公开(公告)号：US20080315214A1

公开(公告)日：2008-12-25

申请号：US11765291

申请日：2007-06-19

申请人： Franklin Wall, JR. ,  Peter Stormberg ,  Jeffrey Kmetec ,  Mina Farr ,  Li Zhang

发明人： Franklin Wall, JR. ,  Peter Stormberg ,  Jeffrey Kmetec ,  Mina Farr ,  Li Zhang

IPC分类号： H01L33/00

CPC分类号： H01L33/642 ,  H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H05K3/308 ,  H01L2924/00

摘要： Standard solderless connectors extend from a molded package body supporting at least one high power LED. The package includes a relatively large metal slug extending completely through the package. The LED is mounted over the top surface of the metal slug with an electrically insulating ceramic submount in-between the LED and metal slug. Electrodes on the submount are connected to the package connectors. Solderless clamping means, such as screw openings, are provided on the package for firmly clamping the package on a thermally conductive mounting board. The slug in the package thermally contacts the board to sink heat away from the LED. Fiducial structures (e,g., holes) in the package precisely position the package on corresponding fiducial structures on the board. Other packages are described that do not use a molded body.

摘要翻译： 标准无焊接连接器从支持至少一个大功率LED的模制封装体延伸。 该包装包括完全延伸穿过包装的相对较大的金属块。 LED被安装在金属片的顶表面上，其中一个电绝缘的陶瓷基座位于LED和金属片之间。 底座上的电极连接到包装连接器。 无包装夹紧装置，例如螺丝孔，用于将包装牢固地夹在导热安装板上。 包装中的塞子热接触板以将热量从LED吸收。 包装中的基准结构（例如，孔）将包装精确地定位在板上对应的基准结构上。 描述了不使用成型体的其他包装。