimada
IPC分类号： H01L31/0232 , H01L27/146 , C09D7/12 , C09D201/00 , C08L101/00 , H04N5/225 , H04N5/335 , G02B5/22
CPC分类号： H01L27/14623 , C08L101/00 , C09B57/004 , C09B67/0013 , C09D7/40 , C09D201/00 , G02B5/223 , H01L27/14618 , H01L27/1462 , H01L27/14621 , H01L27/14625 , H01L27/14627 , H01L27/14629 , H01L27/14685 , H01L27/14687 , H01L2924/0002 , H04N5/225 , H04N5/2254 , H04N5/335 , H01L2924/00
摘要： There is provided a curable resin composition which is capable of being coated on a solid-state imaging device substrate and contains a dye having a maximum absorption wavelength in a wavelength range from 600 to 850 nm, a production method of image sensor chip comprising a step of coating the curable resin composition on a solid-state imaging device substrate to form a dye-containing layer, and a step of adhering a glass substrate having an infrared ray reflecting film onto the dye-containing layer, and an image sensor chip comprising a solid-state imaging device substrate and a dye-containing layer composed of the curable resin composition.
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公开(公告)号：US11848249B2
公开(公告)日：2023-12-19
申请号：US17699181
申请日：2022-03-21
申请人： FUJIFILM Corporation
发明人： Kosuke Yamashita , Naotsugu Muro , Toshiyuki Saie , Naoki Sato , Kazuto Shimada
IPC分类号： H01L21/66 , H01L23/373
CPC分类号： H01L23/3737 , H01L22/12 , H01L22/26
摘要： There is provided a manufacturing method for a thermal conductive layer, with which a thermal conductive layer having a thermal diffusivity of 3.0×10−7 m2s−1 or more is manufactured on a support by using a composition for forming a thermal conductive layer, the composition containing a resin, a filler, and a solvent and having a concentration of solid contents of less than 90% by mass, the manufacturing method including a discharge step of discharging the composition toward the support; and a solvent amount reduction step of reducing a solvent amount in the composition such that a first solvent amount reduction time taken after the composition is discharged until the concentration of solid contents in the composition reaches 90% by mass on the support is 10 seconds or more for each position on the support.
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公开(公告)号：US10598835B2
公开(公告)日：2020-03-24
申请号：US15802803
申请日：2017-11-03
申请人： FUJIFILM Corporation
发明人： Kazuya Oota , Daisuke Sasaki , Yuki Hirai , Takahiro Okawara , Kazuto Shimada , Keisuke Arimura
摘要： An infrared absorbing composition which is used for forming an infrared cut filter in a solid image pickup element having the infrared cut filter includes at least one infrared absorber having an absorption maximum at a wavelength of 650 nm or longer which is selected from polymethine colorants.
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公开(公告)号：US10338469B2
公开(公告)日：2019-07-02
申请号：US15279699
申请日：2016-09-29
申请人： FUJIFILM Corporation
发明人： Kotaro Asano , Atsuyasu Nozaki , Takashi Sato , Rena Mukaiyama , Kazuto Shimada
摘要： A photosensitive resin composition contains a polymer compound having a constitutional unit represented by the following Formula A-1 as a constitutional unit A and at least one constitutional unit among constitutional units represented by the following Formulas B-1 to B-6 as a constitutional unit B in the main chain, and an infrared absorbing material.
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公开(公告)号：US09625618B2
公开(公告)日：2017-04-18
申请号：US14299210
申请日：2014-06-09
申请人： FUJIFILM CORPORATION
发明人： Keiji Yamamoto , Kazuto Shimada , Hideki Takakuwa , Makoto Kubota
IPC分类号： G02B1/10 , G02B1/04 , H01L27/146 , G02B1/11 , H04N5/335 , C09D183/04 , G02B1/111 , C08G77/20
CPC分类号： G02B1/14 , C08G77/20 , C09D183/04 , G02B1/04 , G02B1/10 , G02B1/105 , G02B1/11 , G02B1/111 , G02B2207/107 , H01L27/14625 , H04N5/335 , Y10T428/24942 , C08L27/12 , C08L101/02 , C08L83/04
摘要： An optical member set which has a first optical member formed by curing a composition of curable resins, and a second optical member which is covered by the first optical member, in which the contact angle with water on a surface, which comes into contact with a first optical member, of the second optical member is 70 to 97° and the contact angle with the water on a surface of the opposite side to the side, which comes into contact with the second optical member, of the first optical member is 80 to 115°.
