公开(公告)号：US20230364732A1

公开(公告)日：2023-11-16

申请号：US18029059

申请日：2021-09-17

Applicant: FUJIMI INCORPORATED

Inventor： SACHIKO HIRAKO ,  NAOTO NOGUCHI

IPC: B24B37/04 ,  B08B1/00 ,  B08B3/08 ,  B08B3/04 ,  C09G1/02 ,  C11D11/00 ,  C11D1/29 ,  C11D1/72 ,  C11D1/62

CPC classification number: B24B37/044 ,  B08B1/001 ,  B08B3/08 ,  B08B3/048 ,  C09G1/02 ,  C11D11/0047 ,  C11D1/29 ,  C11D1/721 ,  C11D1/62

Abstract: Provided is a method that enables good cleaning of a polished substrate formed of a high-hardness material. Provided is a method of polishing and cleaning a substrate formed of a material having a Vickers hardness of 1500 Hv or more. The method includes: polishing a substrate to be polished using a polishing composition; and cleaning the polished substrate using a cleaner. The polishing composition contains a polishing auxiliary. Furthermore, the cleaner contains a surfactant.