公开(公告)号：US08363400B2

公开(公告)日：2013-01-29

申请号：US12982268

申请日：2010-12-30

申请人： Feng-Ku Wang ,  Chih-Kai Yang

发明人： Feng-Ku Wang ,  Chih-Kai Yang

IPC分类号： H05K7/20

CPC分类号： G06F1/203 ,  H01L23/467 ,  H01L2924/0002 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/4914 ,  Y10T29/4935 ,  Y10T29/49359 ,  Y10T29/49377 ,  H01L2924/00

摘要： An electronic device is provided. The electronic device includes a mechanism, a circuit module and a fixing element. The circuit module is disposed inside the mechanism. The circuit module includes a circuit board and a fan. The circuit board has at least one edge and a fixing hole. The fan has a first lateral side and a second lateral side. The first lateral side has a first hook buckled on the edge. The second lateral side has at least one screwed board, wherein the screwed board has a screwed hole. The fixing element is screwed on the screwed hole and the fixing hole to screw the fan on the circuit board.

摘要翻译： 提供电子设备。 电子设备包括机构，电路模块和固定元件。 电路模块设置在机构内部。 电路模块包括电路板和风扇。 电路板具有至少一个边缘和固定孔。 风扇具有第一横向侧和第二横向侧。 第一侧面具有在边缘上弯曲的第一钩。 第二侧面具有至少一个螺纹板，其中所述螺纹板具有螺纹孔。 固定元件拧在螺纹孔和固定孔上，将风扇拧到电路板上。

公开(公告)号：US07436673B2

公开(公告)日：2008-10-14

申请号：US11606001

申请日：2006-11-30

申请人： Feng-Ku Wang ,  Yi-Lun Cheng ,  Jui-Chan Fan ,  Chun-Yi Chang ,  Chun-Lung Lin ,  Chih-Kai Yang

发明人： Feng-Ku Wang ,  Yi-Lun Cheng ,  Jui-Chan Fan ,  Chun-Yi Chang ,  Chun-Lung Lin ,  Chih-Kai Yang

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

CPC分类号： G06F1/20 ,  H01L23/4006 ,  H01L23/427 ,  H01L2023/4056 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/00

摘要： A fixing structure of heat conduction pad is used to uniformly press two heat conduction pads on the two heat generating electronic components on a circuit board respectively. The fixing structure includes a fixing member and an elastic member. The two ends of the elastic member are a fastening portion and a fixing portion respectively. The middle part of the elastic member is a pressing portion. In addition, a suspension arm is extended from the fixing portion. When the fastening portion is to be fasten on the circuit board and the fixing portion is to be fixed on the circuit board by the fixing member, the pressing portion presses one of the heat conduction pad on one of the heat generating electronic component, and the suspension arm presses the other heat conduction pad on the other heat generating electronic component.

摘要翻译： 热传导垫的固定结构分别用于均匀地按压电路板上的两个发热电子元件上的两个导热垫。 固定结构包括固定构件和弹性构件。 弹性构件的两端分别是紧固部和固定部。 弹性构件的中部是按压部。 此外，悬架臂从固定部分延伸。 当紧固部分紧固在电路板上并且固定部分通过固定部件固定在电路板上时，按压部分按压发热电子部件之一的导热焊盘中的一个， 悬挂臂按压另一个发热电子部件上的另一个导热垫。

公开(公告)号：US20080198550A1

公开(公告)日：2008-08-21

申请号：US11707511

申请日：2007-02-16

申请人： Feng-Ku Wang ,  Chih-Kai Yang ,  Huang-Cheng Ke

发明人： Feng-Ku Wang ,  Chih-Kai Yang ,  Huang-Cheng Ke

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heatsink module for dual heat sources for dissipating heat generated by a first and a second heat-generating element disposed on a circuit board is provided. The heatsink module includes a first heat-conducting plate, a second heat-conducting plate, a fixing member, a heat pipe, and a pressing flat spring. The first and second heat-conducting plates contact the first and second heat-generating elements respectively. The fixing member when fixed to the circuit board presses the second heat-conducting plate against the second heat-generating element. One end of the pressing flat spring is under the traction of the fixing member fixed to the circuit board, and presses the first heat-conducting plate against the first heat-generating element. The fixing member and the first heat-conducting plate then clamp the heat pipe, so as to conduct the heat generated by the first and second heat-generating elements to the heat pipe via the connecting elements.

