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公开(公告)号:US20230053210A1
公开(公告)日:2023-02-16
申请号:US17881283
申请日:2022-08-04
Applicant: Fujimi Incorporated
Inventor: Tsutomu YOSHINO , Yasuto ISHIDA
IPC: H01L21/306 , H01L21/02
Abstract: The present invention provides a means capable of sufficiently removing a residue containing inorganic oxide abrasive grains present on the surface of a polished object to be polished containing silicon nitride. One aspect of the present invention relates to a surface treatment method for reducing a residue containing inorganic oxide abrasive grains on a surface of a polished object to be polished containing silicon nitride using a composition for surface treatment, wherein the composition for surface treatment contains a zeta potential adjusting agent having a negatively charged functional group and having a viscosity of an aqueous solution having a concentration of 20% by mass at 25° C. of 10 mPa·s or more and a dispersing medium, and the surface treatment method includes controlling a zeta potential of the silicon nitride and a zeta potential of the inorganic oxide abrasive grains each to −30 mV or less using the composition for surface treatment.
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公开(公告)号:US20230048722A1
公开(公告)日:2023-02-16
申请号:US17881388
申请日:2022-08-04
Applicant: Fujimi Incorporated
Inventor: Tsutomu YOSHINO , Yasuto ISHIDA
IPC: C09G1/02 , C09K3/14 , H01L21/3105 , B24B37/04
Abstract: The present invention provides a unit that can sufficiently remove a residue containing inorganic oxide abrasive grains present on the surface of a polished object to be polished containing silicon oxide. One aspect of the present invention relates to a surface treatment method for reducing a residue containing inorganic oxide abrasive grains on a surface of a polished object to be polished containing silicon oxide using a composition for surface treatment, wherein the composition for surface treatment contains a zeta potential adjusting agent having an sp value of more than 9 and 11 or less and having a negatively charged functional group and a dispersing medium, and the surface treatment method includes negatively controlling a zeta potential of the silicon oxide and controlling a zeta potential of the inorganic oxide abrasive grains to −30 mV or less using the surface treatment composition.
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公开(公告)号:US20200024547A1
公开(公告)日:2020-01-23
申请号:US16491349
申请日:2018-02-19
Applicant: FUJIMI INCORPORATED
Inventor: Yasuto ISHIDA , Tsutomu YOSHINO , Shogo ONISHI , Yukinobu YOSHIZAKI
Abstract: An objective of the present invention is to provide a means for sufficiently removing residues remaining on a surface of a polished object to be polished.A composition for surface treatment containing a polymer compound having at least one ionic functional group selected from the group consisting of a sulfonic acid (salt) group, a phosphoric acid (salt) group, a phosphoric acid (salt) group, and an amino group, and water, in which pH is less than 7, and the polymer compound has a pKa of 3 or less and an ionic functional group density of more than 10%.
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公开(公告)号:US20190241842A1
公开(公告)日:2019-08-08
申请号:US16320432
申请日:2017-06-13
Applicant: FUJIMI INCORPORATED
Inventor: Yasuto ISHIDA
CPC classification number: C11D7/36 , C11D3/36 , C11D7/34 , C11D11/0047 , H01L21/02068 , H01L21/304
Abstract: The present invention relates to a composition for surface treatment including: a phosphonic acid compound containing two or more nitrogen atoms; and water, wherein the pH is 6 or less, and the composition for surface treatment is used for treating a surface of a polishing-completed object to be polished having a tungsten-containing layer. According to the present invention, there is provided a means capable of inhibiting dissolution of the tungsten-containing layer provided on a polishing-completed object to be polished when a surface treatment is performed.
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公开(公告)号:US20230027432A1
公开(公告)日:2023-01-26
申请号:US17939645
申请日:2022-09-07
Applicant: FUJIMI INCORPORATED
Inventor: Tsutomu YOSHINO , Shogo ONISHI , Yasuto ISHIDA
IPC: C11D3/37 , C11D1/00 , C11D11/00 , H01L21/321 , B08B3/08 , H01L21/02 , H01L21/3105 , B08B1/00
Abstract: To provide a means capable of sufficiently removing organic residues present on the surface of a polishing object after polishing containing silicon oxide or polysilicon.
