公开(公告)号：US08898895B2

公开(公告)日：2014-12-02

申请号：US13968664

申请日：2013-08-16

Applicant: FUJIFILM Corporation

Inventor： Shiki Ueki ,  Takeshi Hama ,  Takeyoshi Kano

IPC: H01R9/00 ,  H05K3/00 ,  H05K3/46 ,  H05K3/42 ,  H05K3/10

CPC classification number: H05K3/4685 ,  H05K3/108 ,  H05K3/421 ,  H05K3/423 ,  H05K3/4652 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method for producing a multilayer substrate involves: a base-material pretreatment step in which a hole forming step and a metal adhesion step are performed in no particular order, the hole forming step being a step of subjecting a core base material having at least an insulating layer and a first metal layer to a hole opening process, the metal adhesion step being a step in which a predetermined metal or metal ion is made to adhere to the other surface of the insulating layer; a desmearing step of performing desmearing by plasma etching; a cleaning step of cleaning the core base material by using an acidic solution; and a plating step of applying a plating catalyst or a precursor thereof onto the insulating layer and performing plating.

Abstract translation: 制造多层基板的方法包括：基材预处理步骤，其中孔形成步骤和金属粘合步骤以特定顺序进行，所述孔形成步骤是将具有至少一个 绝缘层和第一金属层进行开孔处理，金属粘合步骤是使预定的金属或金属离子粘附到绝缘层的另一个表面的步骤; 通过等离子体蚀刻进行去污的脱蜡步骤; 通过使用酸性溶液清洗核心基材的清洗步骤; 以及将电镀催化剂或其前体施加到绝缘层上并进行电镀的电镀步骤。