公开(公告)号：US20140283380A1

公开(公告)日：2014-09-25

申请号：US14167246

申请日：2014-01-29

Applicant: FUJITSU LIMITED

Inventor： Yoshiyuki HIROSHIMA ,  Naoki NAKAMURA ,  Akiko MATSUI ,  Tetsuro YAMADA ,  Takahiro OOI ,  Kohei CHORAKU

IPC: H05K3/30 ,  B25J15/06

CPC classification number: H05K13/0408 ,  H05K3/3436 ,  H05K13/0409 ,  H05K13/046 ,  H05K2201/10121 ,  H05K2203/166 ,  Y10T29/49131

Abstract: A placement apparatus for an optical component includes: a suction nozzle that includes a nozzle main body having a suction surface having a suction port, an optical component being sucked to the suction port, a plurality of nozzle electrodes disposed on the suction surface, each of the nozzle electrodes being brought into contact with a corresponding one of a plurality of component electrodes provided on the optical component so as to establish electrical conduction between each of the plurality of nozzle electrodes and a corresponding one of the plurality of component electrodes.

Abstract translation: 一种用于光学部件的放置装置，包括：吸嘴，其包括具有吸入面的吸嘴主体，吸入口，被吸入吸入口的光学部件，设置在吸入面上的多个喷嘴电极， 喷嘴电极与设置在光学部件上的多个部件电极中的对应的一个电极接触，以便在多个喷嘴电极中的每一个与多个部件电极中的相应一个之间建立电导通。

公开(公告)号：US20140170784A1

公开(公告)日：2014-06-19

申请号：US14029838

申请日：2013-09-18

Applicant: FUJITSU LIMITED

Inventor： Tetsuro YAMADA ,  Akiko MATSUI ,  Yoshiyuki HIROSHIMA ,  Takahiro OOI ,  Kohei CHORAKU

IPC: H01L33/58 ,  H01L31/0232

CPC classification number: G02B6/4245 ,  G02B6/4214 ,  G02B6/4239 ,  G02B6/43

Abstract: A method of manufacturing a photoelectric composite substrate, includes: aligning and fixing an optical element having a solder terminal to an optical waveguide for forming a path of an optical signal on a printed circuit board; mounting the optical waveguide, to which the optical element is fixed, on the printed circuit board; and welding the solder terminal to an electrode of a package installed on the printed circuit board or an electrode of the printed circuit board.

Abstract translation: 一种制造光电复合基板的方法，包括：将具有焊接端子的光学元件对准和固定到用于在印刷电路板上形成光信号路径的光波导; 将光学元件固定到其上的光波导安装在印刷电路板上; 并将焊接端子焊接到安装在印刷电路板上的封装的电极或印刷电路板的电极上。

公开(公告)号：US20150116962A1

公开(公告)日：2015-04-30

申请号：US14587556

申请日：2014-12-31

Applicant: FUJITSU LIMITED

Inventor： Yoshiyuki HIROSHIMA ,  Akiko MATSUI ,  Mitsuhiko SUGANE ,  Takahide MUKOYAMA ,  Tetsuro YAMADA ,  Takahiro OOI

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H05K1/18 ,  H05K2201/099

Abstract: An electronic device includes an electronic component including a plurality of terminals and a circuit board on which the electronic component is mounted. The circuit board includes a board body, a plurality of electrode pads arranged on the board body, each of the electrode pads being connected to each of the terminals by solder, a first solder resist formed on the board body and having a plurality of first openings, each of the first openings accommodating each of the electrode pads, and a second solder resist formed on the first solder resist and having a plurality of second openings, each of the second openings being larger than each of the first openings and communicating with each of the first openings.

Abstract translation: 一种电子设备包括一个包括多个端子的电子部件和一个安装有电子部件的电路板。 电路板包括板体，布置在板体上的多个电极焊盘，每个电极焊盘通过焊料连接到每个端子;第一阻焊剂，形成在电路板主体上，并具有多个第一开口 每个所述第一开口容纳每个所述电极焊盘;以及第二阻焊剂，形成在所述第一阻焊层上，并且具有多个第二开口，每个所述第二开口大于每个所述第一开口， 第一个开口。