摘要翻译： 提供了用于散发由设置在电路板上的第一和第二发热元件产生的热量的双重热源的散热器模块。 散热模块包括第一导热板，第二导热板，固定构件，热管和按压板簧。 第一和第二导热板分别接触第一和第二发热元件。 固定构件固定在电路板上时，将第二导热板压在第二发热元件上。 按压平板弹簧的一端处于固定于电路板的固定部件的牵引下，并将第一导热板压在第一发热元件上。 固定构件和第一导热板然后夹紧热管，以便经由连接元件将由第一和第二发热元件产生的热量传导到热管。

公开(公告)号：US20070243345A1

公开(公告)日：2007-10-18

申请号：US11401875

申请日：2006-04-12

申请人： Feng-Ku Wang ,  Yi-Lun Cheng ,  Chun-Yi Chang ,  Jui-Chan Fan ,  Chun-Lung Lin ,  Chih-Kai Yang

发明人： Feng-Ku Wang ,  Yi-Lun Cheng ,  Chun-Yi Chang ,  Jui-Chan Fan ,  Chun-Lung Lin ,  Chih-Kai Yang

IPC分类号： B32B3/04 ,  B31B45/00 ,  B32B7/12 ,  B32B3/10

CPC分类号： H01L23/34 ,  H01L2924/0002 ,  Y10T428/13 ,  Y10T428/24215 ,  Y10T428/24273 ,  Y10T428/28 ,  H01L2924/00

摘要： A folding protective cover structure is used to cover and protect a heat-conductive medium disposed on the bottom surface of a heat sink device. An unfoldable plate body is employed and has a hollow portion, a folding portion, and an adhesive area; wherein the hollow portion is used for surrounding the heat-conductive medium with a frame-fixing plate extending from its edge, which is folded towards an opposite direction of the heat-conductive medium, so as to keep an upright state; the folding portion is folded towards the hollow portion, so that the frame-fixing plate passes through the folding portion to clip and fix the folding portion, thus forming an accommodating space for protecting the heat-conductive medium; and the adhesive area is located at the edge of the hollow portion, facing the surface of the heat sink device, for adhering and securing the plate body to the heat sink device.

摘要翻译： 折叠保护盖结构用于覆盖和保护设置在散热装置的底表面上的导热介质。 使用可展开的板体，并具有中空部分，折叠部分和粘合区域; 其中所述中空部分用于围绕所述导热介质，其具有从其边缘延伸的框架固定板，所述框架固定板朝向所述导热介质的相反方向折叠，以保持直立状态; 折叠部分朝向中空部分折叠，使得框架固定板穿过折叠部分以夹紧和固定折叠部分，从而形成用于保护导热介质的容纳空间; 并且粘合剂区域位于中空部分的面对散热装置的表面的边缘，用于将板体粘附并固定到散热装置。

公开(公告)号：US20070236886A1

公开(公告)日：2007-10-11

申请号：US11399453

申请日：2006-04-07

申请人： Chih-Kai Yang ,  Feng-Ku Wang

发明人： Chih-Kai Yang ,  Feng-Ku Wang

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat plate fixing structure is provided, suitable for being used in the heatsink structure of the heating element for an electronic device, which is provided with a support part and a fixing piece, wherein the fixing piece is fixed onto the internal side of the top plate of the support part, pressing against the heat plate, such that the heat plate and the heating element are tightly attached to each other, thereby achieving good heat conductive integration.

摘要翻译： 提供一种热板固定结构，适合用于电子设备用加热元件的散热结构，该散热结构设置有支撑部和固定片，其中固定片固定在顶部的内侧 支撑部分的板，压靠加热板，使得加热板和加热元件彼此紧密地附接，从而实现良好的导热一体化。

公开(公告)号：US07589969B2

公开(公告)日：2009-09-15

申请号：US11401875

申请日：2006-04-12

申请人： Feng-Ku Wang ,  Yi-Lun Cheng ,  Chun-Yi Chang ,  Jui-Chan Fan ,  Chun-Lung Lin ,  Chih-Kai Yang

发明人： Feng-Ku Wang ,  Yi-Lun Cheng ,  Chun-Yi Chang ,  Jui-Chan Fan ,  Chun-Lung Lin ,  Chih-Kai Yang

IPC分类号： H05K7/20

CPC分类号： H01L23/34 ,  H01L2924/0002 ,  Y10T428/13 ,  Y10T428/24215 ,  Y10T428/24273 ,  Y10T428/28 ,  H01L2924/00

摘要： A folding protective cover structure is used to cover and protect a heat-conductive medium disposed on the bottom surface of a heat sink device. An unfoldable plate body is employed and has a hollow portion, a folding portion, and an adhesive area; wherein the hollow portion is used for surrounding the heat-conductive medium with a frame-fixing plate extending from its edge, which is folded towards an opposite direction of the heat-conductive medium, so as to keep an upright state; the folding portion is folded towards the hollow portion, so that the frame-fixing plate passes through the folding portion to clip and fix the folding portion, thus forming an accommodating space for protecting the heat-conductive medium; and the adhesive area is located at the edge of the hollow portion, facing the surface of the heat sink device, for adhering and securing the plate body to the heat sink device.

