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公开(公告)号：US20190169764A1
公开(公告)日：2019-06-06
申请号：US16206141
申请日：2018-11-30
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Miho YAMAUCHI , Shuichi KITAGAWA , Yoshiaki KOBAYASHI
Abstract: A surface-treated material of the present disclosure has a conductive substrate, and a surface treatment film which includes at least one layer of metal layers and is formed on the conductive substrate. The surface treatment film is a plating film. The surface treatment film is formed on a whole surface or a part of the conductive substrate through a zinc-containing layer that contains zinc as a main component and has a thickness of 50 nm or less, or is formed on the conductive substrate without through the zinc-containing layer. The surface-treated material has a ratio of a contact area to a test area of 85% or more as measured according to a tape test method defined in JIS H 8504: 1999.
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公开(公告)号：US20240372281A1
公开(公告)日：2024-11-07
申请号：US18579915
申请日：2023-03-10
Inventor： Yoshitane TORII , Shuichi KITAGAWA , Soki KUZUHARA
Abstract: An electrical contact material includes an electroconductive substrate, and a silver-containing layer including silver provided to at least part of a surface of the electroconductive substrate. An average CI value of the silver-containing layer is 0.6 or more in a cross section of the electrical contact material.
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公开(公告)号：US20240364032A1
公开(公告)日：2024-10-31
申请号：US18580026
申请日：2023-03-10
Inventor： Yoshitane TORII , Shuichi KITAGAWA , Soki KUZUHARA
IPC: H01R13/03
CPC classification number: H01R13/03
Abstract: An electrical contact material includes an electroconductive substrate, and a silver-containing layer including silver provided to at least part of a surface of the electroconductive substrate. An average KAM value of the silver-containing layer is 0.20° or more and 2.00° or less in a cross section of the electrical contact material.
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公开(公告)号：US20240321474A1
公开(公告)日：2024-09-26
申请号：US18579877
申请日：2023-03-10
Inventor： Yoshitane TORII , Shuichi KITAGAWA , Soki KUZUHARA
IPC: H01B1/02
CPC classification number: H01B1/02
Abstract: An electrical contact material includes an electroconductive substrate, and a silver-containing layer including silver provided to at least part of a surface of the electroconductive substrate. An average GOS value of the silver-containing layer is 1.00° or less and a proportion of KAM value of 1.00° or more in the silver-containing layer is 20% or more in a cross section of the electrical contact material.
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