POLISHING PAD AND POLISHING METHOD USING SAME

    公开(公告)号:US20210347007A1

    公开(公告)日:2021-11-11

    申请号:US17280607

    申请日:2019-09-12

    IPC分类号: B24B37/24 B24B37/22 B24B37/26

    摘要: There are provided a polishing pad and a polishing method using the same that are useful for removing the surface waviness of a curved resin-painted surface at a high polishing removal rate. A polishing pad (10) according to one aspect of the present invention includes a layer having a polishing surface (30). The layer having the polishing surface (30) has a sparse and dense structure in which a proportion of a sparse portion of the polishing surface (30) is 52% or more and 96% or less, and is composed of a sheet material having an A hardness of 70 or more measured according to JIS K 6253.