摘要翻译： 折叠保护盖结构用于覆盖和保护设置在散热装置的底表面上的导热介质。 使用可展开的板体，并具有中空部分，折叠部分和粘合区域; 其中所述中空部分用于围绕所述导热介质，其具有从其边缘延伸的框架固定板，所述框架固定板朝向所述导热介质的相反方向折叠，以保持直立状态; 折叠部分朝向中空部分折叠，使得框架固定板穿过折叠部分以夹紧和固定折叠部分，从而形成用于保护导热介质的容纳空间; 并且粘合剂区域位于中空部分的面对散热装置的表面的边缘，用于将板体粘附并固定到散热装置。

公开(公告)号：US20090034196A1

公开(公告)日：2009-02-05

申请号：US11850480

申请日：2007-09-05

申请人： Feng-Ku Wang ,  Chih-Kai Yang

发明人： Feng-Ku Wang ,  Chih-Kai Yang

IPC分类号： H05K7/20

CPC分类号： G06F1/203 ,  F28D15/0266 ,  F28F1/24 ,  H01L23/3672 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat-dissipating module adapted for cooling a heat-generating element is provided. The heat-dissipating module includes a fin module, a fan and a heat pipe. The fan is adapted for generating an air current. The fin module includes a plurality of first fins and a plurality of second fins. Each first fin includes a first edge facing the fan. The first edges are located on a first surface. Each second fin includes a second edge facing the fan. The second edges are located on a second surface not coinciding with the first surface. The air current passes through the first surface and the second surface and then passes by the first fins and the second fins. The heat pipe includes a first end thermally coupled to the heat-generating element, and a second end thermally coupled to the first fins and the second fins.

摘要翻译： 提供了一种用于冷却发热元件的散热模块。 散热模块包括翅片模块，风扇和热管。 该风扇适于产生气流。 翅片模块包括多个第一散热片和多个第二散热片。 每个第一翅片包括面向风扇的第一边缘。 第一边缘位于第一表面上。 每个第二鳍片包括面向风扇的第二边缘。 第二边缘位于不与第一表面重合的第二表面上。 气流通过第一表面和第二表面，然后通过第一散热片和第二散热片。 热管包括热耦合到发热元件的第一端和与第一散热片和第二散热片热耦合的第二端。

公开(公告)号：US07457119B2

公开(公告)日：2008-11-25

申请号：US11703704

申请日：2007-02-08

申请人： Feng-Ku Wang ,  Chih-Kai Yang ,  Yu-Chih Cheng

发明人： Feng-Ku Wang ,  Chih-Kai Yang ,  Yu-Chih Cheng

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： H01L23/467 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heatsink module used for dissipating heat generated by a heat generating component is provided. The heatsink module includes a heat pipe, a heatsink fin assembly, a fan blade motor set, a fan shell, and an external cover. The heat pipe conducts the heat generated by the heat generating component to the heatsink fin assembly. The fan blade motor set, disposed in the fan shell and covered by the external cover, operates to generate an airflow passing through the heatsink fin assembly to dissipate the heat on the heatsink fin assembly. The fan shell has a plurality of buckling components, and the external cover has a plurality of matching components disposed at the edge corresponding to the buckling components, such that the buckling components and the matching components are buckled together when the external cover is covered on the fan shell, so as to fast combine the parts.

公开(公告)号：US20080186675A1

公开(公告)日：2008-08-07

申请号：US11702112

申请日：2007-02-05

申请人： Feng-Ku Wang ,  Chih-Kai Yang

发明人： Feng-Ku Wang ,  Chih-Kai Yang

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heatsink apparatus for dissipating heat generated by electronic parts is provided. The heatsink apparatus includes a fan and a heatsink fin. One end of the heatsink fin is adhered to an electronic component, the other end forms a curl portion, and a curl inner surface receives an air flow generated by the fan, so as to quickly dissipate the heat energy of the electronic component.

公开(公告)号：US20070235177A1

公开(公告)日：2007-10-11

申请号：US11399454

申请日：2006-04-07

申请人： Feng-Ku Wang ,  Yi-Lun Cheng ,  Jui-Chan Fan ,  Chun-Yi Chang ,  Chun-Lung Lin ,  Chih-Kai Yang

发明人： Feng-Ku Wang ,  Yi-Lun Cheng ,  Jui-Chan Fan ,  Chun-Yi Chang ,  Chun-Lung Lin ,  Chih-Kai Yang

IPC分类号： H05K7/20

CPC分类号： H01L23/42 ,  F28F2265/00 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat conducting medium protection device is provided. At least one cutout is formed in a sheet, and the sheet is bent to closely engage the cutouts so as to transform the sheet into a three-dimensional shape and form an accommodating space. When the heat conducting medium protection device is covered on a heat sink coated with a heat conducting medium, the accommodating space accommodates the heat conducting medium for holding the heat conducting medium, thereby making it easy to transmit the heat sink coated with a heat conducting medium.

摘要翻译： 提供导热介质保护装置。 至少一个切口形成在片材中，并且片材被弯曲以紧密地接合切口，以便将片材变形为三维形状并形成容纳空间。 当导热介质保护装置覆盖在涂有导热介质的散热片上时，容纳空间容纳用于保持导热介质的导热介质，从而容易地传输涂有导热介质的散热片 。