Process for electroplating tin, lead and tin-lead alloys and baths
therefor
    1.
    发明授权
    Process for electroplating tin, lead and tin-lead alloys and baths therefor 失效
    用于电镀锡,铅和锡铅合金及其浴的工艺

    公开(公告)号:US4599149A

    公开(公告)日:1986-07-08

    申请号:US564516

    申请日:1983-12-22

    摘要: This invention relates to the electrodeposition of tin, lead and particularly tin-lead alloys from an electroplating bath comprising a lead and/or tin alkylsulfonate, and alkylsulfonic acid in a sufficient amount to impart a pH below about 3 to the bath, and various additives to improve the brightness of the deposits, the useful current density ranges, and/or the solderability of tin-lead alloy deposits including quaternary nitrogen wetting agents containing a fatty acid radical, alkylene oxides, pyridine compounds, aromatic aldehydes, acetaldehyde and/or a bismuth compound. The bath is formulated to have a cloud point above about 90.degree. F.

    摘要翻译: 本发明涉及从包含铅和/或锡烷基磺酸铅的电镀浴和足够量的烷基磺酸将锡,铅和特别是锡铅合金电沉积以使pH低于约3的pH,以及各种添加剂 改善沉积物的亮度,有用的电流密度范围和/或锡 - 铅合金沉积物的可焊性,包括含有脂肪酸基团,环氧烷烃,吡啶化合物,芳族醛,乙醛和/或 铋化合物。 该浴被配制成具有高于约90°F的浊点。

    Bath and process for plating tin, lead and tin-lead alloys
    2.
    发明授权
    Bath and process for plating tin, lead and tin-lead alloys 失效
    镀锡,铅和锡铅合金的浴和工艺

    公开(公告)号:US4565609A

    公开(公告)日:1986-01-21

    申请号:US723595

    申请日:1985-04-15

    摘要: This invention relates to the electrodeposition of tin, lead and particularly tin-lead alloys from an electroplating bath comprising a lead and/or tin alkylsulfonate, an alkylsulfonic acid in a sufficient amount to impart a pH below about 3 to the bath, and various additives to improve the brightness of the deposits, the useful current density ranges, and/or the solderability of tin-lead alloy deposits including quaternary nitrogen wetting agents containing a fatty acid radical, alkylene oxides, pyridine compounds, aromatic aldehydes, acetaldehyde and/or a bismuth compound.

    摘要翻译: 本发明涉及从包含铅和/或烷基磺酸锡的电镀浴中的锡,铅和特别是锡铅合金的电沉积,足以使pH低于约3的烷基磺酸,以及各种添加剂 改善沉积物的亮度,有用的电流密度范围和/或锡 - 铅合金沉积物的可焊性,包括含有脂肪酸基团,环氧烷烃,吡啶化合物,芳族醛,乙醛和/或 铋化合物。

    Bath and process for plating lead and lead/tin alloys
    3.
    发明授权
    Bath and process for plating lead and lead/tin alloys 失效
    镀铅和铅/锡合金的镀浴和工艺

    公开(公告)号:US4565610A

    公开(公告)日:1986-01-21

    申请号:US723597

    申请日:1985-04-15

    摘要: This invention relates to the electrodeposition of tin, lead and particularly tin-lead alloys from an electroplating bath comprising a lead and/or tin alkylsulfonate, an alkylsulfonic acid in a sufficient amount to impart a pH below about 3 to the bath, and various additives to improve the brightness of the deposits, the useful current density ranges, and/or the solderability of tin-lead alloy deposits including quaternary nitrogen wetting agents containing a fatty acid radical, alkylene oxides, pyridine compounds, aromatic aldehydes, acetaldehyde and/or a bismuth compound.

    摘要翻译: 本发明涉及从包含铅和/或烷基磺酸锡的电镀浴中的锡,铅和特别是锡铅合金的电沉积,足以使pH低于约3的烷基磺酸,以及各种添加剂 改善沉积物的亮度,有用的电流密度范围和/或锡 - 铅合金沉积物的可焊性,包括含有脂肪酸基团,环氧烷烃,吡啶化合物,芳族醛,乙醛和/或 铋化合物。