公开(公告)号：US20210347007A1

公开(公告)日：2021-11-11

申请号：US17280607

申请日：2019-09-12

Applicant: FUJIMI INCORPORATED

Inventor： Kyosuke TENKO ,  Shota HISHIDA ,  Daisuke YASUI ,  Hideharu HASE ,  Toru KAMADA

IPC: B24B37/24 ,  B24B37/22 ,  B24B37/26

Abstract: There are provided a polishing pad and a polishing method using the same that are useful for removing the surface waviness of a curved resin-painted surface at a high polishing removal rate. A polishing pad (10) according to one aspect of the present invention includes a layer having a polishing surface (30). The layer having the polishing surface (30) has a sparse and dense structure in which a proportion of a sparse portion of the polishing surface (30) is 52% or more and 96% or less, and is composed of a sheet material having an A hardness of 70 or more measured according to JIS K 6253.