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公开(公告)号：US11697754B2
公开(公告)日：2023-07-11
申请号：US17072001
申请日：2020-10-15
申请人： FUJIFILM Corporation
发明人： Kosuke Yamashita , Kazuto Shimada
IPC分类号： C09K5/14 , C08K3/04 , C08K3/22 , C08K3/28 , C08K3/34 , C08K3/38 , C08K7/04 , C08K9/02 , H01L23/373 , G03F7/32
CPC分类号： C09K5/14 , C08K3/042 , C08K3/22 , C08K3/28 , C08K3/34 , C08K3/38 , C08K7/04 , C08K9/02 , H01L23/3737 , C08K2003/2227 , C08K2003/2241 , C08K2003/282 , C08K2003/385 , C08K2201/001 , C08K2201/005 , C08K2201/016 , G03F7/322
摘要： The present invention relates to a thermal conductive layer that includes at least one filler, has a thermal diffusivity of 5.0×10−7 m2s−1 or more, and has a volume resistivity of 1.0×1011 Ω·cm or more. Further, the present invention relates to a photosensitive layer to which the thermal conductive layer is applied, a photosensitive composition, a manufacturing method for a thermal conductive layer, and a laminate and a semiconductor device.
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公开(公告)号：US10719012B2
公开(公告)日：2020-07-21
申请号：US15821160
申请日：2017-11-22
申请人： FUJIFILM Corporation
发明人： Kazuya Oota , Masahiro Mori , Kazuto Shimada
IPC分类号： G03F7/029 , G03F7/033 , G03F7/16 , G02B5/22 , G03F7/00 , G03F7/031 , C08K5/33 , G03F7/105 , G03F7/038 , C08K5/3415 , C08L101/00 , C08L63/00 , G02B5/20 , C08G59/32 , C08G59/50 , C08K5/00 , G03F7/20 , G03F7/32 , G03F7/40 , H01L27/146 , H01L27/148
摘要： A curable composition includes: an α-type oxytitanium phthalocyanine pigment; and a curable compound. A method of manufacturing a curable composition includes a step of dispersing an α-type oxytitanium phthalocyanine pigment and a pigment other than an oxytitanium phthalocyanine pigment in the presence of a solvent. A film, an infrared cut filter, and an infrared transmitting filter are formed using the curable composition. A pattern forming method includes: a step of forming a curable composition layer on a support using the curable composition; and a step of forming a pattern on the curable composition layer using a photolithography method or a dry etching method. The device is a solid image pickup element, an infrared sensor, or an image display device including the film.
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10.发明授权公开(公告)号：US10692903B2
公开(公告)日：2020-06-23
申请号：US16214152
申请日：2018-12-10
申请人： FUJIFILM Corporation
发明人： Ryoji Goto , Kazuto Shimada , Shigeaki Nimura
IPC分类号： H01L27/146 , G02B1/11 , G02B5/22 , G02B5/26 , G02B5/30 , G02B5/20 , G02B3/00 , H04N9/04 , H04N5/33
摘要： Provided are: a color filter for an image sensor in which an infrared filter having no particulate defects or the like can be laminated adjacent to an image pickup element and in which the total thickness of an image sensor can be significantly reduced; an image sensor including the color filter for an image sensor; and a method of manufacturing the color filter for an image sensor. The color filter for an image sensor includes: two or more absorbing color filters that absorb light components having different wavelength ranges; and a cholesteric reflecting layer in which a right circularly polarized light cholesteric layer having right circularly polarized light reflecting properties and a left circularly polarized light cholesteric layer having left circularly polarized light reflecting properties are laminated.
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