公开(公告)号：US06902256B2

公开(公告)日：2005-06-07

申请号：US10621018

申请日：2003-07-16

申请人： Frank E. Anderson ,  Byron V. Bell ,  Carl E. Sullivan ,  Paul A Cook ,  Robert W. Cornell ,  George K. Parish

发明人： Frank E. Anderson ,  Byron V. Bell ,  Carl E. Sullivan ,  Paul A Cook ,  Robert W. Cornell ,  George K. Parish

IPC分类号： B41J2/14 ,  B41J2/175 ,  B41J2/05

CPC分类号： B41J2/17556 ,  B41J2/14129 ,  B41J2/17506 ,  B41J2/17513 ,  B41J2202/03 ,  B41J2202/13

摘要： An ink jet printer including a printer cartridge containing a printhead attached to a cartridge carriage for translation of the cartridge across a print media. The printer also includes an off carriage ink supply, a printer microprocessor, and a combined ink fill tube and electrical connection cable connected between the cartridge and the off carriage ink supply for providing refill ink to the ink cartridge and control of the carriage and printhead. Improvements to the printer enable low cost, high quality printing to be achieved.

摘要翻译： 一种喷墨打印机，包括一个打印机墨盒，该打印机墨盒包含一个连接到墨盒托架的打印头，用于使打印墨盒平移印刷介质。 该打印机还包括一个卸载墨盒，一个打印机微处理器以及一个连接在墨盒和卸载墨盒之间的组合墨水填充管和电连接电缆，用于向墨盒提供再填充墨水并控制滑架和打印头。 对打印机的改进使得能够实现低成本，高质量的打印。

公开(公告)号：US07354794B2

公开(公告)日：2008-04-08

申请号：US11062019

申请日：2005-02-18

申请人： Frank E. Anderson ,  Richard E. Corley, Jr. ,  Paul T. Spivey ,  Carl E. Sullivan

发明人： Frank E. Anderson ,  Richard E. Corley, Jr. ,  Paul T. Spivey ,  Carl E. Sullivan

IPC分类号： H01L21/00

CPC分类号： B41J2/14072 ,  H01L2224/48091 ,  H01L2224/73265 ,  Y10T29/49401 ,  H01L2924/00014

摘要： Methods of connecting a circuit device to a semiconductor substrate and micro-fluid ejection devices made by the methods. One method includes printing an elongate strip of an electrically conductive fluid to electrically interconnect a first contact pad on a semiconductor substrate containing fluid ejection actuator devices with a second contact pad on an electrical trace circuit, wherein the electrical trace circuit is disposed adjacent to and spaced-apart from the semiconductor substrate. The electrically conductive fluid contains a liquid component and a conductive particle component. The liquid component is removed from the conductive particle component to provide a solid elongate strip of conductive material interconnecting the first contact pad and the second contact pad.

摘要翻译： 将电路装置与半导体基板连接的方法和由该方法制成的微流体喷射装置。 一种方法包括印刷导电流体的细长条以将包含流体喷射致动器装置的半导体衬底上的第一接触焊盘与电迹线电路上的第二接触焊盘电互连，其中电迹线电路邻近并间隔开 从半导体衬底放置。 导电流体包含液体组分和导电颗粒组分。 将液体组分从导电颗粒组分移除以提供将第一接触垫和第二接触垫相互连接的导电材料的实心细长带。