公开(公告)号：US20250084281A1

公开(公告)日：2025-03-13

申请号：US18825481

申请日：2024-09-05

Applicant: FUJIMI INCORPORATED

Inventor： Shogo ONISHI ,  Anthony Y. KIM ,  Alexandra CARLSON

IPC: C09G1/02 ,  H01L21/3105 ,  H01L21/321

Abstract: The present disclosure relates to a polishing compositions that increase a silicon oxide removal rate without impairing the stability of an abrasive. The present disclosure relates to a polishing composition comprising an abrasive, a base compound, a silicon oxide removal rate controller, and an oxidizer, wherein the abrasive is a silica abrasive with a primary particle size ranging from about 30 nm to about 70 nm and a secondary particle size ranging from about 50 nm to about 130 nm; the base compound is an inorganic base; the silicon oxide removal rate controller is a zwitterion; and the oxidizer is a peroxide.

公开(公告)号：US20200024547A1

公开(公告)日：2020-01-23

申请号：US16491349

申请日：2018-02-19

Applicant: FUJIMI INCORPORATED

Inventor： Yasuto ISHIDA ,  Tsutomu YOSHINO ,  Shogo ONISHI ,  Yukinobu YOSHIZAKI

IPC: C11D1/00 ,  C11D11/00 ,  C11D17/00 ,  C11D3/37 ,  C09G1/04 ,  H01L21/02

Abstract: An objective of the present invention is to provide a means for sufficiently removing residues remaining on a surface of a polished object to be polished.A composition for surface treatment containing a polymer compound having at least one ionic functional group selected from the group consisting of a sulfonic acid (salt) group, a phosphoric acid (salt) group, a phosphoric acid (salt) group, and an amino group, and water, in which pH is less than 7, and the polymer compound has a pKa of 3 or less and an ionic functional group density of more than 10%.

公开(公告)号：US20150322294A1

公开(公告)日：2015-11-12

申请号：US14655597

申请日：2013-10-25

Applicant: FUJIMI INCORPORATED

Inventor： Shogo ONISHI

IPC: C09G1/02 ,  B24B37/04 ,  C09K3/14

CPC classification number: C09G1/02 ,  B24B37/044 ,  C09K3/1436 ,  H01L21/3212

Abstract: Provided is a polishing composition which can suppress scratches on the surface of a metal substrate as an object to be polished, while suppressing dishing of the metal substrate. Disclosed is a polishing composition including functional polishing particles and water, the functional polishing particles containing a surface-modifying group having, at one end, a functional group that suppresses dissolution of a metal substrate by adsorbing to the metal substrate, and metal oxide particles to which the surface-modifying group is immobilized.

Abstract translation: 提供一种能够抑制作为被研磨物的金属基板的表面上的划痕同时抑制金属基板的凹陷的研磨用组合物。 公开了一种包含功能性抛光颗粒和水的抛光组合物，所述功能抛光颗粒含有表面改性基团，其一端具有通过吸附金属基底而抑制金属基材溶解的官能团，金属氧化物颗粒至 表面改性基团被固定化。

公开(公告)号：US20230027432A1

公开(公告)日：2023-01-26

申请号：US17939645

申请日：2022-09-07

Applicant: FUJIMI INCORPORATED

Inventor： Tsutomu YOSHINO ,  Shogo ONISHI ,  Yasuto ISHIDA

IPC: C11D3/37 ,  C11D1/00 ,  C11D11/00 ,  H01L21/321 ,  B08B3/08 ,  H01L21/02 ,  H01L21/3105 ,  B08B1/00

Abstract: To provide a means capable of sufficiently removing organic residues present on the surface of a polishing object after polishing containing silicon oxide or polysilicon.
A surface treatment composition contains a polymer having a constituent unit represented by Formula (1) below and water and is used for treating the surface of a polishing object after polishing, in which, in Formula (1) above, R1 is a hydrocarbon group having 1 to 5 carbon atoms and R2 is a hydrogen atom or a hydrocarbon group having 1 to 3 carbon atoms.

