公开(公告)号：US20220186102A1

公开(公告)日：2022-06-16

申请号：US17441083

申请日：2019-12-26

Applicant: FUJIMI INCORPORATED

Inventor： Naoki USHIDA ,  Yuji MASUDA ,  Mina SATO ,  Kazuto SATO ,  Takuya ISAYAMA

IPC: C09K5/14 ,  C01B32/956 ,  C08K3/14

Abstract: There are provided a filler capable of increasing the thermal conductivity of a molded body of a resin composition obtained by being blended in resins, such as plastics, curable resins, or rubbers, and a molded body and a heat dissipating material having high thermal conductivity. A resin composition containing a filler and a resin is molded to give a molded body, and a heat dissipating material is obtained from the molded body. The filler contains secondary particles which are sintered bodies of powder containing primary particles of ceramic. The filler has a specific surface area measured by the BET method of 0.25 m2/g or less and granule strength measured by a microcompression test of 45 MPa or more.