公开(公告)号：US20110049545A1

公开(公告)日：2011-03-03

申请号：US12552328

申请日：2009-09-02

申请人： Grigoriy Basin ,  Jeffrey Kmetec ,  Paul S. Martin

发明人： Grigoriy Basin ,  Jeffrey Kmetec ,  Paul S. Martin

IPC分类号： H01L33/00

CPC分类号： H01L24/97 ,  H01L33/005 ,  H01L33/46 ,  H01L33/486 ,  H01L33/505 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/73204 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00

摘要： After flip chip LEDs are mounted on a submount wafer and their growth substrates removed, a phosphor plate is affixed to the exposed top surface of each LED. A reflective material, such as silicone containing at least 5% TiO2 powder, by weight, is then spun over or molded over the wafer to cover the phosphor plates and the sides of the LEDs. The top surface of the reflective material is then etched using microbead blasting to expose the top of the phosphor plates and create a substantially planar reflective layer over the wafer surface. Lenses may then be formed over the LEDs. The wafer is then singulated. The reflective material reflects all side light back into the LED and phosphor plate so that virtually all light exits the top of the phosphor plate to improve the light emission characteristics.

摘要翻译： 在将倒装芯片LED安装在底座晶片上并且移除其生长衬底之后，将磷光体板固定到每个LED的暴露的顶表面。 然后将反射材料，例如含有至少5重量％TiO 2的硅氧烷的硅酮在晶片上旋转或模制，以覆盖荧光体板和LED的侧面。 然后使用微珠喷射来蚀刻反射材料的顶表面以暴露荧光体板的顶部并在晶片表面上形成基本上平面的反射层。 然后可以在LED上形成透镜。 然后将晶片切片。 反射材料将所有侧光反射回LED和磷光体板，使得几乎所有的光离开荧光体板的顶部以改善发光特性。

公开(公告)号：US20130248913A1

公开(公告)日：2013-09-26

申请号：US13878782

申请日：2011-10-07

申请人： Brendan Moran ,  Jeffrey Kmetec ,  Iain Black ,  Frederic Diana ,  Serge Laurent Rudaz ,  Li Zhang

发明人： Brendan Moran ,  Jeffrey Kmetec ,  Iain Black ,  Frederic Diana ,  Serge Laurent Rudaz ,  Li Zhang

IPC分类号： H01L33/60 ,  H01L33/50

CPC分类号： H01L33/60 ,  H01L33/50 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01L2924/00

摘要： A submount for a light emitting stack includes a substrate and a metallization layer having circuit traces and a planar dielectric layer that fills regions between the circuit traces. The planar dielectric layer serves to minimize the amount of light lost/absorbed by the substrate and preferably reflects the internally reflected light back toward the desired light output element. To facilitate efficient manufacture, a dielectric paste is applied over the metallized layer, then planed to expose at least portions of the metal conductors for the subsequent coupling to the light emitting stack. Pedestal elements are preferably provided at select locations on the circuit traces to facilitate this coupling while allowing the remainder of the circuit traces to be covered with the dielectric layer.

摘要翻译： 用于发光堆叠的基座包括衬底和具有电路迹线的金属化层和填充电路迹线之间的区域的平面介电层。 平面介电层用于使由衬底损失/吸收的光的量最小化，并且优选地将内部反射的光反射回所需的光输出元件。 为了促进有效的制造，将电介质浆料施加在金属化层上，然后设计成露出至少部分金属导体，以便随后与发光堆叠耦合。 优选地，在电路迹线上的选择位置设置基座元件以促进该耦合，同时允许电路迹线的其余部分被电介质层覆盖。

公开(公告)号：US07638814B2

公开(公告)日：2009-12-29

申请号：US11765291

申请日：2007-06-19

申请人： Franklin Wall, Jr. ,  Peter Stormberg ,  Jeffrey Kmetec ,  Mina Farr ,  Li Zhang

发明人： Franklin Wall, Jr. ,  Peter Stormberg ,  Jeffrey Kmetec ,  Mina Farr ,  Li Zhang

IPC分类号： H01L23/34

CPC分类号： H01L33/642 ,  H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H05K3/308 ,  H01L2924/00

摘要： Standard solderless connectors extend from a molded package body supporting at least one high power LED. The package includes a relatively large metal slug extending completely through the package. The LED is mounted over the top surface of the metal slug with an electrically insulating ceramic submount in-between the LED and metal slug. Electrodes on the submount are connected to the package connectors. Solderless clamping means, such as screw openings, are provided on the package for firmly clamping the package on a thermally conductive mounting board. The slug in the package thermally contacts the board to sink heat away from the LED. Fiducial structures (e,g., holes) in the package precisely position the package on corresponding fiducial structures on the board. Other packages are described that do not use a molded body.

