Process for manufacturing a membrane of semiconductor material integrated in, and electrically insulated from, a substrate
    1.
    发明授权
    Process for manufacturing a membrane of semiconductor material integrated in, and electrically insulated from, a substrate 有权
    用于制造集成在基板中并与其电绝缘的半导体材料的膜的工艺

    公开(公告)号:US07678600B2

    公开(公告)日:2010-03-16

    申请号:US12047830

    申请日:2008-03-13

    IPC分类号: H01L21/00

    CPC分类号: B81C1/00158

    摘要: A process for manufacturing an integrated membrane made of semiconductor material includes the step of forming, in a monolithic body of semiconductor material having a front face, a buried cavity, extending at a distance from the front face and delimiting with the front face a surface region of the monolithic body, the surface region forming a membrane that is suspended above the buried cavity. The process further envisages the step of forming an insulation structure in a surface portion of the monolithic body to electrically insulate the membrane from the monolithic body; and the further and distinct step of setting the insulation structure at a distance from the membrane so that it will be positioned outside the membrane at a non-zero distance of separation.

    摘要翻译: 制造由半导体材料制成的集成膜的方法包括以下步骤:在具有前表面的半导体材料的整体中形成一个与前表面相距一定距离的掩埋腔, 的单体,表面区域形成悬浮在掩埋腔上方的膜。 该方法进一步设想在整体式主体的表面部分形成绝缘结构以将膜与整体式电绝缘的步骤; 以及将绝缘结构设置在离膜一定距离处的进一步和不同的步骤,使得其将以非零分离距离定位在膜的外部。

    CAPACITIVE SEMICONDUCTOR PRESSURE SENSOR
    2.
    发明申请
    CAPACITIVE SEMICONDUCTOR PRESSURE SENSOR 有权
    电容式半导体压力传感器

    公开(公告)号:US20120223402A1

    公开(公告)日:2012-09-06

    申请号:US13446976

    申请日:2012-04-13

    IPC分类号: H01L29/84

    CPC分类号: G01L9/0073 G01L9/0045

    摘要: A capacitive semiconductor pressure sensor, comprising: a bulk region of semiconductor material; a buried cavity overlying a first part of the bulk region; and a membrane suspended above said buried cavity, wherein, said bulk region and said membrane are formed in a monolithic substrate, and in that said monolithic substrate carries structures for transducing the deflection of said membrane into electrical signals, wherein said bulk region and said membrane form electrodes of a capacitive sensing element, and said transducer structures comprise contact structures in electrical contact with said membrane and with said bulk region.

    摘要翻译: 一种电容半导体压力传感器,包括:半导体材料的主体区域; 覆盖大块区域的第一部分的掩埋腔; 以及悬浮在所述掩埋腔上方的膜,其中所述体积区域和所述膜形成在整体式衬底中,并且所述整体式衬底承载用于将所述膜的偏转转换成电信号的结构,其中所述体积区域和所述膜 形成电容感测元件的电极,并且所述换能器结构包括与所述膜电连接并与所述体积区域接触的接触结构。

    Integrated differential pressure sensor and manufacturing process thereof
    4.
    发明授权
    Integrated differential pressure sensor and manufacturing process thereof 有权
    集成差压传感器及其制造工艺

    公开(公告)号:US07763487B2

    公开(公告)日:2010-07-27

    申请号:US11417683

    申请日:2006-05-04

    IPC分类号: H01L21/00 H01L29/84

    CPC分类号: G01L9/0045 G01L13/025

    摘要: A process for manufacturing an integrated differential pressure sensor includes forming, in a monolithic body of semiconductor material having a first face and a second face, a cavity extending at a distance from the first face and delimiting therewith a flexible membrane, forming an access passage in fluid communication with the cavity, and forming, in the flexible membrane, at least one transduction element configured so as to convert a deformation of the flexible membrane into electrical signals. The cavity is formed in a position set at a distance from the second face and delimits, together with the second face, a portion of the monolithic body. In order to form the access passage, the monolithic body is etched so as to form an access trench extending through it.

