公开(公告)号：US20190153263A1

公开(公告)日：2019-05-23

申请号：US16096290

申请日：2017-01-27

申请人： FUJIMI INCORPORATED

发明人： Hitoshi MORINAGA ,  Kazusei TAMAI ,  Maiko ASAI ,  Yuuichi ITO ,  Kyosuke TENKO ,  Toru KAMADA

IPC分类号： C09G1/02 ,  C09K3/14

摘要： Provided are an abrasive, a polishing composition, and a polishing method capable of polishing the surface of an alloy or metal oxide at a sufficient polishing removal rate and providing a high-quality mirror surface. The abrasive contains alumina having an α-conversion rate of 80% or more and having a 50% particle diameter, in a volume-based cumulative particle diameter distribution, of 0.15 μm or more to 0.35 μm or less. The polishing composition contains this abrasive and has a pH of 7 or less. These abrasive and polishing composition are used for polishing polishing objects containing at least one of an alloy and a metal oxide.

公开(公告)号：US20240182750A1

公开(公告)日：2024-06-06

申请号：US18285091

申请日：2022-03-29

申请人： FUJIMI INCORPORATED

发明人： Kyosuke TENKO ,  Jun ITO ,  Daisuke YASUI ,  Hitoshi MORINAGA

IPC分类号： C09G1/02 ,  C09K3/14

CPC分类号： C09G1/02 ,  C09K3/1409

摘要： Provided is a polishing composition with excellent machining capacity, and good cleaning property after polishing.
A polishing composition containing abrasive grains, water, and a hydrophobic dispersing medium, wherein the hydrophobic dispersing medium contains at least one selected from the group consisting of normal paraffin hydrocarbons, isoparaffin hydrocarbons, naphthenic hydrocarbons, and terpene hydrocarbons, and has a flash point of 30° C. or more and 100° C. or less, or a vapor pressure at 20° C. of 0.004 kPa or more and 2 kPa or less.

公开(公告)号：US20210347007A1

公开(公告)日：2021-11-11

申请号：US17280607

申请日：2019-09-12

申请人： FUJIMI INCORPORATED

发明人： Kyosuke TENKO ,  Shota HISHIDA ,  Daisuke YASUI ,  Hideharu HASE ,  Toru KAMADA

IPC分类号： B24B37/24 ,  B24B37/22 ,  B24B37/26

摘要： There are provided a polishing pad and a polishing method using the same that are useful for removing the surface waviness of a curved resin-painted surface at a high polishing removal rate. A polishing pad (10) according to one aspect of the present invention includes a layer having a polishing surface (30). The layer having the polishing surface (30) has a sparse and dense structure in which a proportion of a sparse portion of the polishing surface (30) is 52% or more and 96% or less, and is composed of a sheet material having an A hardness of 70 or more measured according to JIS K 6253.