A surface treatment composition contains a polymer having a constituent unit represented by Formula (1) below and water and is used for treating the surface of a polishing object after polishing, in which, in Formula (1) above, R1 is a hydrocarbon group having 1 to 5 carbon atoms and R2 is a hydrogen atom or a hydrocarbon group having 1 to 3 carbon atoms.-
公开(公告)号:US20220010207A1
公开(公告)日:2022-01-13
申请号:US17486008
申请日:2021-09-27
Applicant: FUJIMI INCORPORATED
Inventor: Tsutomu YOSHINO , Ayano YAMAZAKI , Satoru YARITA , Shogo ONISHI , Yasuto ISHIDA
IPC: C09K13/06 , H01L21/321 , C09G1/02 , C09G1/04 , H01L21/02 , H01L21/306 , C09K13/00
Abstract: An intermediate raw material according to the present invention includes a charge control agent having a critical packing parameter of 0.6 or more and a dispersing medium and a pH of the intermediate raw material is less than 7.
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公开(公告)号:US20210130735A1
公开(公告)日:2021-05-06
申请号:US16491845
申请日:2018-01-19
Applicant: FUJIMI INCORPORATED
Inventor: Yasuto ISHIDA
Abstract: The purpose of the present invention is to provide means for sufficiently removing residues on a surface of an object which has been polished including silicon nitride, silicon oxide, or polysilicon.
Provided is a composition for surface treatment including an anionic surfactant having a molecular weight of 1,000 or less and water, the composition having a pH of less than 7, wherein a ratio of a molecular weight of a hydrophilic moiety to a molecular weight of a hydrophobic moiety (the molecular weight of the hydrophilic moiety/the molecular weight of the hydrophobic moiety) of the anionic surfactant is 0.4 or more (in which the hydrophobic moiety is a hydrocarbon group having 4 or more carbon atoms and the hydrophilic moiety is a part excluding the hydrophobic moiety and a counterion), and the composition for surface treatment is used for surface treatment of an object which has been polished including at least one selected from the group consisting of silicon nitride, silicon oxide, and polysilicon.-
8.
公开(公告)号:US20200095467A1
公开(公告)日:2020-03-26
申请号:US16579323
申请日:2019-09-23
Applicant: FUJIMI INCORPORATED
Inventor: Tsutomu YOSHINO , Ayano YAMAZAKI , Satoru YARITA , Shogo ONISHI , Yasuto ISHIDA
IPC: C09G1/02 , H01L21/321
Abstract: An intermediate raw material according to the present invention includes a charge control agent having a critical packing parameter of 0.6 or more and a dispersing medium and a pH of the intermediate raw material is less than 7.
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公开(公告)号:US20200017719A1
公开(公告)日:2020-01-16
申请号:US16491102
申请日:2018-02-19
Applicant: FUJIMI INCORPORATED
Inventor: Yasuto ISHIDA , Tsutomu YOSHINO , Shogo ONISHI , Yukinobu YOSHIZAKI
IPC: C09G1/16 , C09G1/02 , H01L21/304
Abstract: An object of the present invention is to provide a means for sufficiently removing residues remaining on a surface of a polished object to be polished.A composition for surface treatment containing a polymer compound having at least one ionic functional group selected from the group consisting of a sulfonic acid (salt) group, a phosphoric acid (salt) group, a phosphoric acid (salt) group, a carboxylic acid (salt) group, and an amino group, and water, wherein the pH value is less than 7, and the polymer compound has a pKa of 3 or less, and a weight average molecular weight of 3,500 or more and 100,000 or less.
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公开(公告)号:US20190177656A1
公开(公告)日:2019-06-13
申请号:US16324090
申请日:2017-06-26
Applicant: FUJIMI INCORPORATED
Inventor: Yasuto ISHIDA
IPC: C11D1/34 , C11D11/00 , H01L21/306 , H01L21/02
Abstract: The present invention is to provide a means with which foreign matters remaining on a surface of a polished object to be polished can be sufficiently removed. The present invention relates to a composition for surface treatment for a polished object to be polished, including: a (co)polymer containing a structural unit A having a phosphonic acid group and a divalent (poly)oxyhydrocarbon group or a salt thereof; and water, wherein a content of the structural units A exceeds 50% by mole relative to the total structural units forming the (co)polymer.
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