公开(公告)号：US20210130968A1

公开(公告)日：2021-05-06

申请号：US16473763

申请日：2017-12-26

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Miho YAMAUCHI ,  Yoshiaki KOBAYASHI

IPC: C25D3/12 ,  C25D3/38 ,  C25D5/12

Abstract: The surface-treated material (10) according to the present invention is a surface-treated material including an electroconductive substrate (1) and a surface treatment coating film (2) including at least one metal layer formed above the electroconductive substrate (1), wherein a lowermost metal layer (21), as a metal layer included in the at least one metal layer and formed above the electroconductive substrate (1), is made of nickel, nickel alloy, cobalt, cobalt alloy, copper, or copper alloy, the surface-treated material includes an intervening layer (3) between the electroconductive substrate (1) and the surface treatment coating film (2), the intervening layer (3) containing a metal component of the electroconductive substrate (1), a metal component of the surface treatment coating film (2), and an oxygen component, and the mean thickness of the intervening layer (3) is in the range of 1.00 nm or larger and 40 nm or smaller as measured in the vertical cross-section of the surface-treated material.

公开(公告)号：US20190337268A1

公开(公告)日：2019-11-07

申请号：US16473924

申请日：2017-12-26

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Yoshiaki KOBAYASHI ,  Miho YAMAUCHI

IPC: B32B15/01 ,  C25D5/12 ,  C25D5/44 ,  C25D7/00 ,  H01R13/03

Abstract: The present invention provides: a surface-treated material that can simply and in a short time period form a surface treatment film having an adequate adhesiveness particularly on an electroconductive substrate which is mainly formed of a base metal having a large ionization tendency and is considered to resist having a sound plating film formed thereon; and a component produced by using the same.A surface-treated material (10) of the present invention comprises an electroconductive substrate (1) and a surface treatment film (2) formed of at least one or more layers of metal layers (3 and 4) which are formed on the electroconductive substrate (1), and among the at least one or more layers of metal layers (3 and 4), a lowermost metal layer (3) which is directly formed on the electroconductive substrate (1) comprises a plurality of metal-buried portions (3a) that are scattered in the electroconductive substrate (1) and continuously extend from a surface of the electroconductive substrate (1) toward an inside thereof.

公开(公告)号：US20210164120A1

公开(公告)日：2021-06-03

申请号：US17044998

申请日：2019-03-18

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Miho YAMAUCHI ,  Yoshiaki OGIWARA

IPC: C25D3/38 ,  C25D5/44 ,  C25D7/06 ,  C25D5/10

Abstract: Provided is a plated wire rod having excellent salt water corrosion resistance, solder wettability, thermal peeling resistance, and fatigue resistance. A plated wire rod having a wire rod made of aluminum or an aluminum alloy, and a surface treatment coating which is constituted by one or more metal layers and with which the wire rod is coated, the plated wire rod comprising: a mixed layer in a boundary region between the wire rod and the surface treatment coating, the mixed layer containing a metal component of the wire rod, a metal component of the surface treatment coating, and an oxygen component, wherein the one or more metal layers constituting the surface treatment coating includes an innermost metal layer which is located closest to the wire rod among the one or more metal layers, the innermost metal layer being made of copper or a copper alloy.

公开(公告)号：US20190323136A1

公开(公告)日：2019-10-24

申请号：US16473822

申请日：2017-12-26

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Yoshiaki KOBAYASHI ,  Miho YAMAUCHI

IPC: C25D7/00 ,  H01B1/02 ,  C25D5/12 ,  C25D5/44 ,  C25D3/12 ,  C25D3/38

Abstract: A surface-treated material (10) according to the present invention comprises an electroconductive substrate (1) and a surface treatment film (2) formed of at least one or more layers of metal layers (3 and 4) which are formed on the electroconductive substrate (1), wherein among the at least one or more layers of metal layers (3 and 4), the lowermost metal layer (3) which is directly formed on the electroconductive substrate (1) comprises a plurality of metal-buried portions (3a) that are scattered in the electroconductive substrate (1), branch from a surface of the electroconductive substrate (1) and widely extend toward the inside thereof, and as a vertical cross section of the surface-treated material (10) is viewed, in which at least one of the metal-buried portions (3a) exists in the electroconductive substrate (1), an average value of an area ratio of the metal-buried portion (3a) occupying the predetermined observation region of the electroconductive substrate (1) is in a range of 5% or more and 50% or less.

公开(公告)号：US20190169764A1

公开(公告)日：2019-06-06

申请号：US16206141

申请日：2018-11-30

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Miho YAMAUCHI ,  Shuichi KITAGAWA ,  Yoshiaki KOBAYASHI

IPC: C25D5/44 ,  C25D3/12

Abstract: A surface-treated material of the present disclosure has a conductive substrate, and a surface treatment film which includes at least one layer of metal layers and is formed on the conductive substrate. The surface treatment film is a plating film. The surface treatment film is formed on a whole surface or a part of the conductive substrate through a zinc-containing layer that contains zinc as a main component and has a thickness of 50 nm or less, or is formed on the conductive substrate without through the zinc-containing layer. The surface-treated material has a ratio of a contact area to a test area of 85% or more as measured according to a tape test method defined in JIS H 8504: 1999.

公开(公告)号：US20200024764A1

公开(公告)日：2020-01-23

申请号：US16585903

申请日：2019-09-27

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Miho YAMAUCHI ,  Yoshiaki OGIWARA

IPC: C25D5/44 ,  C22C21/12 ,  C22F1/057 ,  H01B1/02 ,  C22C13/00 ,  C22C19/03 ,  C25D7/06 ,  C23C28/00

Abstract: A plated wire rod material according to the present disclosure contains a substrate containing aluminum or an aluminum alloy, and a surface treatment coat including one or more metal layers and covering the substrate. Of the one or more metal layers, an undermost metal layer which is a metal layer formed on the substrate includes nickel, a nickel alloy, cobalt or a cobalt alloy. A mixed layer containing a metal component in the substrate, a metal component in the surface treatment coat and an oxygen component is present at an interface between the substrate and the surface treatment coat.