OPTICAL FIBER FIXING STRUCTURE
    1.
    发明申请

    公开(公告)号:US20170139161A1

    公开(公告)日:2017-05-18

    申请号:US15416619

    申请日:2017-01-26

    Abstract: An optical fiber fixing structure includes: a cylindrical member; an optical fiber inserted into a hole of the cylindrical member; and a fixing material configured to fix the cylindrical member and the optical fiber, wherein the optical fiber is a polarization maintaining optical fiber having a polarization axis, and a center of the optical fiber is arranged so as to be eccentric to a center of the hole, and an angle formed by an eccentric direction connecting the center of the hole and the center of the optical fiber and the polarization axis is −22.5° to 22.5°, or 67.5° to 112.5°.

    SEMICONDUCTOR LASER MODULE
    2.
    发明申请

    公开(公告)号:US20180138657A1

    公开(公告)日:2018-05-17

    申请号:US15867833

    申请日:2018-01-11

    Abstract: A semiconductor laser module includes a semiconductor laser that outputs laser light; an optical fiber that guides the laser light; a lens that couples the laser light, which is output from the semiconductor laser, with the optical fiber; a base that is substantially tabular in shape and that has the semiconductor laser, the optical fiber, and the lens fixed thereon either directly or indirectly; and a housing which houses the base and fixes the base either directly or indirectly. Among faces of the base, a face on a side that is fixed either directly or indirectly to the housing includes a junction plane that is joined to the housing either directly or indirectly, and a detachment plane that is detached to remain unfixed from the housing.

    SEMICONDUCTOR LASER MODULE
    3.
    发明申请
    SEMICONDUCTOR LASER MODULE 有权
    半导体激光模块

    公开(公告)号:US20150131692A1

    公开(公告)日:2015-05-14

    申请号:US14535357

    申请日:2014-11-07

    Abstract: A semiconductor laser module 1 is mainly composed of a package 3, a semiconductor laser 5, lenses 7, 9, 13, reflecting mirrors 11, an optical fiber 15, and the like. The package 3 is composed of a bottom part and side surfaces 19a, 19b. The side surfaces 19a, 19b stand erect approximately vertical to the bottom part of the package. In the semiconductor laser module 1, a plurality of semiconductor laser installation surfaces 17 are formed in a step-like shape. On each semiconductor laser installation surface 17, a semiconductor laser 5 is installed. A lens 7 is arranged at the anterior (in the emission direction) of the semiconductor laser 5. Moreover, a lens 9 is arranged further to the anterior. A reflecting mirror 11 is fixed to the side surface 19a, which is provided facing the emission direction of the semiconductor laser 5.

    Abstract translation: 半导体激光器模块1主要由封装3,半导体激光器5,透镜7,9,13,反射镜11,光纤15等组成。 包装3由底部和侧面19a,19b构成。 侧表面19a,19b竖直地直立于包装的底部。 在半导体激光器模块1中,形成阶梯状的多个半导体激光器安装面17。 在每个半导体激光器安装表面17上安装半导体激光器5。 透镜7配置在半导体激光器5的前方(发光方向)。此外,透镜9配置在前方。 反射镜11固定在与半导体激光器5的发射方向相对的侧面19a上。

    LASER APPARATUS
    4.
    发明申请
    LASER APPARATUS 审中-公开

    公开(公告)号:US20190020178A1

    公开(公告)日:2019-01-17

    申请号:US16054462

    申请日:2018-08-03

    Abstract: A laser apparatus includes light source elements outputting laser beams; a wavelength-selecting element disposed in an optical path of each of the laser beams and configured to cause light in a predetermined wavelength band to selectively transmit therethrough; and a partially transmissive-reflector that receives the light transmitted through the wavelength-selecting element, reflects a part of the input light toward the wavelength-selecting element, and causes its remainder to transmit therethrough. The wavelength-selecting element causes a part of the respective laser beams output from the respective light source elements to selectively transmit therethrough, the partially transmissive-reflector reflects a part of the respective transmitted laser beams, and the wavelength-selecting element causes a part of the respective reflected laser beams to transmit to return to the light source elements, and each of the light source elements preferentially oscillates at a wavelength of the laser beam that transmits through the wavelength-selecting element.

    SEMICONDUCTOR LASER MODULE
    5.
    发明申请
    SEMICONDUCTOR LASER MODULE 有权
    半导体激光模块

    公开(公告)号:US20160246022A1

    公开(公告)日:2016-08-25

    申请号:US15062744

    申请日:2016-03-07

    Abstract: A semiconductor laser module includes a semiconductor laser element outputting a laser light; an optical fiber; an optical component disposed at an outer periphery of the optical fiber and fixing the optical fiber; a first-fixing agent fastening the optical component and the optical fiber; a light-absorbing element disposed at an outer periphery of the optical component and fixing the optical component; a first light-blocking portion disposed between an end into which the laser light is incident of the optical fiber and the optical component; and a housing accommodating therein the semiconductor laser element, an end into which the laser light is incident of the optical fiber and the first light-blocking portion. The optical component has an optical transmittance at a wavelength of the laser light, and the light-absorbing element has an optical absorptivity at a wavelength of the laser light.

    Abstract translation: 半导体激光器模块包括输出激光的半导体激光元件; 光纤; 光学部件,设置在所述光纤的外周并固定所述光纤; 固定光学部件和光纤的第一固定剂; 光吸收元件,设置在所述光学部件的外周并固定所述光学部件; 第一遮光部,设置在激光入射到所述光纤的端部与所述光学部件之间; 以及容纳所述半导体激光元件的壳体,所述激光入射到所述光纤和所述第一遮光部的端部。 光学部件在激光的波长处具有光透射率,并且光吸收元件在激光的波长处具有光吸收率。

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