公开(公告)号：US20130099270A1

公开(公告)日：2013-04-25

申请号：US13714000

申请日：2012-12-13

Applicant: Furukawa Electric Co., Ltd.

Inventor： Yoshiaki KOBAYASHI ,  Akira MATSUDA ,  Satoshi SUZUKI ,  Shin KIKUCHI ,  Akira TACHIBANA ,  Satoru ZAMA

IPC: H01L33/60

CPC classification number: H01L33/60 ,  C25D3/12 ,  C25D3/38 ,  C25D3/46 ,  C25D3/64 ,  C25D5/022 ,  C25D5/10 ,  C25D5/12 ,  C25D5/34 ,  C25D5/36 ,  C25D5/44 ,  C25D5/48 ,  C25D5/50 ,  C25D7/08 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A lead frame for an optical semiconductor device, having a reflection layer at least on one side or each side of the outermost surface of a substrate, partially or entirely, in which the reflection layer has, on the outermost surface at least in a region where light emitted by an optical semiconductor element is reflected, a microstructure with at least the surface thereof having been mechanically deformed, which is converted from a plating microstructure formed of a metal or an alloy thereof; a method of producing the same, and an optical semiconductor device having the same.

Abstract translation: 一种用于光学半导体器件的引线框架，其中反射层至少在基板的最外表面的一侧或每一侧上部分或全部地被反射层，其中反射层在其最外表面上至少在 由光学半导体元件发出的光被反射，其至少表面的机械变形的微观结构由金属或其合金形成的电镀微结构转变; 其制造方法和具有该半导体器件的光半导体器件。

公开(公告)号：US20170076834A1

公开(公告)日：2017-03-16

申请号：US15363518

申请日：2016-11-29

Applicant: FURUKAWA ELECTRIC CO., LTD. ,  FURUKAWA AUTOMOTIVE SYSTEMS INC.

Inventor： Yoshikazu OKUNO ,  Yoshiaki KOBAYASHI ,  Tatsuya NAKATSUGAWA ,  Kengo MITOSE ,  Akira TACHIBANA ,  Shingo KAWATA

IPC: H01B1/02 ,  C25D3/12 ,  C25D3/38 ,  C25D3/30 ,  C22F1/08 ,  C25D5/50 ,  C25D7/00 ,  C22F1/16 ,  C22F1/10 ,  B32B15/01 ,  C25D5/12

CPC classification number: H01B1/026 ,  B21D53/00 ,  B32B15/018 ,  C22F1/08 ,  C22F1/10 ,  C22F1/16 ,  C25D3/12 ,  C25D3/30 ,  C25D3/38 ,  C25D5/12 ,  C25D5/34 ,  C25D5/50 ,  C25D5/505 ,  C25D7/00 ,  H01H1/025 ,  H01H1/04

Abstract: An electrical contact material (10) having: a conductive substrate (1) formed from copper or a copper alloy; a first intermediate layer (2) provided on the conductive substrate (1); a second intermediate layer (3) provided on the first intermediate layer (2); and an outermost layer (4) formed from tin or a tin alloy and provided on the second intermediate layer (3), wherein the first intermediate layer (2) is constructed as one layer of grains extending from the conductive substrate (1) side to the second intermediate layer (3) side, and wherein, in the first intermediate layer (2), the density of grain boundaries (5b) extending in a direction in which the angle formed by the grain boundary in interest and the interface between the conductive substrate and the first intermediate layer is 45° or greater, is 4 μm/μm2 or less; a method of producing the same; and a terminal.

Abstract translation: 1.一种电接触材料（10），具有：由铜或铜合金形成的导电性基体（1） 设置在所述导电基板（1）上的第一中间层（2）; 设置在第一中间层（2）上的第二中间层（3） 以及由锡或锡合金形成并设置在第二中间层（3）上的最外层（4），其中第一中间层（2）被构造为从导电基板（1）侧延伸到一层晶粒 第二中间层（3）侧，并且其中在第一中间层（2）中，沿着由感兴趣的晶界形成的角度和导电性界面之间的界面延伸的晶界（5b）的密度 基板和第一中间层为45°以上，为4μm/μm2以下; 其制造方法; 和一个终端。