    摘要翻译: 一种用于制造集成差压传感器的方法,包括在具有第一面和第二面的半导体材料的整体中形成一个与第一面相距一定距离的空腔,并将其限定在柔性膜上,形成入口通道 与空腔流体连通,以及在柔性膜中形成至少一个换能元件,其构造成将柔性膜的变形转换为电信号。 空腔形成在距第二面一定距离处的位置,并与第二面一起界定整体式的一部分。 为了形成进入通道,对整体式主体进行蚀刻以便形成延伸通过其的通道沟槽。

    Integrated differential pressure sensor
    6.
    发明授权
    Integrated differential pressure sensor 有权
    集成差压传感器

    公开(公告)号:US08008738B2

    公开(公告)日:2011-08-30

    申请号:US12826388

    申请日:2010-06-29

    IPC分类号: H01L29/84 G01L9/00

    CPC分类号: G01L9/0045 G01L13/025

    摘要: An integrated differential pressure sensor includes, in a monolithic body of semiconductor material, a first face and a second face, a cavity extending at a distance from the first face and delimited therewith by a flexible membrane formed in part by epitaxial material from the monolithic body and in part by annealed epitaxial material from the monolithic body, an access passage in fluid communication with the cavity, and in the flexible membrane at least one transduction element configured so as to convert a deformation of the flexible membrane into electrical signals. The cavity is formed in a position set at a distance from the second face and is delimited at the second face with a portion of the monolithic body.

    摘要翻译: 集成的差压传感器包括在半导体材料的整体主体中的第一面和第二面,空腔与第一面延伸一定距离,并由其中由通过外延材料部分由整体式形成的柔性膜界定 并且部分地通过来自整体式的退火的外延材料,与空腔流体连通的进入通道,以及柔性膜中的至少一个换能元件,其构造成将柔性膜的变形转换为电信号。 空腔形成在距离第二面一定距离处的位置,并且在第二面处与整体式主体的一部分界定。

    INTEGRATED DIFFERENTIAL PRESSURE SENSOR
    7.
    发明申请
    INTEGRATED DIFFERENTIAL PRESSURE SENSOR 有权
    集成式差压传感器

    公开(公告)号:US20100269595A1

    公开(公告)日:2010-10-28

    申请号:US12826388

    申请日:2010-06-29

    IPC分类号: G01L9/12 G01L9/06

    CPC分类号: G01L9/0045 G01L13/025

    摘要: An integrated differential pressure sensor includes, in a monolithic body of semiconductor material, a first face and a second face, a cavity extending at a distance from the first face and delimited therewith by a flexible membrane formed in part by epitaxial material from the monolithic body and in part by annealed epitaxial material from the monolithic body, an access passage in fluid communication with the cavity, and in the flexible membrane at least one transduction element configured so as to convert a deformation of the flexible membrane into electrical signals. The cavity is formed in a position set at a distance from the second face and is delimited at the second face with a portion of the monolithic body.

    摘要翻译: 集成的差压传感器包括在半导体材料的整体主体中的第一面和第二面,空腔与第一面延伸一定距离,并由其中由通过外延材料部分由整体式形成的柔性膜界定 并且部分地通过来自整体式的退火的外延材料,与空腔流体连通的进入通道,以及柔性膜中的至少一个换能元件,其构造成将柔性膜的变形转换为电信号。 空腔形成在距离第二面一定距离处的位置,并且在第二面处与整体式主体的一部分界定。

    Capacitive semiconductor pressure sensor
    8.
    发明授权
    Capacitive semiconductor pressure sensor 有权
    电容半导体压力传感器

    公开(公告)号:US08575710B2

    公开(公告)日:2013-11-05

    申请号:US13446976

    申请日:2012-04-13

    IPC分类号: H01L29/84

    CPC分类号: G01L9/0073 G01L9/0045

    摘要: A capacitive semiconductor pressure sensor, comprising: a bulk region of semiconductor material; a buried cavity overlying a first part of the bulk region; and a membrane suspended above said buried cavity, wherein, said bulk region and said membrane are formed in a monolithic substrate, and in that said monolithic substrate carries structures for transducing the deflection of said membrane into electrical signals, wherein said bulk region and said membrane form electrodes of a capacitive sensing element, and said transducer structures comprise contact structures in electrical contact with said membrane and with said bulk region.

