公开(公告)号：US20220298380A1

公开(公告)日：2022-09-22

申请号：US17698962

申请日：2022-03-18

Applicant: FUJIMI INCORPORATED

Inventor： Yukinobu YOSHIZAKI ,  Hirofumi IKAWA

IPC: C09G1/02

Abstract: Provided is a polishing composition capable of polishing a layer containing an element in group 13 of the periodic table in a content of more than 40 mass % at a high polishing speed. Provided is a polishing composition for use in polishing an object to be polished having a layer containing an element in group 13 of the periodic table in a content of more than 40 mass %, the polishing composition containing a cationically modified silica, a polyalkylene glycol, and an acid.

公开(公告)号：US20200308449A1

公开(公告)日：2020-10-01

申请号：US16797177

申请日：2020-02-21

Applicant: FUJIMI INCORPORATED

Inventor： Ryota MAE ,  Tsutomu YOSHINO ,  Shogo ONISHI ,  Hirofumi IKAWA ,  Yasuto ISHIDA

IPC: C09G1/02

Abstract: An object of the present invention is to provide a new polishing composition that contributes to improving the quality of a device.There is provided a polishing composition containing: an abrasive grain having an organic acid immobilized on a surface thereof; a first water-soluble polymer having a sulfonic acid group or a group having a salt thereof, or a carboxyl group or a group having a salt thereof; a second water-soluble polymer different from the first water-soluble polymer; a nonionic surfactant; and an aqueous carrier, wherein the polishing composition is used for polishing an object to be polished.