摘要翻译： 标准无焊接连接器从支持至少一个大功率LED的模制封装体延伸。 该包装包括完全延伸穿过包装的相对较大的金属块。 LED被安装在金属片的顶表面上，其中一个电绝缘的陶瓷基座位于LED和金属片之间。 底座上的电极连接到包装连接器。 无包装夹紧装置，例如螺丝孔，用于将包装牢固地夹在导热安装板上。 包装中的塞子热接触板以将热量从LED吸收。 包装中的基准结构（例如，孔）将包装精确地定位在板上对应的基准结构上。 描述了不使用成型体的其他包装。

公开(公告)号：US09040332B2

公开(公告)日：2015-05-26

申请号：US13878782

申请日：2011-10-07

申请人： Brendan Moran ,  Jeffrey Kmetec ,  Iain Black ,  Frederic Diana ,  Serge Laurent Rudaz ,  Li Zhang

发明人： Brendan Moran ,  Jeffrey Kmetec ,  Iain Black ,  Frederic Diana ,  Serge Laurent Rudaz ,  Li Zhang

IPC分类号： H01L33/08 ,  H01L33/60 ,  H01L33/50 ,  H01L33/62

CPC分类号： H01L33/60 ,  H01L33/50 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01L2924/00

摘要： A submount for a light emitting stack includes a substrate and a metallization layer having circuit traces and a planar dielectric layer that fills regions between the circuit traces. The planar dielectric layer serves to minimize the amount of light lost/absorbed by the substrate and preferably reflects the internally reflected light back toward the desired light output element. To facilitate efficient manufacture, a dielectric paste is applied over the metallized layer, then planed to expose at least portions of the metal conductors for the subsequent coupling to the light emitting stack. Pedestal elements are preferably provided at select locations on the circuit traces to facilitate this coupling while allowing the remainder of the circuit traces to be covered with the dielectric layer.

摘要翻译： 用于发光堆叠的基座包括衬底和具有电路迹线的金属化层和填充电路迹线之间的区域的平面介电层。 平面介电层用于使由衬底损失/吸收的光的量最小化，并且优选地将内部反射的光反射回所需的光输出元件。 为了促进有效的制造，将电介质浆料施加在金属化层上，然后设计成露出至少部分金属导体，以便随后与发光堆叠耦合。 优选地，在电路迹线上的选择位置设置基座元件以促进该耦合，同时允许电路迹线的其余部分被电介质层覆盖。

公开(公告)号：US20080315214A1

公开(公告)日：2008-12-25

申请号：US11765291

申请日：2007-06-19

申请人： Franklin Wall, JR. ,  Peter Stormberg ,  Jeffrey Kmetec ,  Mina Farr ,  Li Zhang

发明人： Franklin Wall, JR. ,  Peter Stormberg ,  Jeffrey Kmetec ,  Mina Farr ,  Li Zhang

IPC分类号： H01L33/00

CPC分类号： H01L33/642 ,  H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H05K3/308 ,  H01L2924/00

摘要： Standard solderless connectors extend from a molded package body supporting at least one high power LED. The package includes a relatively large metal slug extending completely through the package. The LED is mounted over the top surface of the metal slug with an electrically insulating ceramic submount in-between the LED and metal slug. Electrodes on the submount are connected to the package connectors. Solderless clamping means, such as screw openings, are provided on the package for firmly clamping the package on a thermally conductive mounting board. The slug in the package thermally contacts the board to sink heat away from the LED. Fiducial structures (e,g., holes) in the package precisely position the package on corresponding fiducial structures on the board. Other packages are described that do not use a molded body.

摘要翻译： 标准无焊接连接器从支持至少一个大功率LED的模制封装体延伸。 该包装包括完全延伸穿过包装的相对较大的金属块。 LED被安装在金属片的顶表面上，其中一个电绝缘的陶瓷基座位于LED和金属片之间。 底座上的电极连接到包装连接器。 无包装夹紧装置，例如螺丝孔，用于将包装牢固地夹在导热安装板上。 包装中的塞子热接触板以将热量从LED吸收。 包装中的基准结构（例如，孔）将包装精确地定位在板上对应的基准结构上。 描述了不使用成型体的其他包装。