-
公开(公告)号：US20190153263A1
公开(公告)日：2019-05-23
申请号：US16096290
申请日：2017-01-27
Applicant: FUJIMI INCORPORATED
Inventor： Hitoshi MORINAGA , Kazusei TAMAI , Maiko ASAI , Yuuichi ITO , Kyosuke TENKO , Toru KAMADA
Abstract: Provided are an abrasive, a polishing composition, and a polishing method capable of polishing the surface of an alloy or metal oxide at a sufficient polishing removal rate and providing a high-quality mirror surface. The abrasive contains alumina having an α-conversion rate of 80% or more and having a 50% particle diameter, in a volume-based cumulative particle diameter distribution, of 0.15 μm or more to 0.35 μm or less. The polishing composition contains this abrasive and has a pH of 7 or less. These abrasive and polishing composition are used for polishing polishing objects containing at least one of an alloy and a metal oxide.
-
公开(公告)号：US20210347007A1
公开(公告)日：2021-11-11
申请号：US17280607
申请日：2019-09-12
Applicant: FUJIMI INCORPORATED
Inventor： Kyosuke TENKO , Shota HISHIDA , Daisuke YASUI , Hideharu HASE , Toru KAMADA
Abstract: There are provided a polishing pad and a polishing method using the same that are useful for removing the surface waviness of a curved resin-painted surface at a high polishing removal rate. A polishing pad (10) according to one aspect of the present invention includes a layer having a polishing surface (30). The layer having the polishing surface (30) has a sparse and dense structure in which a proportion of a sparse portion of the polishing surface (30) is 52% or more and 96% or less, and is composed of a sheet material having an A hardness of 70 or more measured according to JIS K 6253.
-
公开(公告)号：US20190070707A1
公开(公告)日：2019-03-07
申请号：US16074668
申请日：2017-02-20
Applicant: FUJIMI INCORPORATED
Inventor： Toru KAMADA , Koji KATAYAMA , Hitoshi MORINAGA , Takashi HORIBE
Abstract: A disc-shaped polishing pad (1) is used for a polishing method of the present invention. The polishing pad (1) has a peripheral surface (111) on a polishing surface (10) side in an axial direction of the disc of a tapered surface whose diameter is reduced to the polishing surface (10). An angle formed by the peripheral surface (111) and the polishing surface (10) is 125° or more and less than 180°. The polishing pad (1) has a hardness immediately after a pressing surface is in close contact of 40 or more by a testing method specified in an appendix 2 of JIS K7312: 1996, “Spring Hardness Test Type C Testing Method”. A slurry containing abrasives is supplied to a polished surface larger than the polishing surface (10). The polishing surface (10) is pressed against the polished surface and the polishing pad (1) is moved to polish the polished surface.
-
公开(公告)号：US20190010357A1
公开(公告)日：2019-01-10
申请号：US15737874
申请日：2016-05-18
Applicant: FUJIMI INCORPORATED
Inventor： Toru KAMADA , Hitoshi MORINAGA
Abstract: To provide a polishing composition in which abrasives are less likely to precipitate and precipitated and agglomerated abrasives easily redisperse. A polishing composition has abrasives, a liquid medium, metal oxide particles, and a water-soluble polymer. The average primary particle diameter of the metal oxide particles is 1/10 or less of the average primary particle diameter of the abrasives and the weight average molecular weight of the water-soluble polymer is 200 or more and 1000 or less.
-
-
-
Search Results
4
records
(took 0.013 seconds)