公开(公告)号：US20220010207A1

公开(公告)日：2022-01-13

申请号：US17486008

申请日：2021-09-27

Applicant: FUJIMI INCORPORATED

Inventor： Tsutomu YOSHINO ,  Ayano YAMAZAKI ,  Satoru YARITA ,  Shogo ONISHI ,  Yasuto ISHIDA

IPC: C09K13/06 ,  H01L21/321 ,  C09G1/02 ,  C09G1/04 ,  H01L21/02 ,  H01L21/306 ,  C09K13/00

Abstract: An intermediate raw material according to the present invention includes a charge control agent having a critical packing parameter of 0.6 or more and a dispersing medium and a pH of the intermediate raw material is less than 7.

公开(公告)号：US20200095468A1

公开(公告)日：2020-03-26

申请号：US16579395

申请日：2019-09-23

Applicant: FUJIMI INCORPORATED

Inventor： Ayano YAMAZAKI ,  Tsutomu YOSHINO ,  Shogo ONISHI

IPC: C09G1/02 ,  H01L21/321

Abstract: The present invention is to provide means which can inhibit dissolution of tungsten-containing material by bringing a specific compound into contact with the tungsten-containing material. The present invention relates to a tungsten dissolution inhibitor which contains a sulfonic acid compound or a salt thereof containing a nitrogen atom and having a molecular weight of less than 1,000.

公开(公告)号：US20210292600A1

公开(公告)日：2021-09-23

申请号：US17196487

申请日：2021-03-09

Applicant: FUJIMI INCORPORATED

Inventor： Sonosuke ISHIGURO ,  Shogo ONISHI

IPC: C09G1/02

Abstract: The polishing composition according to the present invention is a polishing composition which contains abrasive grains, an additive, a pH adjusting agent, and a dispersing medium and in which a zeta potential of the abrasive grains is negative, the additive is a crosslinked bicyclic compound having a tertiary nitrogen atom, a content of the additive is more than 0% by mass and less than 0.5% by mass with respect to the entire polishing composition mass, and a pH of the polishing composition is less than 5.

公开(公告)号：US20200095467A1

公开(公告)日：2020-03-26

申请号：US16579323

申请日：2019-09-23

Applicant: FUJIMI INCORPORATED

Inventor： Tsutomu YOSHINO ,  Ayano YAMAZAKI ,  Satoru YARITA ,  Shogo ONISHI ,  Yasuto ISHIDA

IPC: C09G1/02 ,  H01L21/321

Abstract: An intermediate raw material according to the present invention includes a charge control agent having a critical packing parameter of 0.6 or more and a dispersing medium and a pH of the intermediate raw material is less than 7.

公开(公告)号：US20200017719A1

公开(公告)日：2020-01-16

申请号：US16491102

申请日：2018-02-19

Applicant: FUJIMI INCORPORATED

Inventor： Yasuto ISHIDA ,  Tsutomu YOSHINO ,  Shogo ONISHI ,  Yukinobu YOSHIZAKI

IPC: C09G1/16 ,  C09G1/02 ,  H01L21/304

Abstract: An object of the present invention is to provide a means for sufficiently removing residues remaining on a surface of a polished object to be polished.A composition for surface treatment containing a polymer compound having at least one ionic functional group selected from the group consisting of a sulfonic acid (salt) group, a phosphoric acid (salt) group, a phosphoric acid (salt) group, a carboxylic acid (salt) group, and an amino group, and water, wherein the pH value is less than 7, and the polymer compound has a pKa of 3 or less, and a weight average molecular weight of 3,500 or more and 100,000 or less.

公开(公告)号：US20190085207A1

公开(公告)日：2019-03-21

申请号：US16085312

申请日：2017-03-10

Applicant: FUJIMI INCORPORATED

Inventor： Shogo ONISHI ,  Takeki SATO

IPC: C09G1/02 ,  H01L21/321 ,  H01L21/768

Abstract: The present invention provides a polishing composition for an object to be polished having a metal-containing layer, by which sufficient flattening can be achieved. The present invention is a polishing composition used for polishing an object to be polished having a metal-containing layer, the polishing composition including: abrasive grains; an acid; an oxidizer; and a dispersing medium, wherein an acid dissociation constant (pKa) of the acid is higher than a pH of the composition.