公开(公告)号：US20240254364A1

公开(公告)日：2024-08-01

申请号：US18423589

申请日：2024-01-26

Applicant: FUJIMI INCORPORATED

Inventor： Hitoshi MORINAGA ,  Yuta YAMADA ,  Kazutoshi HOTTA ,  Yuuichi ITO

IPC: C09G1/02

CPC classification number: C09G1/02

Abstract: The present invention provides a polishing composition which is capable of rapidly removing scratches and exhibits a high polishing rate without deteriorating surface quality. One aspect of the present invention relates to the polishing composition contains abrasive grains having a Mohs hardness of 8 or more, and a dispersing medium, wherein the abrasive grains have two or more local maximum points at different particle sizes in a volume-based particle size distribution measured by a porous electrical resistance method.