FILLER, MOLDED BODY, AND HEAT DISSIPATING MATERIAL

    公开(公告)号:US20220186102A1

    公开(公告)日:2022-06-16

    申请号:US17441083

    申请日:2019-12-26

    Abstract: There are provided a filler capable of increasing the thermal conductivity of a molded body of a resin composition obtained by being blended in resins, such as plastics, curable resins, or rubbers, and a molded body and a heat dissipating material having high thermal conductivity. A resin composition containing a filler and a resin is molded to give a molded body, and a heat dissipating material is obtained from the molded body. The filler contains secondary particles which are sintered bodies of powder containing primary particles of ceramic. The filler has a specific surface area measured by the BET method of 0.25 m2/g or less and granule strength measured by a microcompression test of 45 MPa or more.

    CERAMIC POWDER
    2.
    发明申请

    公开(公告)号:US20210094884A1

    公开(公告)日:2021-04-01

    申请号:US17036303

    申请日:2020-09-29

    Abstract: To provide a ceramic powder having low bulkiness and good dispersibility.
    In the ceramic powder, the volume ratio of aggregated particles having a particle diameter larger than a reference particle diameter is 35 vol. % or more and the volume ratio when ultrasonic dispersion treatment for 10 minutes at an oscillation frequency of 19.5 kHz and an output power of 10 W is applied is 4 vol. % or less. The reference particle diameter is a particle diameter equivalent to a cumulative 0.1 vol. % diameter from the large diameter side when the ceramic powder is subjected to ultrasonic dispersion treatment for 3 minutes at an oscillation frequency of 19.5 kHz and an output power of 150 W.

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