公开(公告)号：US20210130968A1

公开(公告)日：2021-05-06

申请号：US16473763

申请日：2017-12-26

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Miho YAMAUCHI ,  Yoshiaki KOBAYASHI

IPC: C25D3/12 ,  C25D3/38 ,  C25D5/12

Abstract: The surface-treated material (10) according to the present invention is a surface-treated material including an electroconductive substrate (1) and a surface treatment coating film (2) including at least one metal layer formed above the electroconductive substrate (1), wherein a lowermost metal layer (21), as a metal layer included in the at least one metal layer and formed above the electroconductive substrate (1), is made of nickel, nickel alloy, cobalt, cobalt alloy, copper, or copper alloy, the surface-treated material includes an intervening layer (3) between the electroconductive substrate (1) and the surface treatment coating film (2), the intervening layer (3) containing a metal component of the electroconductive substrate (1), a metal component of the surface treatment coating film (2), and an oxygen component, and the mean thickness of the intervening layer (3) is in the range of 1.00 nm or larger and 40 nm or smaller as measured in the vertical cross-section of the surface-treated material.

公开(公告)号：US20190337268A1

公开(公告)日：2019-11-07

申请号：US16473924

申请日：2017-12-26

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Yoshiaki KOBAYASHI ,  Miho YAMAUCHI

IPC: B32B15/01 ,  C25D5/12 ,  C25D5/44 ,  C25D7/00 ,  H01R13/03

Abstract: The present invention provides: a surface-treated material that can simply and in a short time period form a surface treatment film having an adequate adhesiveness particularly on an electroconductive substrate which is mainly formed of a base metal having a large ionization tendency and is considered to resist having a sound plating film formed thereon; and a component produced by using the same.A surface-treated material (10) of the present invention comprises an electroconductive substrate (1) and a surface treatment film (2) formed of at least one or more layers of metal layers (3 and 4) which are formed on the electroconductive substrate (1), and among the at least one or more layers of metal layers (3 and 4), a lowermost metal layer (3) which is directly formed on the electroconductive substrate (1) comprises a plurality of metal-buried portions (3a) that are scattered in the electroconductive substrate (1) and continuously extend from a surface of the electroconductive substrate (1) toward an inside thereof.

公开(公告)号：US20190323136A1

公开(公告)日：2019-10-24

申请号：US16473822

申请日：2017-12-26

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Yoshiaki KOBAYASHI ,  Miho YAMAUCHI

IPC: C25D7/00 ,  H01B1/02 ,  C25D5/12 ,  C25D5/44 ,  C25D3/12 ,  C25D3/38

Abstract: A surface-treated material (10) according to the present invention comprises an electroconductive substrate (1) and a surface treatment film (2) formed of at least one or more layers of metal layers (3 and 4) which are formed on the electroconductive substrate (1), wherein among the at least one or more layers of metal layers (3 and 4), the lowermost metal layer (3) which is directly formed on the electroconductive substrate (1) comprises a plurality of metal-buried portions (3a) that are scattered in the electroconductive substrate (1), branch from a surface of the electroconductive substrate (1) and widely extend toward the inside thereof, and as a vertical cross section of the surface-treated material (10) is viewed, in which at least one of the metal-buried portions (3a) exists in the electroconductive substrate (1), an average value of an area ratio of the metal-buried portion (3a) occupying the predetermined observation region of the electroconductive substrate (1) is in a range of 5% or more and 50% or less.

公开(公告)号：US20190169764A1

公开(公告)日：2019-06-06

申请号：US16206141

申请日：2018-11-30

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Miho YAMAUCHI ,  Shuichi KITAGAWA ,  Yoshiaki KOBAYASHI

IPC: C25D5/44 ,  C25D3/12

Abstract: A surface-treated material of the present disclosure has a conductive substrate, and a surface treatment film which includes at least one layer of metal layers and is formed on the conductive substrate. The surface treatment film is a plating film. The surface treatment film is formed on a whole surface or a part of the conductive substrate through a zinc-containing layer that contains zinc as a main component and has a thickness of 50 nm or less, or is formed on the conductive substrate without through the zinc-containing layer. The surface-treated material has a ratio of a contact area to a test area of 85% or more as measured according to a tape test method defined in JIS H 8504: 1999.