    摘要翻译: 一种电容半导体压力传感器,包括:半导体材料的主体区域; 覆盖大块区域的第一部分的掩埋腔; 以及悬浮在所述掩埋腔上方的膜,其中所述体积区域和所述膜形成在整体式衬底中,并且所述整体式衬底承载用于将所述膜的偏转转换成电信号的结构,其中所述体积区域和所述膜 形成电容感测元件的电极,并且所述换能器结构包括与所述膜电连接并与所述体积区域接触的接触结构。

    Process for manufacturing a triaxial piezoresistive accelerometer and relative pressure-monitoring device
    9.
    发明授权
    Process for manufacturing a triaxial piezoresistive accelerometer and relative pressure-monitoring device 有权
    制造三轴压阻加速度计和相对压力监测装置的方法

    公开(公告)号:US07322236B2

    公开(公告)日:2008-01-29

    申请号:US11338614

    申请日:2006-01-24

    IPC分类号: G01P15/00

    摘要: A manufacturing process of a semiconductor piezoresistive accelerometer includes the steps of: providing a wafer of semiconductor material; providing a membrane in the wafer over a cavity; rigidly coupling an inertial mass to the membrane; and providing, in the wafer, piezoresistive transduction elements, that are sensitive to strains of the membrane and generate corresponding electrical signals. The step of coupling is carried out by forming the inertial mass on top of a surface of the membrane opposite to the cavity. The accelerometer is advantageously used in a device for monitoring the pressure of a tire of a vehicle.

    摘要翻译: 半导体压阻加速度计的制造方法包括以下步骤:提供半导体材料的晶片; 在晶片上在腔上提供膜; 将惯性质量刚性耦合到膜上; 并且在晶片中提供对膜的应变敏感的压阻转导元件并产生相应的电信号。 通过在与空腔相对的膜的表面的顶部上形成惯性质量来进行耦合的步骤。 加速度计有利地用于监测车辆的轮胎的压力的装置中。

    Process for manufacturing a semiconductor wafer having SOI-insulated wells and semiconductor wafer thereby manufactured
    10.
    发明授权
    Process for manufacturing a semiconductor wafer having SOI-insulated wells and semiconductor wafer thereby manufactured 有权
    制造具有SOI绝缘阱和半导体晶片的半导体晶片的制造方法

    公开(公告)号:US07906406B2

    公开(公告)日:2011-03-15

    申请号:US11879738

    申请日:2007-07-17

    IPC分类号: H01L21/76

    CPC分类号: H01L21/76264 H01L21/7682

    摘要: A process for manufacturing a semiconductor wafer including SOI-insulation wells includes forming, in a die region of a semiconductor body, buried cavities and semiconductor structural elements, which traverse the buried cavities and are distributed in the die region. The process moreover includes the step of oxidizing selectively first adjacent semiconductor structural elements, arranged inside a closed region, and preventing oxidation of second semiconductor structural elements outside the closed region, so as to form a die buried dielectric layer selectively inside the closed region.

    摘要翻译: 制造包括SOI绝缘阱的半导体晶片的工艺包括在半导体主体的管芯区域中形成穿过掩埋腔并分布在管芯区域中的掩埋腔和半导体结构元件。 该方法还包括选择性地将第一相邻的半导体结构元件氧化并设置在封闭区域内的步骤,并且防止第二半导体结构元件在封闭区域外的氧化,从而在闭合区域内选择性地形成管芯埋入介电层。